Search Results - "SOUTHWICK, R. G"
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A Physical Model of the Temperature Dependence of the Current Through SiO2/HfO2 Stacks
Published in IEEE transactions on electron devices (01-09-2011)Get full text
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2
Impact of single pMOSFET dielectric degradation on NAND circuit performance
Published in Microelectronics and reliability (01-03-2008)“…Degradation of CMOS NAND logic circuits resulting from dielectric degradation of a single pMOSFET using constant voltage stress has been examined by means of a…”
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3
Selective Enablement of Dual Dipoles for near Bandedge Multi-Vt Solution in High Performance FinFET and Nanosheet Technologies
Published in 2020 IEEE Symposium on VLSI Technology (01-06-2020)“…We report that n-dipole and p-dipole (dual dipoles) can be co-integrated to provide a more flexible volumeless multiple threshold voltage(multi-Vt) solution in…”
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Conference Proceeding -
4
On the “U-shaped” continuum of band edge states at the Si/SiO2 interface
Published in Applied physics letters (28-11-2011)“…The historical and near universal acceptance that a U-shaped continuum of band edge states intrinsically exists at the Si/SiO2 boundary is re-examined. Using a…”
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Journal Article -
5
A Physical Model of the Temperature Dependence of the Current Through \hbox\hbox\hbox Stacks
Published in IEEE transactions on electron devices (01-09-2011)“…In this paper, we investigate the characteristics of the defects responsible for the leakage current in the SiO 2 and SiO 2 /HfO 2 gate dielectric stacks in a…”
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Selective GeOx-scavenging from interfacial layer on Si1−xGex channel for high mobility Si/Si1−xGex CMOS application
Published in 2016 IEEE Symposium on VLSI Technology (01-06-2016)“…We demonstrate a technique for selective GeO x -scavenging which creates a GeO x -free IL on Si 1-x Ge x substrates. This process reduces N it by >60% to 2e11…”
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Conference Proceeding -
7
Modeling temperature dependency (6 - 400K) of the leakage current through the SiO2/high-K stacks
Published in 2010 Proceedings of the European Solid State Device Research Conference (01-09-2010)“…We investigate the mechanism of the gate leakage current in the Si/SiO 2 /HfO 2 /TiN stacks in a wide temperature range (6 - 400 K) by simulating the electron…”
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Conference Proceeding -
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Hardware Based Performance Assessment of Vertical-Transport Nanosheet Technology
Published in 2022 International Electron Devices Meeting (IEDM) (03-12-2022)“…Vertical-transport FET (VTFET) is a strong candidate for future CMOS technology. The concept of VTFET has been demonstrated in our previous report, which…”
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Conference Proceeding -
9
Time dependent dielectric breakdown of SiN, SiBCN and SiOCN spacer dielectrics
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01-04-2017)“…The dielectric breakdown of SiN, SiBCN, and SiOCN MOSFET spacer dielectrics are studied. Using the Self-Consistent-Acceleration-Poisson-Statistics (SCAPS)…”
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Conference Proceeding -
10
SiGe Channel CMOS: Understanding Dielectric Breakdown and Bias Temperature Instability Tradeoffs
Published in 2019 Symposium on VLSI Technology (01-06-2019)“…Breakdown and bias temperature instability for n/pFETs are studied on a wide composition of SiGe channels on different strain relaxation buffers. This study…”
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Conference Proceeding -
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Time Dependent Dielectric Breakdown of Cobalt and Ruthenium Interconnects at 36nm Pitch
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01-03-2019)“…Time dependent dielectric breakdown (TDDB) properties of cobalt and ruthenium interconnects were investigated in 36 nm pitch dual damascene test vehicles. We…”
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Conference Proceeding -
12
Differentiated Performance and Reliability Enabled by Multi-Work Function Solution in RMG Silicon and SiGe MOSFETs
Published in 2018 IEEE Symposium on VLSI Technology (01-06-2018)“…We report for the first time that replacement metal gate (RMG) work function metal (WFM) modulates the interface defects in Silicon and SiGe MOSFETs. Changing…”
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Conference Proceeding -
13
Understanding the interfacial layer formation on strained Si1−xGex channels and their correlation to inversion layer hole mobility
Published in 2017 Symposium on VLSI Technology (01-06-2017)“…We investigate the mechanism of interfacial layer formation on Si 1-x Ge x (0 <; x <; 0.5) channel and its correlation to hole mobility. It is found that the…”
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Conference Proceeding -
14
A Physical Model of the Temperature Dependence of the Current Through [Formula Omitted] Stacks
Published in IEEE transactions on electron devices (01-09-2011)“…In this paper, we investigate the characteristics of the defects responsible for the leakage current in the [Formula Omitted] and [Formula Omitted] gate…”
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Journal Article -
15
A Physical Model of the Temperature Dependence of the Current Through hbox SiO 2 hbox / hbox HfO 2 Stacks
Published in IEEE transactions on electron devices (01-09-2011)“…In this paper, we investigate the characteristics of the defects responsible for the leakage current in the hbox SiO 2 and hbox SiO 2 hbox / break hbox HfO 2…”
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Journal Article -
16
On the "U-shaped" continuum of band edge states at the Si/SiO 2 interface
Published in Applied physics letters (01-12-2011)“…The historical and near universal acceptance that a U-shaped continuum of band edge states intrinsically exists at the Si/SiO 2 boundary is re-examined. Using…”
Get full text
Journal Article -
17
SiGe composition and thickness effects on NBTI in replacement metal gate / high-κ technologies
Published in 2014 IEEE International Reliability Physics Symposium (01-06-2014)“…The dependence of NBTI on SiGe thickness and composition for epitaxially grown layers on (100) and (110) Si substrates is studied in detail. It is found that…”
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Conference Proceeding -
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NBTI in Si0.5Ge0.5 RMG gate stacks - Effect of high-k nitridation
Published in 2015 IEEE International Reliability Physics Symposium (01-04-2015)“…Negative Bias Temperature Instability (NBTI) is assessed in (100)Si planar cSi 0.5 Ge 0.5 Replacement Metal Gate (RMG) gate stacks, with and without high-k…”
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Conference Proceeding -
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On the Contribution of Bulk Defects on Charge Pumping Current
Published in IEEE transactions on electron devices (01-11-2012)“…Frequency-dependent charge pumping (CP) (FD-CP) has emerged as a popular technique for studying the spatial and energetic distribution of defect centers in…”
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Journal Article -
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Survey of oxide degradation in inverter circuits using 2.0 nm MOS devices
Published in IEEE International Integrated Reliability Workshop Final Report, 2004 (2004)“…Degradation in CMOS inverter circuit performance as a result of gate oxide wearout in 2.0 nm pMOSFETs was investigated using a constant voltage stress (CVS)…”
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Conference Proceeding