Search Results - "Sachid, Angada B"
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1
High-Gain Inverters Based on WSe2 Complementary Field-Effect Transistors
Published in ACS nano (27-05-2014)“…In this work, the operation of n- and p-type field-effect transistors (FETs) on the same WSe2 flake is realized,and a complementary logic inverter is…”
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Journal Article -
2
Field-Effect Transistors Built from All Two-Dimensional Material Components
Published in ACS nano (24-06-2014)“…We demonstrate field-effect transistors using heterogeneously stacked two-dimensional materials for all of the components, including the semiconductor,…”
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Journal Article -
3
Monolithic 3D CMOS Using Layered Semiconductors
Published in Advanced materials (Weinheim) (01-04-2016)“…Monolithic 3D integrated circuits using transition metal dichalcogenide materials and low‐temperature processing are reported. A variety of digital and analog…”
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4
Gate Fringe-Induced Barrier Lowering in Underlap FinFET Structures and Its Optimization
Published in IEEE electron device letters (01-01-2008)“…The difficulty to fabricate and control precisely defined doping profiles in the source/drain underlap regions of FinFETs necessitates the use of undoped gate…”
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5
MoS₂ transistors with 1-nanometer gate lengths
Published in Science (American Association for the Advancement of Science) (07-10-2016)“…Scaling of silicon (Si) transistors is predicted to fail below 5-nanometer (nm) gate lengths because of severe short channel effects. As an alternative to Si,…”
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Journal Article -
6
Improved Subthreshold Swing and Short Channel Effect in FDSOI n-Channel Negative Capacitance Field Effect Transistors
Published in IEEE electron device letters (01-02-2018)“…Negative capacitance (NC) FETs with channel lengths from 30 nm to <inline-formula> <tex-math notation="LaTeX">50~\mu \text{m} </tex-math></inline-formula>,…”
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7
Insights Into the Design and Optimization of Tunnel-FET Devices and Circuits
Published in IEEE transactions on electron devices (01-04-2011)“…Improving the on-current has been the focus of enhancing the performance of tunnel field-effect transistors (TFETs). In this paper, we show that the increase…”
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Journal Article -
8
High-gain monolithic 3D CMOS inverter using layered semiconductors
Published in Applied physics letters (27-11-2017)“…We experimentally demonstrate a monolithic 3D integrated complementary metal oxide semiconductor (CMOS) inverter using layered transition metal dichalcogenide…”
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9
Denser and More Stable SRAM Using FinFETs With Multiple Fin Heights
Published in IEEE transactions on electron devices (01-08-2012)“…We present the optimization of multiple-fin-height FinFET static random access memory (SRAM) to reduce cell leakage and improve the stability and density of…”
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10
Variation Caused by Spatial Distribution of Dielectric and Ferroelectric Grains in a Negative Capacitance Field-Effect Transistor
Published in IEEE transactions on electron devices (01-10-2018)“…We propose a new scheme to consider the dielectric (DE) phases inside polycrystalline ferroelectric (FE) materials. The scheme is used to extract material…”
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11
Modeling of Back-Gate Effects on Gate-Induced Drain Leakage and Gate Currents in UTB SOI MOSFETs
Published in IEEE transactions on electron devices (01-10-2017)“…The back-gate bias-dependent gate-induced drain leakage (GIDL) and gate current models of ultrathin body (UTB) silicon-on-insulator (SOI) MOSFETs are proposed…”
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12
Negative Capacitance, n-Channel, Si FinFETs: Bi-directional Sub-60 mV/dec, Negative DIBL, Negative Differential Resistance and Improved Short Channel Effect
Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)“…We report on negative capacitance (NC) FinFETs with ferroelectric Hf 0.5 Zr 0.5 O 2 (HZO) as gate dielectric on fully depleted silicon on insulator (FDSOI)…”
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Conference Proceeding -
13
A Novel and Robust Approach for Common Mode Feedback Using IDDG FinFET
Published in IEEE transactions on electron devices (01-11-2008)“…In this paper, we propose a novel and robust approach for common mode feedback (CMFB) for a differential amplifier using independently driven double gate…”
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14
Impact of Fringe Capacitance on the Performance of Nanoscale FinFETs
Published in IEEE electron device letters (01-01-2010)“…In this letter, we report the enhanced fringe capacitance in FinFETs when compared to the equivalent planar MOSFETs at the 22-nm node. We show that this…”
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15
Drain current model for nanoscale double-gate MOSFETs
Published in Solid-state electronics (01-09-2009)“…A closed form inversion charge-based drain current model for a short channel symmetrically driven, lightly doped symmetric double-gate MOSFET (SDGFET) is…”
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16
FinFET With High- \kappa Spacers for Improved Drive Current
Published in IEEE electron device letters (01-07-2016)“…We demonstrate p-channel gate-source/drain underlapped silicon FinFET with HfO 2 high-κ spacer and compare it with its counterpart having SiO 2 low-κ spacer…”
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17
Bulk FinFET With Low- \kappa Spacers for Continued Scaling
Published in IEEE transactions on electron devices (01-04-2017)“…We fabricate n-channel silicon bulk FinFET with silicon nitride (Si 3 N 4 ) high-κ, silicon nitride/silicon dioxide dual-κ, and silicon dioxide (SiO 2 ) low-κ…”
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18
Engineering Negative Differential Resistance in NCFETs for Analog Applications
Published in IEEE transactions on electron devices (01-05-2018)“…In negative capacitance field-effect transistors (NCFETs), drain current may decrease with increasing <inline-formula> <tex-math notation="LaTeX">{V}_{\mathrm…”
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19
Nanowire FET With Corner Spacer for High-Performance, Energy-Efficient Applications
Published in IEEE transactions on electron devices (01-12-2017)“…Parasitic capacitance in nanoscale FETs is becoming a dominant component of the total device capacitance which degrades device and circuit performance. This…”
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Journal Article -
20
UTBSOI MOSFET with corner spacers for energy-efficient applications
Published in 2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) (01-04-2018)“…Parasitic capacitance is a critical challenge in improving the device and circuit performance in nanoscale devices like the UTBSOI MOSFET and FinFET. Scaling…”
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Conference Proceeding