Search Results - "Sabuncuoglu Tezcan, D."

Integrated fluidic system for bio-molecule separation by Hiraoka, M, Fiorini, P, Zhang, L, De Malsche, W, Majeed, B, Tezcan, D Sabuncuoglu, Desmet, G, Yamashita, I, Van Hoof, C, Op de Beeck, M

“…An integrated fluidic system has been fabricated, capable of separating a mixture of different bio-molecules into its components. It is composed of a filter…”
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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

“…3D integration has the potential to alleviate the performance limitations that CMOS scaling is facing provided that it preserves the integrity of both front…”
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Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance by Mercha, A, Van der Plas, G, Moroz, V, De Wolf, I, Asimakopoulos, P, Minas, N, Domae, S, Perry, D, Choi, M, Redolfi, A, Okoro, C, Yang, Y, Van Olmen, J, Thangaraju, S, Tezcan, D S, Soussan, P, Cho, J H, Yakovlev, A, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

“…As scaling becomes increasingly difficult, 3D integration has emerged as a viable alternative to achieve the requisite bandwidth and power efficiency…”
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Design and fabrication of a biomedical Lab-on-Chip system for SNP detection in DNA by op de Beeck, M, De Malsche, W, Hiraoka, M, Fiorini, P, Zhang, L, op de Beeck, J, Majeed, B, Tanaka, H, Sabuncuoglu Tezcan, Deniz, Desmet, G, Ueda, D, Van Hoof, C, Yamashita, I

“…A Lab-on-Chip system is proposed, capable of SNP (Single Nucleotide Polymorphism) detection in DNA. One of the core components is an advanced filter consisting…”
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A low cost uncooled infrared microbolometer focal plane array using the CMOS n-well layer by Sabuncuoglu Tezcan, D., Eminoglu, S., Sevket Akar, O., Akin, T.

“…This paper reports a low-cost, 256-pixel uncooled infrared microbolometer focal plane array (FPA) implemented using a 0.8 /spl mu/m CMOS process where the…”
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3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias by Swinnen, B., Ruythooren, W., De Moor, P., Bogaerts, L., Carbonell, L., De Munck, K., Eyckens, B., Stoukatch, S., Tezcan, D.S., Tokei, Z., Vaes, J., Van Aelst, J., Beyne, E.

“…Using standard single damascene type techniques on bulk-Si, combined on one hand with extreme wafer thinning and on the other with Cu-Cu thermo-compression…”
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Electronic-photonic integration in the helios project by Fedeli, J. M., Schrank, F., Bogaerts, W., Masood, A., Zimmermann, L., Augendre, E., Bernabe, S., Kraft, J., Van Olmen, J., Sabuncuoglu Tezcan, D., Grosse, P., Enot, T.

“…Different ways of integrating of integrating photonics and electronics at the wafer level scale are reviewed: Monolithic, Back-Side, and Front-Side…”
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High performance Hybrid and Monolithic Backside Thinned CMOS Imagers realized using a new integration process by De Munck, K., Sabuncuoglu Tezcan, D., Borgers, T., Ruythooren, W., De Moor, P., Sedky, S., Toccafondi, C., Bogaerts, J., Van Hoof, C.

“…Hybrid and monolithic thinned backside illuminated CMOS imagers operating at full depletion at low substrate voltages were developed. The combination of a 50…”
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Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping by Civale, Y., Tezcan, D.S., Philipsen, H.G.G., Jaenen, P., Agarwal, R., Duval, F., Soussan, P., Travaly, Y., Beyne, E.

“…In this study, we report on the processing and the electrical characterization of a 3D-WLP TSV flow, using a polymer-isolated, Cu-filled TSV, realized on…”
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