Search Results - "Sassoulas, P."

28nm FDSOI technology platform for high-speed low-voltage digital applications by Planes, N., Weber, O., Barral, V., Haendler, S., Noblet, D., Croain, D., Bocat, M., Sassoulas, P., Federspiel, X., Cros, A., Bajolet, A., Richard, E., Dumont, B., Perreau, P., Petit, D., Golanski, D., Fenouillet-Beranger, C., Guillot, N., Rafik, M., Huard, V., Puget, S., Montagner, X., Jaud, M., Rozeau, O., Saxod, O., Wacquant, F., Monsieur, F., Barge, D., Pinzelli, L., Mellier, M., Boeuf, F., Arnaud, F., Haond, M.

“…For the first time, a full platform using FDSOI technology is presented. This work demonstrates 32% and 84% speed boost at 1.0V and 0.6V respectively, without…”
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28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis by Cavalcante, C., Fenouillet-Beranger, C., Batude, P., Garros, X., Federspiel, X., Lacord, J., Kerdiles, S., Royet, A. S., Acosta-Alba, P., Rozeau, O., Barral, V., Arnaud, F., Planes, N., Sassoulas, P. O., Ghegin, E., Beneyton, R., Gregoire, M., Weber, O., Guerin, C., Arnaud, L., Moreau, S., Kies, R., Romano, G., Rambal, N., Magalhaes, A., Ghibaudo, G., Colinge, J. P., Vinet, M., Andrieu, F.

“…For the first time, the thermal stability of a 28nm FDSOI CMOS technology is evaluated with yield measurements (5Mbit dense SRAM and 1 Million Flip- flops). It…”
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High Density Embedded PCM Cell in 28nm FDSOI Technology for Automotive Micro-Controller Applications by Arnaud, F., Ferreira, P., Piazza, F., Gandolfo, A., Zuliani, P., Mattavelli, P., Gomiero, E., Samanni, G., Jasse, J., Jahan, C., Reynard, J. P., Berthelon, R., Weber, O., Villaret, A., Dumont, B., Grenier, J. C., Ranica, R., Gallon, C., Boccaccio, C., Souhaite, A., Desvoivres, L., Ristoiu, D., Favennec, L., Caubet, V., Delmedico, S., Cherault, N., Beneyton, R., Chouteau, S., Sassoulas, P. O., Clement, L., Boivin, P., Turgis, D., Disegni, F., Ogier, J. L., Federspiel, X., Kermarrec, O., Molgg, M., Viscuso, A., Annunziata, R., Maurelli, A., Cappelletti, P., Ciantar, E.

“…In this paper we present an enhancement of our 28nm FDSOI-PCM solution using Bipolar Junction Transistor (BJT) selector co-integrated with triple gate oxide…”
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Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications embedding 16MB Phase Change Memory by Arnaud, F., Zuliani, P., Reynard, J.P., Gandolfo, A., Disegni, F., Mattavelli, P., Gomiero, E., Samanni, G., Jahan, C., Berthelon, R., Weber, O., Richard, E., Barral, V., Villaret, A., Kohler, S., Grenier, J.C., Ranica, R., Gallon, C., Souhaite, A., Ristoiu, D., Favennec, L., Caubet, V., Delmedico, S., Cherault, N., Beneyton, R., Chouteau, S., Sassoulas, P.O., Vernhet, A., Le Friec, Y., Domengie, F., Scotti, L., Pacelli, D., Ogier, J.L., Boucard, F., Lagrasta, S., Benoit, D., Clement, L., Boivin, P., Ferreira, P., Annunziata, R., Cappelletti, P.

“…For the first time we propose a 28nm FDSOI e-NVM solution for automotive micro-controller applications using a Phase Change Memory (PCM) based on chalcogenide…”
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Self-healing breakdown of metallized polypropylene by Sassoulas, P.-O., Gosse, B., Gosse, J.-P.

“…We have studied the self-healing breakdown of metallized PP films for different values of the PP film thickness and of the surface resistance of metal layer…”
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Heater system optimization for robust ePCM reliability and scalability in 28nm FDSOI technology by Ranica, R., Berthelon, R., Gandolfo, A., Samanni, G., Gomiero, E., Jasse, J., Mattavelli, P., Sandrini, J., Querre, M., Le-Friec, Y., Poulet, J., Caubet, V., Favennec, L., Boccaccio, C., Ghezzi, G., Gallon, C., Grenier, JC, Dumont, B., Weber, O., Villaret, A., Beneyton, R., Cherault, N., Ristoiu, D., Del Medico, S., Kermarrec, O., Reynard, JP, Boivin, P., Souhaite, A., Desvoivres, L., Chouteau, S., Sassoulas, PO, Clement, L., Valery, A., Petroni, E., Turgis, D., Lippiello, A., Scotti, L., Disegni, F., Ventre, A., Ornaghi, D., De Tomasi, M., Maurelli, A., Conte, A., Arnaud, F., Redaelli, A., Annunziata, R., Cappelletti, P., Piazza, F., Ferreira, P., Gonella, R., Ciantar, E.

“…One of the most promising Embedded Phase Change Memory (ePCM) integration scheme is the wall architecture, which relies on the dedicated Heater element to…”
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