Search Results - "Saarilahti, Jaakko"
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Properties of nanocrystalline silicon probed by optomechanics
Published in Nanophotonics (Berlin, Germany) (01-11-2020)“…Nanocrystalline materials exhibit properties that can differ substantially from those of their single crystal counterparts. As such, they provide ways to…”
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Ultra-High Sensitivity Surface-Micromachined Capacitive Differential Pressure Sensor for Low-Pressure Applications
Published in Journal of microelectromechanical systems (01-02-2023)“…An ultra-high sensitivity surface-micromachined capacitive differential pressure sensor and capacitance bridge readout circuit, with amplitude balancing for…”
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Integrated Radiometer at 240 GHz With SiGe MMIC Detector and GRIN Silicon Lens
Published in IEEE transactions on microwave theory and techniques (01-06-2024)“…We describe an integrated radiometer at 240 GHz consisting of a direct detection MMIC fabricated in BiCMOS SiGe and a silicon gradient refractive index (GRIN)…”
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Wafer Level Integration of Sub-THz and THz Systems
Published in IEEE microwave and wireless technology letters (Print) (01-02-2024)“…The letter presents a wafer level integration technology for sub-THz and THz systems. The developed integration process relies on deep reactive ion etching…”
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A 3D micromechanical compass
Published in Sensors and actuators. A. Physical. (10-04-2008)“…We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are…”
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The Effect of Surface Passivation for Sub-THz Silicon Gradient Refractive Index Lens
Published in 2021 51st European Microwave Conference (EuMC) (04-04-2022)“…This paper describes a study of impact of different passivation methods on performance of gradient refractive index (GRIN) lenses. Three different passivation…”
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Conference Proceeding -
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Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate
Published in Sensors and actuators. A, Physical (25-08-2000)“…A capacitive single-chip silicon microphone with very low-stress polysilicon membrane was fabricated. A mechanism for stress-releasing due to the high stress…”
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3D Thin Film Metrology without Cross-Sectional Sampling
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01-05-2023)“…Conformal coating in high aspect ratio substrates is a crucial factor in the development of next generation 3D semiconductor devices. Conventional approaches…”
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Conference Proceeding -
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Design and Fabrication of Aluminum Nitride Piezoelectric Micromachined Ultrasonic Transducers for Air Flow Measurements
Published in 2019 IEEE International Ultrasonics Symposium (IUS) (01-10-2019)“…Beam-drift based flow measurement technique requires frequency matched ultrasound transmitters and receivers for determining the flow rate. Aluminum nitride…”
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Conference Proceeding -
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Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS Mirror
Published in 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (01-06-2019)“…In this study, a low temperature wafer-level packaging process aimed for encapsulating MEMS mirrors was developed. The glass cap wafer used in the package has…”
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Conference Proceeding -
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Silicon Gradient Refractive Index Lens for Millimeter Wave Radiometers
Published in 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) (01-09-2019)“…We propose a radiometer receiver array based on a silicon microlens array and MMIC detectors at 200 - 250 GHz. The paper describes the array concept and…”
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Conference Proceeding -
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Impact of Fabrication Process Tolerances on Characteristics of Sub-THz Silicon Micromachined Filters
Published in 2018 48th European Microwave Conference (EuMC) (01-09-2018)“…We demonstrate sub-THz waveguides, low-pass and band-pass micromachined filters at frequency range 225-325 GHz. Impact of fabrication processes and electrical…”
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Conference Proceeding -
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Sub-THz micromachined waveguides for wafer level integration of MMICs
Published in 2017 12th European Microwave Integrated Circuits Conference (EuMIC) (01-10-2017)“…We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include…”
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Conference Proceeding -
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Sub-THz micromachined waveguides for wafer level integration of MMICs
Published in 2017 47th European Microwave Conference (EuMC) (01-10-2017)“…We demonstrate first results towards sub-THz integration system based on micromachined waveguides on Silicon. The demonstrated components at 270 GHz include…”
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Conference Proceeding -
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Comparison of Micromachined Dielectric and Metallic Waveguides for THz applications
Published in 2018 11th Global Symposium on Millimeter Waves (GSMM) (01-05-2018)“…The paper considers micromachined dielectric and metallic waveguides for THz applications. Analytical analysis and simulation of losses for ideal structures…”
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Conference Proceeding -
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Properties of Nanocrystalline Silicon Probed by Optomechanics
Published 09-07-2019“…Nanocrystalline materials exhibit properties that can differ substantially from those of their single crystal counterparts. As such, they provide ways to…”
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Journal Article -
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3D flip chip packaging of MEMS sensor
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01-09-2014)“…Advanced 3D packaging of a Micro Electro Mechanical Systems (MEMS) chip and a CMOS/ASIC Chip was studied. We successfully introduced redistribution process…”
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Conference Proceeding -
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Rutherford backscattering and kinetics study of the photo-induced solid state chemical reaction between silver and amorphous As 33S 67 layers
Published in Journal of non-crystalline solids (1997)“…The kinetics of the photo-induced solid state chemical reaction of silver with a-As 33S 67 films in a conventional sandwich structure was measured by…”
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Capacitive silicon microphone
Published in Physica scripta (01-01-1999)Get full text
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