Search Results - "Sarobol, P"

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration by Sarobol, P., Blendell, J.E., Handwerker, C.A.

“…A model incorporating the effects of grain geometry and size and grain boundary properties on the growth of whiskers and hillocks has been developed based on…”
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Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films by Sarobol, P., Koppes, J.P., Chen, W.H., Su, P., Blendell, J.E., Handwerker, C.A.

“…Direct evidence was obtained for the nucleation of surface grains through recrystallization and their growth into whiskers and hillocks during thermal cycling…”
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A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties by Sarobol, P., Wang, Y., Chen, W. H., Pedigo, A. E., Koppes, J. P., Blendell, J. E., Handwerker, C. A.

“…Whisker and hillock formation in thin films is well known as a highly local mechanism for stress relaxation, where in many cases, only a few whiskers form out…”
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Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films by Sarobol, P, Pedigo, A E, Su, P, Blendell, J E, Handwerker, C A

“…In this paper, the concept of a defect phase diagram is introduced which quantifies the effects of Cu and Pb additions to electrodeposited Sn films on surface…”
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