Search Results - "Scheuermann, U."

Impact of load pulse duration on power cycling lifetime of Al wire bonds by Scheuermann, U., Schmidt, R.

“…The elimination of solder interfaces in advanced power modules has increased the lifetime in active power cycling tests. It facilitates the investigation of Al…”
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Reliability challenges of automotive power electronics by Scheuermann, U.

“…A high reliability of power electronic modules is an essential requirement for hybrid traction applications. This includes a high capability to withstand the…”
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Power cycling results for different control strategies by Scheuermann, U., Schuler, S.

“…Power cycling is an important method to characterize the lifetime of power semiconductor modules. Application engineers use lifetime curves published by…”
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Achalasia—an unnecessary long way to diagnosis by Niebisch, S., Hadzijusufovic, E., Mehdorn, M., Müller, M., Scheuermann, U., Lyros, O., Schulz, H. G., Jansen-Winkeln, B., Lang, H., Gockel, I.

“…SUMMARY Although achalasia presents with typical symptoms such as dysphagia, regurgitation, weight loss, and atypical chest pain, the time until first…”
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Comparison of resection and transarterial chemoembolisation in the treatment of advanced intrahepatic cholangiocarcinoma – A single-center experience by Scheuermann, U, Kaths, J.M, Heise, M, Pitton, M.B, Weinmann, A, Hoppe-Lotichius, M, Otto, G

“…Abstract Aims The aim of this study is to evaluate factors associated with the outcome after surgical resection and to compare the efficacy of surgery to…”
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Reliability of spring pressure contacts under environmental stress by Lang, F., Scheuermann, U.

“…Spring contacts are an excellent solution for connecting a power module with a printed circuit board (PCB). They can be applied in a wide current range from…”
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Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints by Junghaenel, M., Scheuermann, U.

“…Thermo-mechanical stress limits the useful life of power modules in the application. Active power cycling tests have been applied for more than three decades…”
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Reliability of low current electrical spring contacts in power modules by Hornung, E., Scheuermann, U.

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A Novel Power Module Design and Technology for Improved Power Cycling Capability by Scheuermann, U., Herr, E.

“…An advanced power semiconductor package design without base plate has a number of advantages compared to standard base plate modules. It allows to use…”
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Power cycling testing with different load pulse durations by Scheuermann, U, Schmidt, R, Newman, P

“…For many applications, the impact on the component lifetime of temperature swings generated by low output frequency is of special interest. Therefore, active…”
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Unusual cause of recurrent gluteal abscess formation by Lyros, O, Rudolph, J, Tagkalos, E, Scheuermann, U, Lang, H

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Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications by Scheuermann, U.

“…Hybrid vehicle traction applications require compact power modules with high reliability. A major challenge is the lifetime under thermal cycles. While the…”
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Reliability of pressure contacted intelligent integrated power modules by Scheuermann, U.

“…The pressure contact concept offers new opportunities for an advanced power module package technology. It is flexible with respect to the substrate size or…”
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Reliability of Planar SKiN Interconnect Technology by Scheuermann, U.

“…The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the…”
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Using the chip as a temperature sensor - The influence of steep lateral temperature gradients on the Vce(T)-measurement by Schmidt, R., Scheuermann, U.

“…During operation steep lateral temperature gradients evolve in IGBT power semiconductor chips. The influence of these lateral gradients on the measurement of…”
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Separating Failure Modes in Power Cycling Tests by Schmidt, R., Scheuermann, U.

“…The direct comparison of silver-sintered and soldered chip-DBC-interconnects allows studying the influence of the two main end-of-life failure modes in power…”
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Ungewöhnliche Ursache rezidivierender Glutealabszessbildung by Lyros, O., Rudolph, J., Tagkalos, E., Scheuermann, U., Lang, H.

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Impact of solder fatigue on module lifetime in power cycling tests by Scheuermann, U., Schmidt, R.

“…Different end-of-life mechanisms in power modules (i.e., solder fatigue and wire bond failures) and their interactions are subject of investigation. Their…”
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Von Z bis A oder : Wie unser Worterbuch entsteht (De Z à A ou : comment se fait notre dictionnaire) by SCHEUERMANN, U

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