Search Results - "Schaible, B"
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Comparing impact on the family and insurance coverage in children with cerebral palsy and children with another special healthcare need
Published in Child : care, health & development (01-05-2018)“…Background Families and caregivers of children with special healthcare needs (CSHCN) often experience financial difficulties, have unmet physical and mental…”
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WS14.3 Hypoxia reduces the virulence of Pseudomonas aeruginosa
Published in Journal of cystic fibrosis (01-06-2016)Get full text
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Luting of ceramic inlays in vitro : Marginal quality of self-etch and etch-and-rinse adhesives versus self-etch cements
Published in Dental materials (01-02-2008)“…Abstract Objectives To evaluate marginal integrity of IPS Empress inlays luted with different adhesives and cements before and after thermo-mechanical loading…”
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70 Expression of RND-type efflux pumps as a mechanism of antibiotic resistance in clinical Prevotella isolates
Published in Journal of cystic fibrosis (01-06-2014)Get full text
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83 Investigation of RND efflux pumps in clinical Prevotella species isolated from CF patients
Published in Journal of cystic fibrosis (01-06-2013)Get full text
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33 Hypoxia reduces internalization of Pseudomonas aeruginosa in pulmonary epithelial cells
Published in Journal of cystic fibrosis (01-06-2012)Get full text
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Fuzzy logic models for ranking process effects
Published in IEEE transactions on fuzzy systems (01-11-1997)“…When modeling and analyzing manufacturing processes, it may be helpful to know the relative importance of the various process parameters and their…”
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Prehospital Management of Rapid Atrial Fibrillation: Recommendations for Treatment Protocols
Published in The American journal of emergency medicine (01-01-2001)“…The present study was completed to establish an epidemiological database defining prehospital rapid atrial fibrillation (RAF) and interventions given such…”
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Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-02-1998)“…Flip-chip assembly is an important technology for first level electronic packaging. Among different assembly approaches, thermosonic bonding is becoming an…”
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Thermosonic flip-chip bonding system with a self-planarization feature using polymer
Published in IEEE transactions on advanced packaging (01-08-1999)“…Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and…”
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Journal Article Conference Proceeding -
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Thermosonic flip chip bonding system with a self-planarization feature using polymer
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)“…Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and…”
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Conference Proceeding Journal Article -
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Utility of ultrasound for assessing and confirming decompression of spinal cord
Published in Interdisciplinary neurosurgery : Advanced techniques and case management (01-09-2021)“…An underutilized modality within the operating room is the use of Intraoperative Ultrasound. This modality offers real time, noninvasive, and accurate…”
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Efficient design using fuzzy logic based regression models
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01-03-1998)“…With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these…”
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Efficient design using fuzzy logic based regression models
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)“…With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these…”
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Conference Proceeding -
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Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)“…Flip-chip assembly is an important technology for first level electronic packaging. Among different assembly approaches, thermosonic bonding is becoming an…”
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Conference Proceeding -
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Novel homozygous p.E64D mutation in DJ1 in early onset Parkinson disease (PARK7)
Published in Human mutation (01-10-2004)“…Mutations in the parkin gene have been identified as a common cause of autosomal recessive inherited Parkinson disease (PD) associated with early disease…”
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Digital control of a positioning device for a ventilation machine
Published in 1997 European Control Conference (ECC) (01-07-1997)“…In this paper a microcontroller based digital control of an industrial application is presented. The positioning control of a ventilator piston in an…”
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Conference Proceeding -
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Fuzzy logic models with improved accuracy and continuous differentiability
Published in IEEE transactions on components, packaging and manufacturing technology. Part C, Manufacturing (01-01-1996)“…One method of obtaining a fuzzy logic model (FLM) for use in process optimization and control involves the fuzzy weighting of many simple, often linear,…”
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