Search Results - "Salleh, M. A. A. Mohd"

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength by Muhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J., Nogita, K.

“…The effects of copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish reflowed on Sn-3.0Ag-0.5Cu…”
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Removal of Zinc from Aqueous Solution by Optimized Oil Palm Empty Fruit Bunches Biochar as Low Cost Adsorbent by Salleh, M. A. Mohd, Samsuri, A. W., Yunus, Robiah, Zamani, Seyed Ali, Asady, Bahareh

“…This study aims to produce optimized biochar from oil palm empty fruit bunches (OPEFB), as a green, low cost adsorbent for uptake of zinc from aqueous…”
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Gasification of Biochar from Empty Fruit Bunch in a Fluidized Bed Reactor by Mohd Salleh, M. A., Kisiki, Nsamba Hussein, Yusuf, H. M., Ab Karim Ghani, W. A. Wan

“…A biochar produced from empty fruit bunches (EFB) was gasified in a fluidized bed using air to determine gas yield, overall carbon conversion, gas quality, and…”
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Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy by Tan, C. Y., Mohd Salleh, M. A. A., Saud, N., Nishimura, T., Nogita, K.

“…The present study explores the effects of minor vanadium (V) addition on Sn-3wt%Ag-5wt%Cu (SAC35) based solder alloy. Weight percentages of V ranging from 0 to…”
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In Situ TEM Observations of Cu6Sn5 Polymorphic Transformations in Reaction Layers Between Sn-0.7Cu Solders and Cu Substrates by Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D., Matsumura, S.

“…Direct evidence of the relationship between the polymorphic phase transformation from monoclinic Cu 6 Sn 5 to hexagonal Cu 6 Sn 5 and stress…”
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Effect of Experimental Variables on the Combustion Characteristics of Water-in-Diesel Emulsion Fuels by Bidita, B. S., Aien, N., Suraya, A. R., Mohd Salleh, M. A., Idris, A.

“…Water-in-diesel (W/D) emulsion fuels were prepared through an ultrasonic processor by using high energy emulsification method. Accordingly, the physical and…”
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Influence of Fuel Additive in the Formulation and Combustion Characteristics of Water-in-Diesel Nanoemulsion Fuel by Bidita, B. S, Suraya, A. R, Shazed, M. A, Mohd Salleh, M. A, Idris, A

“…A comprehensive experimental study was accomplished to assess the influence of fuel additive in the formulation of water-in-diesel (W/D) nanoemulsions using…”
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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste by Mohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H., Nogita, K.

“…The feasibility of the highly reliable and replicable microstructure formation of the transient liquid phase sintering (TLPS) paste during the early soldering…”
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Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties by Muhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z., Nogita, K.

“…This study examines factor(s) behind the formation of primary Cu 6 Sn 5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys…”
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Air Gasification of Agricultural Waste in a Fluidized Bed Gasifier: Hydrogen Production Performance by Wan Ab Karim Ghani, W. A., Moghadam, Reza Alipour, Salleh, M. A. Mohd, Alias, A. B.

“…Recently, hydrogen production from biomass has become an attractive technology for power generation. The main objective pursued in this work is to investigate…”
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In situ imaging of microstructure formation in electronic interconnections by Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D., Nogita, K.

“…The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by…”
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Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering by Ramli, M. I. I., Mohd Salleh, M. A. A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K., Nogita, K.

“…The relationships between solderability, free solder thickness and intermetallic thickness of Sn–0.7Cu–0.05Ni solder coatings on Cu substrate has been…”
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Effect of fibre coating and geometry on the tensile properties of hybrid carbon nanotube coated carbon fibre reinforced composite by Shazed, M.A., Suraya, A.R., Rahmanian, S., Mohd Salleh, M.A.

“…Hierarchically structured hybrid composites are ideal engineered materials to carry loads and stresses due to their high in-plane specific mechanical…”
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Carbon and glass hierarchical fibers: Influence of carbon nanotubes on tensile, flexural and impact properties of short fiber reinforced composites by Rahmanian, S., Thean, K.S., Suraya, A.R., Shazed, M.A., Mohd Salleh, M.A., Yusoff, H.M.

“…► Dense CNT were grown on carbon fiber and glass fiber by use of floating catalyst CVD method. ► CNT showed different growing mechanism on carbon and glass…”
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Microstructure, mechanical properties and corrosion analysis of Sn–0.7Cu + Ga solders joints developed using green concentrated solar energy soldering method by Sonawwanay, Puskaraj D., Bupesh Raja, V. K., Mohd Salleh, M. A. A., Muhammad, Noorhafiza Binti, Nazri, S. F., Gupta, Manoj

“…Concentrated Solar Energy Soldering (CSES) technique is applied for soldering newly developed Gallium added Sn–0.7Cu Lead-Free solder and evaluated with CSI…”
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Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process by Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H., Nogita, K.

“…This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu 6 Sn 5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate,…”
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The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings by Ramli, M. I. I., Mohd Salleh, M. A. A., Abdullah, M. M. A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S., Nogita, K.

“…The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7Cu solder coatings. The minor addition of 0.05 wt.% Ni into the…”
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Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder by Mohd Salleh, M.A.A., Bakri, A.M. Mustafa Al, Zan@Hazizi, M.H., Somidin, Flora, Mohd Alui, Noor Farhani, Ahmad, Zainal Arifin

“…The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical…”
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Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging by Ramli, M. I. I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad, Nogita, K.

“…This paper investigates the solid-liquid-solid interaction between a low-temperature eutectic Sn-58Bi and Sn-3.0Ag-0.5Cu solder alloy during soldering. The…”
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Effect of Naoh Molar Concentration on Microstructure and Compressive Strength of Dolomite/Fly Ash-Based Geopolymers by Azimi, Emy Aizat, Mohd Salleh, M.A.A., Al Bakri Abdullah, Mohd Mustafa, Aziz, Ikmal Hakem A., Hussin, Kamarudin, Chaiprapa, Jitrin, Vizureanu, Petrica, Yoriya, Sorachon, Nabiałek, Marcin, Wyslocki, Jerzy J.

“…Dolomite can be used as a source of aluminosilicate to produce geopolymers; however, this approach is limited by its low reactivity. This study analyzes the…”
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