Search Results - "Schaible, B"

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    Comparing impact on the family and insurance coverage in children with cerebral palsy and children with another special healthcare need by Schaible, B., Colquitt, G., Caciula, M. C., Carnes, A., Li, L., Moreau, N.

    Published in Child : care, health & development (01-05-2018)
    “…Background Families and caregivers of children with special healthcare needs (CSHCN) often experience financial difficulties, have unmet physical and mental…”
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    Journal Article
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    Luting of ceramic inlays in vitro : Marginal quality of self-etch and etch-and-rinse adhesives versus self-etch cements by Frankenberger, Roland, Lohbauer, Ulrich, Schaible, Rainer B, Nikolaenko, Sergej A, Naumann, Michael

    Published in Dental materials (01-02-2008)
    “…Abstract Objectives To evaluate marginal integrity of IPS Empress inlays luted with different adhesives and cements before and after thermo-mechanical loading…”
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    Journal Article
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    Fuzzy logic models for ranking process effects by Schaible, B., Hong Xie, Yung-Cheng Lee

    Published in IEEE transactions on fuzzy systems (01-11-1997)
    “…When modeling and analyzing manufacturing processes, it may be helpful to know the relative importance of the various process parameters and their…”
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    Journal Article
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    Prehospital Management of Rapid Atrial Fibrillation: Recommendations for Treatment Protocols by Abarbanell, Neal Robert, Marcotte, Mary Ann, Schaible, Beata A., Aldinger, Glenn E.

    Published in The American journal of emergency medicine (01-01-2001)
    “…The present study was completed to establish an epidemiological database defining prehospital rapid atrial fibrillation (RAF) and interventions given such…”
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    Journal Article
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    Thermosonic flip-chip bonding using longitudinal ultrasonic vibration by Qing Tan, Wenge Zhang, Schaible, B., Bond, L.J., Teh-Hua Ju, Yung-Cheng Lee

    “…Flip-chip assembly is an important technology for first level electronic packaging. Among different assembly approaches, thermosonic bonding is becoming an…”
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    Journal Article
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    Thermosonic flip-chip bonding system with a self-planarization feature using polymer by Qing Tan, Schaible, B., Bond, L.J., Yung-Cheng Lee

    Published in IEEE transactions on advanced packaging (01-08-1999)
    “…Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and…”
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    Journal Article Conference Proceeding
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    Thermosonic flip chip bonding system with a self-planarization feature using polymer by Qing Tan, Schaible, B., Bond, L.J., Lee, Y.C.

    “…Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and…”
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    Conference Proceeding Journal Article
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    Utility of ultrasound for assessing and confirming decompression of spinal cord by Schaible, Peter, Schaible, Keith L

    “…An underutilized modality within the operating room is the use of Intraoperative Ultrasound. This modality offers real time, noninvasive, and accurate…”
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    Journal Article
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    Efficient design using fuzzy logic based regression models by Schaible, B., Yung-Chang Lee, Hong Xie

    “…With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these…”
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    Journal Article
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    Efficient design using fuzzy logic based regression models by Schaible, B., Lee, Y.C., Xie, H.

    “…With ever decreasing design cycles, it is important for designers to have techniques they can use to quickly and efficiently model new designs. From these…”
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    Conference Proceeding
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    Thermosonic flip-chip bonding using longitudinal ultrasonic vibration by Qing Tan, Wenge Zhang, Schaible, B., Bond, L.J., Ju, T.H., Lee, Y.C.

    “…Flip-chip assembly is an important technology for first level electronic packaging. Among different assembly approaches, thermosonic bonding is becoming an…”
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    Conference Proceeding
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    Digital control of a positioning device for a ventilation machine by Jenayeh, I., Simon, F., Bernhard, S., Rake, H., Schaible, B.

    Published in 1997 European Control Conference (ECC) (01-07-1997)
    “…In this paper a microcontroller based digital control of an industrial application is presented. The positioning control of a ventilator piston in an…”
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    Conference Proceeding
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    Fuzzy logic models with improved accuracy and continuous differentiability by Schaible, B., Lee, Y.-C.

    “…One method of obtaining a fuzzy logic model (FLM) for use in process optimization and control involves the fuzzy weighting of many simple, often linear,…”
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    Journal Article