Search Results - "STEMME, G"

Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer by Griss, P., Stemme, G.

“…We present the first hollow out-of-wafer-plane silicon microneedles having openings in the shaft rather than having an orifice at the tip. These structures are…”
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Painless Drug Delivery Through Microneedle-Based Transdermal Patches Featuring Active Infusion by Roxhed, Niclas, Samel, BjÖrn, Nordquist, Lina, Griss, Patrick, Stemme, GÖran

“…This paper presents the first microneedle-based transdermal patch with integrated active dispensing functionality. The electrically controlled system consists…”
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Zero-insertion-loss optical shutter based on electrowetting-on-dielectric actuation of opaque ionic liquid microdroplets by Ribet, F., De Luca, E., Ottonello-Briano, F., Swillo, M., Roxhed, N., Stemme, G.

“…This article reports a broad-band optical shutter based on microdroplet actuation with zero optical insertion loss in the open state. These features are…”
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Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters by Somjit, N., Stemme, G., Oberhammer, J.

“…This paper presents a novel concept of a microwave microelectromechanical systems (MEMS) reconfigurable dielectric-block phase shifter with best loss/bit at…”
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Penetration-Enhanced Ultrasharp Microneedles and Prediction on Skin Interaction for Efficient Transdermal Drug Delivery by Roxhed, N., Gasser, T.C., Griss, P., Holzapfel, G.A., Stemme, G.

“…This paper presents penetration-enhanced hollow microneedles and an analysis on the biomechanical interaction between microneedles and skin tissue. The aim of…”
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Active Opening Force and Passive Contact Force Electrostatic Switches for Soft Metal Contact Materials by Oberhammer, J., Stemme, G.

“…This paper reports on a mechanically bi-stable, electrostatically actuated switch mechanism with a large active opening force and a small passive closing…”
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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities by Oberhammer, J., Niklaus, F., Stemme, G.

“…In this work we describe an adhesive wafer-level bonding technique in which the adhesive material is structured prior to bonding. This technique can be used to…”
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Micromachined electrodes for biopotential measurements by Griss, P., Enoksson, P., Tolvanen-Laakso, H.K., Merilainen, P., Ollmar, S., Stemme, G.

“…We describe the microfabrication, packaging and testing of a micromachined dry biopotential electrode, (i.e., where electrolytic gel is not required). It…”
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BCB contact printing for patterned adhesive full-wafer bonded 0-level packages by Oberhammer, J., Stemme, G.

“…Adhesive wafer bonding with a patterned polymer layer is increasingly attracting attention as cheap and simple 0-level packaging technology for…”
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Characterization of micromachined spiked biopotential electrodes by Griss, P., Tolvanen-Laakso, H.K., Merilainen, P., Stemme, G.

“…We present the characterization of dry spiked biopotential electrodes and test their suitability to be used in anesthesia monitoring systems based on the…”
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Room-Temperature Sealing of Microcavities by Cold Metal Welding by Decharat, A., Junchun Yu, Boers, M., Stemme, G., Niklaus, F.

“…In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of microcavities using a room-temperature bonding…”
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Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding by Niklaus, F., Haasl, S., Stemme, G.

“…In this paper, we present CMOS compatible fabrication of monocrystalline silicon micromirror arrays using membrane transfer bonding. To fabricate the…”
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Low temperature full wafer adhesive bonding of structured wafers by Niklaus, F., Andersson, H., Enoksson, P., Stemme, G.

“…In this paper, we present a technology for void free low temperature full wafer adhesive bonding of structured wafers. Benzocyclobutene (BCB) is used as the…”
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Micromachined flat-walled valveless diffuser pumps by Olsson, A., Enoksson, P., Stemme, G., Stemme, E.

“…The first valveless diffuser pump fabricated using the latest technology in deep reactive ion etching (DRIE) is presented. The pump was fabricated in a…”
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Sealing of adhesive bonded devices on wafer level by Oberhammer, J., Niklaus, F., Stemme, G.

“…In this paper, we present a low temperature wafer-level encapsulation technique to hermetically seal adhesive bonded microsystem structures by cladding the…”
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Design and fabrication aspects of an S-shaped film actuator based DC to RF MEMS switch by Oberhammer, J., Stemme, G.

“…This paper reports on design and fabrication aspects of a new microelectromechanical series switch for switching dc and RF signals. The switch consists of a…”
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Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Wafers by Braun, S., Sandstrom, N., Stemme, G., van der Wijngaart, W.

“…This paper presents a concept for the wafer-scale manufacturing of microactuators based on the adhesive bonding of bulk shape-memory-alloy (SMA) sheets to…”
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Low-voltage high-isolation DC-to-RF MEMS switch based on an S-shaped film actuator by Oberhammer, J., Stemme, G.

“…This paper presents a new electrostatically actuated microelectromechanical series switch for switching dc to radio frequency (RF) signals. The device is based…”
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Row/Column Addressing Scheme for Large Electrostatic Actuator MEMS Switch Arrays and Optimization of the Operational Reliability by Statistical Analysis by Braun, S., Oberhammer, J., Stemme, G.

“…This paper investigates the design and optimization of a row/column addressing scheme to individually pull in or pull out single electrostatic actuators in an…”
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Low-temperature wafer-level transfer bonding by Niklaus, F., Enoksson, P., Griss, P., Kalvesten, E., Stemme, G.

“…In this paper, we present a new wafer-level transfer bonding technology. The technology can be used to transfer devices or films from one substrate wafer…”
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