Search Results - "Sampei, Hirokazu"

Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique by Zhang, Zheng, Chen, Chuantong, Suetake, Aiji, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…In this work, an acoustic emission (AE) technique was applied to online condition monitoring (CM) of solder fatigue in a clip-bonding SiC mosfet power assembly…”
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Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique by Zhang, Zheng, Suetake, Aiji, Chen, Chuantong, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…In this work, we applied a acoustic emission monitoring (AEM) technique to inspect solder deterioration in a clip-bonding SiC MOSFET power module during power…”
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