Search Results - "Sathyakam, P. Uma"

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  1. 1

    Triangular Carbon Nanotube Bundle Interconnects for Subthreshold VLSI Circuits by Uma Sathyakam, P., Mallick, P. S.

    Published in Journal of electronic materials (01-10-2019)
    “…Triangular carbon nanotube (T-CNT) bundles are proposed as long interconnects for subthreshold VLSI circuits. The performance of subthreshold interconnects…”
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    Journal Article
  2. 2

    Role of Semiconducting Carbon Nanotubes in Crosstalk Reduction of CNT Interconnects by Uma Sathyakam, P., Karthikeyan, A., Mallick, P. S.

    Published in IEEE transactions on nanotechnology (01-09-2013)
    “…In this letter, we present a new method to reduce crosstalk of carbon nanotube (CNT)-based VLSI interconnects. For this, proper integration of semiconducting…”
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    Journal Article
  3. 3

    Crosstalk Analysis of Triangular CNT Bundle Interconnects by Sathyakam, P. Uma, Bhattacharjee, Shatarupa, Raj, Shubham

    Published in Journal of electronic materials (01-12-2021)
    “…Triangular cross-sectioned carbon nanotube (CNT) bundle interconnects have gained attention recently due to their inherent advantage of least electrostatic…”
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    Journal Article
  4. 4

    Waveform analysis of carbon nanotube interconnects connected to various driver/load circuits by Uma Sathyakam, P., Banerjee, Ananyo, Mallick, P. S.

    Published in International journal of electronics (03-10-2021)
    “…Signal reliability of nano-scale interconnects is a major cause of concern at subthreshold voltages. This paper deals with the subthreshold operation of carbon…”
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    Journal Article
  5. 5

    Performance, comprehension and applications of hematite-based photoanodes in PEC water splitting by Mushtaq, Muzammil, Sathyakam, P. Uma, Vijayaraghavan, R.

    Published in Next materials (01-04-2024)
    “…The world is facing significant energy challenges, and renewable hydrogen production has emerged as a promising solution. Water splitting by…”
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    Journal Article
  6. 6

    Inter-CNT capacitance in mixed CNT bundle interconnects for VLSI circuits by Sathyakam, P. Uma, Mallick, P.S.

    Published in International journal of electronics (01-10-2012)
    “…This article presents a realistic inter-carbon nanotube (CNT) electrostatic coupling capacitance and tunnelling conductance model for a mixed CNT bundle. The…”
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    Journal Article
  7. 7

    A review of tin selenide-based electrodes for rechargeable batteries and supercapacitors by Harish, S., Sathyakam, P. Uma

    Published in Journal of energy storage (15-08-2022)
    “…Tin selenide-based materials (SnSe/SnSe2) have been considered as one of the most promising electrode materials for electrochemical energy storage applications…”
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    Journal Article
  8. 8
  9. 9

    On the Applicability of Triangular Carbon Nanotube Bundles as VLSI interconnects by Sathyakam, P. Uma, Banerjee, Ananyo, Mallick, P. S.

    “…Triangular cross sectioned carbon nanotube bundles are proposed as VLSI interconnects. Due to their inherent geometry effects, triangular CNT (T-CNT) bundles…”
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    Conference Proceeding
  10. 10

    Optimal segmentation of Cu–CNT interconnects by Seshasai, K., Sathyakam, P. Uma, Mummaneni, Kavicharan

    “…Hybrid copper–single-walled carbon nanotube (Cu–SWCNT) interconnects are gaining attention recently due to their inherent advantages of better conductivity…”
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    Journal Article
  11. 11

    Reduction of crosstalk in mixed CNT bundle interconnects for high frequency 3D ICs and SoCs by Sathyakam, P. Uma, Karthikeyan, A., Rajesh, J. Kavish, Mallick, P. S.

    “…This paper investigates the multi equivalent single conductor (MESC) model for mixed CNT bundles (MCBs) which contains metallic single and double walled CNTs…”
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    Conference Proceeding
  12. 12

    Towards realisation of mixed carbon nanotube bundles as VLSI interconnects: A review by Uma Sathyakam, P., Mallick, P.S.

    Published in Nano communication networks (01-09-2012)
    “…Carbon nanotube based interconnect technology is becoming popular for its various merits over the current copper technology. The ability to conduct high…”
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    Journal Article
  13. 13

    Analysis of triangular CNT bundle interconnects for current mode signalling by Sathyakam, P. Uma, Das, Shaurya, Karthikeyan, A.

    “…Current mode signaling (CMS) is found to be advantageous than voltage mode signaling (VMS) in VLSI interconnects. So, we propose the use of triangular carbon…”
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    Conference Proceeding
  14. 14

    Triangular CNT bundles as VLSI interconnects by Sathyakam, P. Uma, Bisht, Ajay, Tandon, Yash, Mallick, P. S.

    “…The performance of coupled VLSI interconnects depends on their coupling capacitance and the dielectric medium surrounding them. However, the idea of designing…”
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    Conference Proceeding
  15. 15

    Mixed CNT bundle interconnects for subthreshold circuits by Sathyakam, P. Uma, Choudhary, Dipanjan, Mallick, P.S.

    “…Performance of mixed carbon nanotube bundle interconnects are analyzed for subthreshold circuits. As voltage scaling in ULSI ICs lead to performance challenges…”
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    Conference Proceeding
  16. 16

    Effect of Realistic Inter-CNT Coupling Capacitance in Mixed CNT Bundle by Sathyakam, P. U., Mallick, P. S.

    “…The change of potential across a CNT in a bundle necessitates the need to consider the inter-CNT coupling capacitance in the equivalent circuit of CNT…”
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    Conference Proceeding