Search Results - "Saeidi, Nooshin"
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1
A Capacitive Humidity Sensor Suitable for CMOS Integration
Published in IEEE sensors journal (01-11-2013)“…This paper describes the design, fabrication, and performance of a thin film humidity sensor fabricated in standard CMOS process, hence it may be combined with…”
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Journal Article -
2
Humidity-to-Frequency Sensor in CMOS Technology With Wireless Readout
Published in IEEE sensors journal (01-03-2013)“…A remotely powered microsystem for humidity measurement is presented. The core of the active transponder consists of a humidity-to-frequency chip fabricated in…”
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Journal Article -
3
High Precision Liquid Level and Leak Detection Based on Capacitive Micromachined Ultrasound Transducer
Published in 2022 Smart Systems Integration (SSI) (27-04-2022)“…This paper reports on a miniaturized liquid level sensor, that is sensitive to very small changes in the liquid level, and thus can also be exploited for leak…”
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Conference Proceeding -
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An implantable humidity-to-frequency sensor in CMOS technology
Published in 2011 IEEE SENSORS Proceedings (01-10-2011)“…This paper reports the development of a thin-film humidity sensor which is integrated as part of a standard CMOS chip. The sensor element is fabricated using…”
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Conference Proceeding -
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Characterization of Capacitive Micromachined Ultrasound Transducer (Cmut) for Targeted Applications in Harsh Environments
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25-01-2021)“…Acoustic borehole televiewers commonly employ piezoelectric transducers for borehole imaging in exploration projects. However, conventional transducers are…”
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Conference Proceeding -
6
An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Published in 2018 IEEE International Ultrasonics Symposium (IUS) (01-10-2018)“…In this paper, we present the design, modeling, fabrication and initial wafer level characterization of Capacitive Micromachined Ultrasound Transducers (CMUTs)…”
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Conference Proceeding -
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Controlled silicon IC thinning on individual die level for active implant integration using a purely mechanical process
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01-05-2014)“…We are developing an electrode array for epidural spinal cord stimulation and a thin integrated circuit (IC) is to be embedded in it. This paper focuses on the…”
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Conference Proceeding -
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Realization of an active book for multichannel intrathecal root stimulation in spinal cord injury - Preliminary results
Published in 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society (01-01-2011)“…After spinal cord injury, electrical stimulation of the roots inside the spinal column at the level of the cauda equina is a safe and effective way to regain…”
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Conference Proceeding Journal Article -
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Design and fabrication of corrosion and humidity sensors for performance evaluation of chip scale hermetic packages for biomedical implantable devices
Published in 2009 European Microelectronics and Packaging Conference (01-06-2009)“…In this paper we report on the development of a set of test chips that can be used to verify the sealing techniques with biomedical implants as their target…”
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Conference Proceeding