Search Results - "Salleh, M.A.A. Mohd"

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates by Mohd Salleh, M.A.A., McDonald, S.D., Nogita, K.

“…The growth of Cu6Sn5 and Cu3Sn5 interfacial layers after isothermal annealing and the resultant effect on the solder joint strength are studied in TiO2 and Ni…”
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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering by Ramli, M.I.I., Mohd Salleh, M.A.A., Yasuda, H., Chaiprapa, J., Nogita, K.

“…This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of…”
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Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces by Mohd Salleh, M.A.A., McDonald, S.D., Yasuda, H., Sugiyama, A., Nogita, K.

“…In situ observations of the reaction between solid Cu in contact with molten Sn–0.7wt.% Cu were achieved using a synchrotron X-ray imaging technique. It was…”
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Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni by Xian, J.W., Mohd Salleh, M.A.A., Belyakov, S.A., Su, T.C., Zeng, G., Nogita, K., Yasuda, H., Gourlay, C.M.

“…The influence of Ni on the size and twinning of primary Cu6Sn5 crystals in Sn-0.7Cu-0.05Ni and Sn-xCu (x = 0.7, 0.9, 1.1) (mass%) solder joints is studied…”
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Tensile Properties And Electrical Conductivity Of Linear Low-Density Polyethylene (LLDPE)/Carbon Black Conductive Polymer Composites (CPCs) : Effect Of Compounding Parameters by Abdul Halim, K.A., Mohd Salleh, M.A.A., Abdullah, M.M.A, Rozaimi, A.A., Badrul, F., Osman, A.F., Omar, M.F., Zakaria, M.S., Jeż, B.

“…In recent years, the research and development in conductive polymer composites (CPCs) had gained considerable interests in both industry and academia as…”
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A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography by Tan, C.Y., Mohd Salleh, M.A.A., Saud, N., Nabialek, M., Rylski, A.

“…This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray…”
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Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process by Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H., Nogita, K.

“…This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu 6 Sn 5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate,…”
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Development of a microwave sintered TiO2 reinforced Sn–0.7wt%Cu–0.05wt%Ni alloy by Mohd Salleh, M.A.A., McDonald, S.D., Terada, Y., Yasuda, H., Nogita, K.

“…•Microwave sintered composite solder sample fabrication processes were discussed.•Effects of sintering on thermal properties of composite solders were…”
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Microstructure and porosity evolution of alkali activated slag at various heating temperatures by Aziz, Ikmal Hakem, Abdullah, Mohd Mustafa Al Bakri, Mohd Salleh, M.A.A., Yoriya, Sorachon, Chaiprapa, Jitrin, Rojviriya, Catleya, Li, Long Yuan

“…This paper elucidated the microstructural and porosity evolution of alkali activated slag at 800 °C up to 1200 °C. The microstructural analysis obtained shows…”
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Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder by Mohd Salleh, M.A.A., Bakri, A.M. Mustafa Al, Zan@Hazizi, M.H., Somidin, Flora, Mohd Alui, Noor Farhani, Ahmad, Zainal Arifin

“…The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical…”
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Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows by Chang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H., Nogita, K.

“…Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs, stacked components, or 3D configurations to ensure reliable…”
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Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG) by Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H., Nogita, K.

“…This paper details an investigation into the microstructure, thermal behaviors and joint strength of Sn-0.7Cu-1.5Bi solder alloy on electroless nickel…”
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Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint by Abdul Razak, N.R., Tan, X.F., Mohd Salleh, M.A.A., McDonald, S.D., Bermingham, M.J., Yasuda, H., Nogita, K.

“…The rapid growth of (Cu,Ni)6Sn5 intermetallic compounds (IMCs) when Sn reacts with Cu containing 6 wt%Ni (Cu-6Ni) offers huge potential for resolving the…”
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Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder by Ramli, M.I.I., Saud, N., Salleh, M.A.A. Mohd, Derman, M.N., Said, R. Mohd

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Effect of Naoh Molar Concentration on Microstructure and Compressive Strength of Dolomite/Fly Ash-Based Geopolymers by Azimi, Emy Aizat, Mohd Salleh, M.A.A., Al Bakri Abdullah, Mohd Mustafa, Aziz, Ikmal Hakem A., Hussin, Kamarudin, Chaiprapa, Jitrin, Vizureanu, Petrica, Yoriya, Sorachon, Nabiałek, Marcin, Wyslocki, Jerzy J.

“…Dolomite can be used as a source of aluminosilicate to produce geopolymers; however, this approach is limited by its low reactivity. This study analyzes the…”
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Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder by Ramli, M.I.I., Mohd Salleh, M.A.A., Derman, M.N., Said, R.M., Saud, N.

“…The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC)…”
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Strength development of solely ground granulated blast furnace slag geopolymers by Aziz, Ikmal Hakem, Abdullah, Mohd Mustafa Al Bakri, Mohd Salleh, M.A.A., Azimi, Emy Aizat, Chaiprapa, Jitrin, Sandu, Andrei Victor

“…[Display omitted] •Mechanical and microstructure of solely GGBFS based geopolymers are investigated.•Solely binder of GGBFS based geopolymers obtained high…”
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The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint by Chang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H., Nogita, K.

“…The effects of 0.05 wt%Ni additions on In-35 wt%Sn (In–35Sn) alloy on the ex-situ interfacial reactions, in-situ microstructures formation during…”
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Multiscale Analysis of the Mechanical Properties of the Crack Tip Region by Zhufeng, S., Mohd Salleh, M.A.A., Jeż, B., Yusoff, N.

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The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints by Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M.A.A. Mohd, Nogita, Kazuhiro

“…Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu6Sn5 intermetallics influenced by micro-alloying in Pb-free solder…”
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