Search Results - "Sacho, Yutaka"

Fabrication of Polycrystalline Silicon Field Emitter Arrays with Hafnium Carbide Coating for Thin-Film-Transistor Controlled Field Emission Displays by Nagao, Masayoshi, Sacho, Yutaka, Sato, Takanobu, Matsukawa, Takashi, Kanemaru, Seigo, Itoh, Junji

“…Hafnium Carbide (HfC)-coated polycrystalline silicon (poly-Si) field emitter arrays (FEAs) were fabricated on an oxidized silicon wafer. The HfC coating layer…”
Get full text

Fabrication of HfC-Coated Si Field Emitter Arrays with Built-in Poly-Si Thin-Film Transistor by Nagao, Masayoshi, Sacho, Yutaka, Matsukawa, Takashi, Kanemaru, Seigo, Itoh, Junji

“…HfC-coated amorphous-Si field emitter arrays (FEAs) controlled by a built-in poly-Si thin-film transistor (TFT) was proposed and fabricated. Such FEAs were…”
Get full text

DNA-Templated Assembly of Au Nanoparticles via Step-by-Step Binding Reaction by Yamada, Fumihiko, Sacho, Yutaka, Matsumoto, Takuya, Tanaka, Hidekazu, Kawai, Tomoji

“…We demonstrated DNA-template assembly of gold-nanoparticles AuNP via step-by-step binding reaction. The control of hydrophilicity for mica surface makes it…”
Get full text

Stacking technology based on 8-inch wafers using direct connection between TSV and micro-bump by Miyakawa, N., Hashimoto, E., Maebashi, T., Nakamura, N., Sacho, Y., Nakayama, S., Toyoda, S.

“…We have developed a unique TSV structure and evaluated the connectivity between TSV and micro-bump. The connection resistances are less than 0.7 ohm and the…”
Get full text

Preparation and properties of eoet based organic complexes by Sasaki, Hiroshi, Kondo, Tetsuo, Kamoshida, Kenta, Sacho, Yutaka, Saito, Gunzi

“…EOET (ethylenedioxy-ethylenedithio-tetrathiafulvalene) is a known electron donor which is a hybrid molecule between ET and BO. In this report, the physical and…”
Get full text

High density assembly technology using stacking method by Maebashi, T., Nakamura, N., Sacho, Y., Nakayama, S., Hashimoto, E., Toyoda, S., Miyakawa, N.

“…We have developed a new 3-dimensional (3D) Wafer-to-Wafer stacking technology in which each wafer was stacked one after another, using a unique Through Silicon…”
Get full text