Search Results - "SORSCH, T"
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1
The electronic structure at the atomic scale of ultrathin gate oxides
Published in Nature (London) (24-06-1999)“…The narrowest feature on present-day integrated circuits is the gate oxide-the thin dielectric layer that forms the basis of field-effect device structures…”
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2
Multi-component high- K gate dielectrics for the silicon industry
Published in Microelectronic engineering (01-11-2001)“…The exponential growth of the silicon industry can be attributed to that fact that silicon has a native oxide that is silicon dioxide. With SiO 2 soon…”
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3
Tunneling into interface states as reliability monitor for ultrathin oxides
Published in IEEE transactions on electron devices (01-12-2000)“…This paper reports experimental data and simulations of low-voltage tunneling in ultrathin oxide MOS devices. When the substrate is very heavily doped, a…”
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4
MEMS thermal imager with optical readout
Published in Sensors and actuators. A. Physical. (01-10-2009)“…A cantilever-based uncooled IR imager was developed utilizing a novel optical readout scheme based on inter-pixel interference. A series of small arrays…”
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5
Small-signal performance and modeling of sub-50 nm nMOSFETs with fT above 460-GHz
Published in Solid-state electronics (01-06-2008)Get full text
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6
Flexible fabrication of large pixel count piston-tip-tilt mirror arrays for fast spatial light modulators
Published in Microelectronic engineering (01-05-2007)“…We present arrays of electrostatically actuated piston-tip-tilt micromirrors realized using a surface micromachining 3-structural-layer polysilicon process…”
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7
Beyond the gene chip
Published in Bell Labs technical journal (2005)“…We describe a prospective strategy for reading the encyclopedic information encoded in the genome: using a nanopore in a membrane formed from a metal-oxide…”
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8
Rapid thermal processing of silicon wafers with emissivity patterns
Published in Journal of electronic materials (01-05-2006)“…Fabrication of devices and circuits on silicon wafers creates patterns in optical properties, particularly the thermal emissivity and absorptivity, that lead…”
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9
Understanding the limits of ultrathin SiO2 and Si-O-N gate dielectrics for sub-50 nm CMOS
Published in Microelectronic engineering (01-09-1999)Get full text
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10
The role of native traps on the tunneling characteristics of ultra-thin (1.5–3 nm) oxides
Published in Microelectronic engineering (1999)“…In this paper we report experiments and simulations on thin oxide (1.5–3 nm) MOS devices, showing that native traps can play a dominant role in the tunneling…”
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11
Ultra-thin gate oxide reliability projections
Published in Solid-state electronics (01-03-2002)“…We describe the reliability projection methods currently used and show that 1.6 nm oxides are sufficiently reliable even if soft breakdown is considered the…”
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12
Oxidation of Si beneath thin SiO2 layers during exposure to HBr/O2 plasmas, investigated by vacuum transfer x-ray photoelectron spectroscopy
Published in Applied physics letters (01-03-1999)“…Thin SiO2 layers were exposed to an HBr/O2 plasma for a variety of short periods, reproducing the over-etching process after polycrystalline Si gate electrodes…”
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13
Monolithic fringe-field-activated crystalline silicon tilting-mirror devices
Published in Journal of microelectromechanical systems (01-10-2003)“…A new approach is presented for fabricating monolithic crystalline silicon tilting-mirror microoptoelectromechanical systems (MOEMS) devices. The activation…”
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14
The relentless march of the MOSFET gate oxide thickness to zero
Published in Microelectronics and reliability (01-04-2000)“…The narrowest feature of an integrated circuit is the silicon dioxide gate dielectric (3–5 nm). The viability of future CMOS technology is contingent upon…”
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15
Progress toward a 30 nm silicon metal–oxide–semiconductor gate technology
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-11-1999)“…We report on progress toward scaling both N-metal–oxide–semiconductor (MOS) and P-metal–oxide–semiconductor MOS transistors to a gate length of 30 nm. We…”
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Conference Proceeding -
16
COM2 enhanced graded base SiGe technology for high speed applications
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)“…The COM2 enhanced graded base SiGe modular BiCMOS technology has been developed. It is based on the COM2 digital CMOS process. The technology achieves peak…”
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17
COM2 enhanced graded base SiGe technology for high speed applications
Published in 2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280) (2002)“…The COM2 Enhanced Graded Base SiGe modular BiCMOS technology has been developed. It is based on the COM2 digital CMOS process. The technology achieves peak…”
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Conference Proceeding -
18
High-Density Solder Bump Interconnect for MEMS Hybrid Integration
Published in IEEE transactions on advanced packaging (01-11-2007)“…An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The…”
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19
A novel, aerosol-nanocrystal floating-gate device for non-volatile memory applications
Published in International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138) (2000)“…This paper describes the fabrication, and structural and electrical characterization of a new, aerosol-nanocrystal floating-gate FET, aimed at non-volatile…”
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Conference Proceeding -
20
Monolithic MEMS optical switch with amplified out-of-plane angular motion
Published in IEEE/LEOS International Conference on Optical MEMs (2002)“…We describe an array of electrostatically actuated surface micromachined mirrors for fiber-optic switching. Using a pure flexure angle amplification mechanism…”
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Conference Proceeding