Search Results - "Sassman, Barry"

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  1. 1

    Plasma-Induced Damage in High- k/Metal Gate Stack Dry Etch by Hussain, M.M., Seung-Chul Song, Barnett, J., Chang Yong Kang, Gebara, G., Sassman, B., Moumen, N.

    Published in IEEE electron device letters (01-12-2006)
    “…Plasma-based dry etch is used as the industry standard gate etch in conventional CMOS fabrication flow. However, past studies indicate that plasma-induced dry…”
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    Journal Article
  2. 2

    High mobility CMOS transistors on Si/SiGe heterostructure channels by Oh, Jungwoo, Jeon, Kanghoon, Lee, Se-Hoon, Huang, Jeff, Hung, P.Y., Ok, Injo, Sassman, Barry, Ko, Dae-Hong, Kirsch, Paul, Jammy, Raj

    Published in Microelectronic engineering (01-09-2012)
    “…We have demonstrated high mobility CMOS transistors on Si/SiGe heterostructure channels selectively grown on a Si (100) substrate. Electron and hole mobility…”
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    Journal Article
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    Impact of Millisecond Flash-Assisted Rapid Thermal Annealing on SiGe Heterostructure Channel pMOSFETs With a High-k/Metal Gate by Se-Hoon Lee, Majhi, P., Ferrer, D. A., Pui-Yee Hung, Huang, J., Oh, J., Wei-Yip Loh, Sassman, B., Byoung-Gi Min, Hsing-Huang Tseng, Harris, R., Bersuker, G., Kirsch, P. D., Jammy, R., Banerjee, S. K.

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Preserving the integrity (e.g., Ge concentration, strain, and lattice perfection) of pseudomorphically grown silicon germanium (SiGe) heterostructure channels…”
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    Journal Article
  7. 7

    Effective Modulation of Ni Silicide Schottky Barrier Height Using Chlorine Ion Implantation and Segregation by Wei-Yip Loh, Etienne, H., Coss, B., Ok, I., Turnbaugh, D., Spiegel, Y., Torregrosa, F., Banti, J., Roux, L., Pui-Yee Hung, Jungwoo Oh, Sassman, B., Radar, K., Majhi, P., Hsing-Huang Tseng, Jammy, R.

    Published in IEEE electron device letters (01-11-2009)
    “…Using a presilicide implantation approach, we demonstrate that the Schottky barrier height (SBH) of NiSi/n-Si(100) can be modulated by doping a Si substrate…”
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    Journal Article
  8. 8

    Deposition thickness based high-throughput nano-imprint template by Hussain, Muhammad Mustafa, Labelle, Ed, Sassman, Barry, Gebara, Gabe, Lanee, Sidi, Moumen, Naim, Larson, Larry

    Published in Microelectronic engineering (01-04-2007)
    “…International Technology Roadmap for Semiconductors 2003 projected nano-imprint lithography has the potential of high throughput, sub-20 nm resolution, and low…”
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    Journal Article
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    Single Metal Gate with Dual Work Functions for FD-SOI and UTB Double Gate Technologies by Pham, Daniel, Luan, Hongfa, Mathur, Kaveri, Sassman, Barry, Nguyen, Billy, Brown, George, Yang, Ji-woon, Oh, Jungwoo, Zeitzoff, Peter, Larson, Larry

    “…In this paper, we demonstrate an integratable single metal gate (TiSiN) on Hf x Si x O y with dual work functions (4.44eV and 4.83eV), achieved by varying the…”
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    Conference Proceeding
  13. 13

    Dual work function high-k/Metal Gate CMOS FinFETs by Hussain, M.M., Smith, C., Kalra, P., Ji-Woon Yang, Gebara, G., Sassman, B., Kirsch, P., Majhi, P., Seung-Chul Song, Harris, R., Hsing-Huang Tseng, Jammy, R.

    “…For the first time, a set of complementary metal oxide semiconductor (CMOS) FinFET devices with two different high-k/metal gate stacks of dual work function…”
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    Conference Proceeding
  14. 14

    A novel technique to calculate the critical temperature of thermal agglomerations on patterned SOI wafers by Widodo, L., Pham, D., Sassman, B., Larson, L.

    “…Thermal agglomeration of ultra-thin SOI (<20nm) is an undesirable issue for device fabrication. In this article for the first time, a methodology to calculate…”
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    Conference Proceeding