Search Results - "SangHyun Ryu"
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Development of a versatile, uniform, and stable initiator layer by the functionalization of a polydopamine/polyethyleneimine film
Published in Bulletin of the Korean Chemical Society (01-06-2022)“…Polymer brush surfaces have various interesting applications; however, to facilitate their formation on surfaces, an initiator ad‐layer is required in advance…”
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Journal Article -
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Mechanical, thermal, and electrical analysis of a compliant interconnect
Published in IEEE transactions on components and packaging technologies (01-06-2005)“…Ball grid array (BGA) package styles use solder balls as electrical interconnects between packages and application boards. Solder balls are rigid and tend to…”
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Journal Article -
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Magnetic anisotropy of sputtered FeN films due to anisotropic columnar growth of grains
Published in IEEE transactions on magnetics (01-09-1997)“…FeN thin films were deposited by RF reactive diode sputtering to investigate magnetic anisotropy variation due to substrate tilt up to 45/spl deg/ during the…”
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Journal Article -
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User Adaptive Recommendation Model by Using User Clustering based on Decision Tree
Published in 2010 10th IEEE International Conference on Computer and Information Technology (01-06-2010)“…With the rapid growth of information and communication technology, many researchers are studying on development of user adaptive recommendation systems for…”
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Conference Proceeding -
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Model for Prediction of Energy Consumption in Residential Buildings Based on Transfer Learning
Published in 2023 International Technical Conference on Circuits/Systems, Computers, and Communications (ITC-CSCC) (25-06-2023)“…As Climate change has become a major issue worldwide, the importance of building energy management systems (BEMS) is increasing. Because of obligation of…”
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Conference Proceeding -
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Mechanical, thermal and electrical analysis of a compliant interconnect
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)“…Ball grid array (BGA) package styles use solder balls as an electrical interconnect between packages and application boards. Solder balls are rigid and tend to…”
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Conference Proceeding