Search Results - "Scofield, J.D."
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Power Device Packaging Technologies for Extreme Environments
Published in IEEE transactions on electronics packaging manufacturing (01-07-2007)“…Silicon carbide is a wide-bandgap semiconductor capable of operation at temperatures in excess of 300degC. However, high-temperature packaging to interface…”
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Journal Article -
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Effect of trimethylsilane flow rate on the growth of SiC thin-films for fiber-optic temperature sensors
Published in Journal of microelectromechanical systems (01-12-2003)“…We have investigated the effect of trimethylsilane ([(CH/sub 3/)/sub 3/SiH] or 3MS) flow rate on the growth of SiC thin-film on single-crystal sapphire…”
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Journal Article -
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High temperature operation of a dc-dc power converter utilizing SiC power devices
Published in Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005 (2005)“…Performance of a 2 kW, 40 kHz, 270 V/500 V boost dc-dc power converter as a function of temperature is reported for the following power semiconductor device…”
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Conference Proceeding -
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Characteristics of High-Speed Silicon Carbide (Sic) Power Transistors
Published in 2007 IEEE Instrumentation & Measurement Technology Conference IMTC 2007 (01-05-2007)“…This paper describes the temperature and operating characteristics of NPN 4H-SiC (a polytype of silicon carbide) bipolar junction transistor (BJT) and 4H-SIC…”
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Conference Proceeding -
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GaAs/Ge tandem-cell space concentrator development
Published in IEEE transactions on electron devices (01-02-1990)“…GaAs/Ge monolithic tandem two-junction concentrators are being developed by optimizing separate one-junction GaAs and Ge cells that simulate the GaAs top cell…”
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Journal Article -
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Study of the phase transformation of cobalt
Published in Journal of phase equilibria (01-12-1991)“…The allotropic transformation of cobalt was studied with a differential scanning calorimeter. The temperature of the fcc to hcp transformation, A sub s , and…”
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Journal Article