Search Results - "Sassman, Barry"
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Plasma-Induced Damage in High- k/Metal Gate Stack Dry Etch
Published in IEEE electron device letters (01-12-2006)“…Plasma-based dry etch is used as the industry standard gate etch in conventional CMOS fabrication flow. However, past studies indicate that plasma-induced dry…”
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Journal Article -
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High mobility CMOS transistors on Si/SiGe heterostructure channels
Published in Microelectronic engineering (01-09-2012)“…We have demonstrated high mobility CMOS transistors on Si/SiGe heterostructure channels selectively grown on a Si (100) substrate. Electron and hole mobility…”
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Comparison of Ohmic contact resistances of n- and p-type Ge source/drain and their impact on transport characteristics of Ge metal oxide semiconductor field effect transistors
Published in Thin solid films (31-10-2011)“…We report the results of a systematic study to understand low drive current of Ge-nMOSFET (metal–oxide–semiconductor field-effect transistor). The poor…”
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Journal Article -
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Impact of Millisecond Flash-Assisted Rapid Thermal Annealing on SiGe Heterostructure Channel pMOSFETs With a High-[Formula Omitted]/Metal Gate
Published in IEEE transactions on electron devices (01-09-2011)“…Preserving the integrity (e.g., Ge concentration, strain, and lattice perfection) of pseudomorphically grown silicon germanium (SiGe) heterostructure channels…”
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Impact of Millisecond Flash-Assisted Rapid Thermal Annealing on SiGe Heterostructure Channel pMOSFETs With a High-k/Metal Gate
Published in IEEE transactions on electron devices (01-09-2011)“…Preserving the integrity (e.g., Ge concentration, strain, and lattice perfection) of pseudomorphically grown silicon germanium (SiGe) heterostructure channels…”
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Journal Article -
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Effective Modulation of Ni Silicide Schottky Barrier Height Using Chlorine Ion Implantation and Segregation
Published in IEEE electron device letters (01-11-2009)“…Using a presilicide implantation approach, we demonstrate that the Schottky barrier height (SBH) of NiSi/n-Si(100) can be modulated by doping a Si substrate…”
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Deposition thickness based high-throughput nano-imprint template
Published in Microelectronic engineering (01-04-2007)“…International Technology Roadmap for Semiconductors 2003 projected nano-imprint lithography has the potential of high throughput, sub-20 nm resolution, and low…”
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Demonstration of L \sim \hbox\ \hbox pMOSFETs With \hbox\hbox/\hbox Channels, High I/I\ (≫ \hbox \times \hbox^) , and Controlled Short Channel Effects (SCEs)
Published in IEEE electron device letters (01-09-2008)“…High-performance sub-60 nm Si/SiGe (Ge:~75%)/Si heterostructure quantum well pMOSFETs with a conventional MOSFET process flow, including gate-first…”
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CMOS band-edge schottky barrier heights using dielectric-dipole mitigated (DDM) metal/Si for source/drain contact resistance reduction
Published in 2009 Symposium on VLSI Technology (01-06-2009)“…We demonstrate for the first time Schottky barrier height (SBH) tuning using interfacial SiO 2 /high-kappa dipoles resulting in SBH les 0.1 eV from the…”
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Conference Proceeding -
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Single Metal Gate with Dual Work Functions for FD-SOI and UTB Double Gate Technologies
Published in 2006 IEEE international SOI Conferencee Proceedings (01-10-2006)“…In this paper, we demonstrate an integratable single metal gate (TiSiN) on Hf x Si x O y with dual work functions (4.44eV and 4.83eV), achieved by varying the…”
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Conference Proceeding -
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Dual work function high-k/Metal Gate CMOS FinFETs
Published in ESSDERC 2007 - 37th European Solid State Device Research Conference (01-09-2007)“…For the first time, a set of complementary metal oxide semiconductor (CMOS) FinFET devices with two different high-k/metal gate stacks of dual work function…”
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Conference Proceeding -
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A novel technique to calculate the critical temperature of thermal agglomerations on patterned SOI wafers
Published in 2005 IEEE International SOI Conference Proceedings (2005)“…Thermal agglomeration of ultra-thin SOI (<20nm) is an undesirable issue for device fabrication. In this article for the first time, a methodology to calculate…”
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Conference Proceeding