Search Results - "Schwarz, Mark"

Examining the Relationship Between School Academic Optimism, Enabling School Structures, and Student Achievement in New Jersey Public Schools During the Post-Pandemic Period by Schwarz, Mark

“…This study investigated the relationships between student achievement and the school characteristics of academic optimism and enabling structures. Perceptual…”
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Numerical investigation of solid circulation flux in an internally circulating fluidized bed with different gas distributor designs by Hassan, Muhammad, Schwarz, Mark Phil, Yuqing, Feng, Rafique, Muhammad, Witt, Peter, Huilin, Lu

“…Numerical simulations using two-fluid model incorporating the kinetic theory of granular flow (KTGF) are conducted to study the behavior of bed particles in a…”
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Mobile health (mHealth) based medication adherence measurement – a pilot trial using electronic blisters in diabetes patients by Brath, Helmut, Morak, Jürgen, Kästenbauer, Thomas, Modre‐Osprian, Robert, Strohner‐Kästenbauer, Hermine, Schwarz, Mark, Kort, Willem, Schreier, Günter

“…Aims The aim of the present study was to evaluate a mobile health (mHealth) based remote medication adherence measurement system (mAMS) in elderly patients…”
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California Central Valley Water Rights in a Changing Climate by Schwarz, Andrew M.

“…Climate change and resulting changes in hydrology are already altering-and are expected in the future to continue to alter-the timing and amount of water…”
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Development of high damage threshold laser-machined apodizers and gain filters for laser applications by Rambo, Patrick, Schwarz, Jens, Kimmel, Mark, Porter, John L.

“…We have developed high damage threshold filters to modify the spatial profile of a high energy laser beam. The filters are formed by laser ablation of a…”
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Should Firms Go “Beyond Profits”? Milton Friedman versus Broad CSR1 by SCHWARTZ, MARK S., SAIIA, DAVID

“…ABSTRACT When attempting to articulate the nature and scope of corporate social responsibility (CSR), a variety of opinions emerge. The primary CSR issue…”
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Investigation of the Factors Affecting the Warpage Prediction of Multi-Chip Package by Rajmane, Pavan, Dhandapani, Karthikeyan, Schwarz, Mark, Syed, Ahmer

“…Rapid growth of electronic devices and increased customer demands for high performance, low cost and miniaturized design has led to increased design…”
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Feasibility of mHealth and Near Field Communication technology based medication adherence monitoring by Morak, J., Schwarz, M., Hayn, D., Schreier, G.

“…Poor patients' adherence to intake of prescribed medication has been identified as a serious problem in the treatment of chronically ill patients. Technical…”
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Non-Nucleotide Hint1-Labile Phosphoramidates for the Interrogation of Pin1 Biology by Schwarz, Daniel Mark Comins

“…The peptidyl-prolyl isomerase Pin1 is the only known enzyme capable of isomerizing the peptide bond between pThr/pSer and Pro residues. This bond is extremely…”
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Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump Shear by Wang, Wei, Zhao, Wei, Nakamoto, Mark, Schwarz, Mark, He, Dongming, Zhang, Xuefeng, Zhao, Lily, Syed, Ahmer

“…With the increasing requirement for advanced technology nodes in high-performance devices, low-K (LK), ultralow-K (ULK) and extreme low K (ELK) dielectric…”
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Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions by Wang, Wei, Sun, Yangyang, Zhang, Xuefeng, Wang, Lejun, Zhao, Lily, Schwarz, Mark, Stone, Bill, Syed, Ahmer

“…As copper pillar bumps have been widely used in flip chip packages to meet the performance demand for denser IO bump and finer pitch, chip-package interaction…”
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Warpage Variation Analysis and Model Prediction for Molded Packages by Niu, Yuling, Wang, Wei, Wang, Zhijie, Dhandapani, Karthik, Schwarz, Mark, Syed, Ahmer

“…Mechanical simulation model is an effective way to analyze warpage of electronic packages. To establish a reliable numerical model, simulation results are…”
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Study of Polyimide in Chip Package Interaction for Flip-Chip Cu-Pillar Packages by Wang, Wei, Zhang, Dingyou, Sun, Yangyang, Rae, David, Zhao, Lily, Zheng, Jiantao, Schwarz, Mark, Shah, Milind, Syed, Ahmer

“…Chip-package interaction (CPI) is a key area for achieving robust copper bump interconnection in flip-chip packages. Polyimide (PI) has been widely used in…”
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0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size by Keser, Beth, Alvarado, Rey, Schwarz, Mark, Bezuk, Steve

“…Board level reliability studies have been performed on wafer level packages (WLP) of various die sizes with 0.35mm ball pitch, SAC405 solder alloy, and two…”
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Design and evaluation of a multimodal mHealth based medication management system for patient self administration by Schreier, Gunter, Schwarz, Mark, Modre-Osprian, Robert, Kastner, Peter, Scherr, Daniel, Fruhwald, Friedrich

“…The intake of prescribed medication presents a challenge, in particular for elderly people and in cases where a variety of medications have to be taken in…”
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Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages by Keser, Beth, Alvarado, Rey, Choi, Alan, Schwarz, Mark, Bezuk, Steve

“…Board level reliability studies have been performed on wafer level packages (WLP) on various die sizes with 0.35mm and 0.3mm ball pitches. The 0.35mm pitch…”
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Interconnect reliability prediction for wafer level packages (WLP) for temperature cycle and drop load conditions by Tong Cui, Syed, Ahmer, Keser, Beth, Alvarado, Rey, Xu, Steven, Schwarz, Mark

“…Interconnect reliability of wafer level packages (WLP) is one of the major concerns because of the direct connection of die to board without any substrate…”
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Study of new alloy composition for solder balls - Identifying material properties as key leading indicators toward improved board level performance by Alvarado, Rey, Keser, Beth, Zhou, Eric, Schwarz, Mark, Bezuk, Steve, Wang, Henry, Kok-Lin Heng

“…The quest for improved board level reliability (BLR) in wafer level packages (WLPs) motivates a characterization of novel alloys, and their impact on BLR…”
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FUN FOR FREE IN QUEBEC CITY by Schwarz, Mark

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Reliability evaluation on low k wafer level packages by Yadav, P., Kalchuri, S., Keser, B., Zang, R., Schwarz, M., Stone, B.

“…Wafer Level Package (WLP) technology has seen tremendous advances in recent years and is rapidly being adopted at the 65 nm Low-K silicon node. For a true WLP,…”
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