Search Results - "Sangawa, Ushio"
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Skin Effect Suppressed Ni-Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board
Published in IEEE transactions on magnetics (01-11-2018)“…Application of negative permeability beyond ferromagnetic resonance frequency is discussed in this paper. Targeted application is the skin effect suppression…”
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Journal Article -
2
Comparison between Microstrip-line and Substrate Integrated Waveguide on Package Substrate in 170 GHz and 300 GHz Bands
Published in 2022 Asia-Pacific Microwave Conference (APMC) (29-11-2022)“…This paper studies a low loss transmission line structure for 100 GHz to 300 GHz, which is considered as terahertz bands for 6G. Transmission losses of the…”
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Conference Proceeding -
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Packaging using microelectromechanical technologies and planar components
Published in IEEE transactions on microwave theory and techniques (01-11-2001)“…A novel millimeter-wave packaging structure was developed in which a micromachined low-loss planar component and flip-chip devices were integrated on a silicon…”
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Journal Article -
4
A Ka-band high-efficiency dielectric lens antenna with a silicon micromachined microstrip patch radiator
Published in IEEE MTT-S International Microwave Symposium digest (01-01-2001)“…Novel antenna configurations suitable for millimeter-wave applications were proposed incorporating a dielectric lens antenna with a single microstrip patch…”
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Journal Article -
5
Palm sized airborne ultrasonic sensor with nanofoam acoustic lens and homodyne interferometer
Published in 2010 IEEE International Ultrasonics Symposium (01-10-2010)“…We propose an optoacoustic airborne ultrasonic sensor consisting of a 633-nm He-Ne laser, an Si PIN photodetector, and a sensor head. The device has a…”
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Conference Proceeding -
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Novel air-borne ultrasonic sensor using nanofoam and a laser Doppler vibrometer
Published in 2009 IEEE International Ultrasonics Symposium (01-09-2009)“…We propose a novel airborne ultrasonic sensor, using nanofoam and a laser Doppler vibrometer that can operate over a wide frequency range and provide high…”
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Conference Proceeding -
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K-band receiver front-end IC integrating micromachined filter and flip-chip assembled active devices
Published in 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282) (1999)“…A novel three-dimensional K-band receiver front-end IC was developed in which a micromachined low-loss filter and flip-chip devices ware integrated on a…”
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Conference Proceeding Journal Article -
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Millimeter-wave Transceiver MCM Usig Multi-layer BCB with Integrated Planner Antenna
Published in 1999 29th European Microwave Conference (01-10-1999)“…A novel millimeter-wave transceiver MCM using multi-layer BCB was proposed. This MCM is based on a glass substrate laminated with three layers of BCB thin…”
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Conference Proceeding