Search Results - "Schwarz, Laurent"

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  1. 1
    In-situ characterization up to 100 ​GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies

    In-situ characterization up to 100 ​GHz of insulators used in new 3D “System in Package on board” (SiPoB) technologies by Houzet, Gregory, Lacrevaz, Thierry, Bermond, Cedric, Artillan, Philippe, Auchère, David, Schwarz, Laurent, Flechet, Bernard

    Published in Microelectronics (01-02-2021)
    “…Insulating materials used for the packaging of integrated circuits play an important role in the electrical performance of the new System-in-Package (SiP),…”
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    Journal Article
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  2. 2
    Challenges in IC-package-PCB co-design of an advanced flip-chip PoP package for a mobile application

    Challenges in IC-package-PCB co-design of an advanced flip-chip PoP package for a mobile application by Lecoq, Xavier, Cosmo, Stephane, Bacle, Prem, Devey, Corinne, Bayet, Olivier, Schwarz, Laurent

    “…When it comes to developing an advanced flip-chip Package-on-Package (PoP) for a mobile application, challenges are daunting: what are the keys to insure that…”
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    Conference Proceeding
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  3. 3
    Assessment of thrust faults, southwestern to north-central Elko County, Nevada

    Assessment of thrust faults, southwestern to north-central Elko County, Nevada by Schwarz, David Laurent

    Published 01-01-1994
    “…The northeastern Nevada Mesozoic hinterland has been modeled as a foreland thrust belt. This model is not supported by exposed field relationships or data from…”
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    Dissertation
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