Search Results - "SING YEW, Kwang"

Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon by HENG TAN, Yew, SING YEW, Kwang, HONG LEE, Kwang, CHANG, Yao-Jen, CHEN, Kuan-Neng, SHENP ANG, Diing, FITZGERALD, Eugene A, CHUAN SENG TAN

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hbox\hbox Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon by Yew Heng Tan, Kwang Sing Yew, Kwang Hong Lee, Yao-Jen Chang, Kuan-Neng Chen, Diing Shenp Ang, Fitzgerald, E. A., Chuan Seng Tan

“…The quality of germanium (Ge) epitaxial film grown directly on silicon (Si) substrate is investigated based on the electrical properties of a…”
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Implementation of Simple but Powerful Trilayer Oxide-Based Artificial Synapses with a Tailored Bio-Synapse-Like Structure by Zhang, Haizhong, Ju, Xin, Yew, Kwang Sing, Ang, Diing Shenp

“…The ultimate aim of artificial synaptic devices is to mimic the features of biological synapses as closely as possible, in particular, its ability of…”
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Single ITO/HfOx/TiN Complementary Switch with a Wide Read Voltage Window for Selector-Less Crossbar RRAM Application by Haizhong Zhang, Diing Shenp Ang, Yu Zhou, Kwang Sing Yew

“…We report the complementary resistance switching (CRS) capability in a single-stack ITO/HfO x /TiN crossbar resistive memory device with a wide read margin…”
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In-Sensor Computing Realization Using Fully CMOS-Compatible TiN/HfO x ‑Based Neuristor Array by Zhang, Haizhong, Qiu, Peng, Lu, Yaoping, Ju, Xin, Chi, Dongzhi, Yew, Kwang Sing, Zhu, Minmin, Wang, Shaohao, Wei, Rongshan, Hu, Wei

“…With the evolution of artificial intelligence, the explosive growth of data from sensory terminals gives rise to severe energy-efficiency bottleneck issues due…”
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In-Sensor Computing Realization Using Fully CMOS-Compatible TiN/HfOx-Based Neuristor Array by Zhang, Haizhong, Qiu, Peng, Lu, Yaoping, Ju, Xin, Chi, Dongzhi, Yew, Kwang Sing, Zhu, Minmin, Wang, Shaohao, Wei, Rongshan, Hu, Wei

“…With the evolution of artificial intelligence, the explosive growth of data from sensory terminals gives rise to severe energy-efficiency bottleneck issues due…”
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Insights on Inter-metal Reliability Assessment of High Voltage Interconnects by Yew, Kwang Sing, Ong, Ran Xing, Yap, Hin Kiong, Yi, Wanbing, Phang, Jacquelyn, Chockalingam, R., Tan, Juan Boon

“…Reliability qualification of HV interconnects is more complicated due to the additional inter-metal impact under high voltage operation. Typically, this is…”
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[Formula Omitted] Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon by Tan, Yew Heng, Yew, Kwang Sing, Lee, Kwang Hong, Chang, Yao-Jen, Chen, Kuan-Neng, Ang, Diing Shenp, Fitzgerald, Eugene A, Tan, Chuan Seng

“…The quality of germanium (Ge) epitaxial film grown directly on silicon (Si) substrate is investigated based on the electrical properties of a…”
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A general simulation procedure for the electrical characteristics of metal-insulator-semiconductor tunnel structures by Vexler, M. I., Tyaginov, S. E., Illarionov, Yu. Yu, Sing, Yew Kwang, Shenp, Ang Diing, Fedorov, V. V., Isakov, D. V.

“…The algorithm is suggested for calculating the I – V characteristics of a voltage- or current-controlled metal-tunnel-thin insulator-semiconductor system. The…”
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Analysis of the electroluminescence features of silicon metal-insulator-semiconductor structures as a tool for diagnostics of the injection properties of a dielectric layer by Illarionov, Yu. Yu, Vexler, M. I., Isakov, D., Fedorov, V. V., Sing, Yew Kwang

“…A technique for diagnostics of the injection properties of thin dielectric layers based on analysis of the data on silicon electroluminescence in a…”
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Optimizing Interconnects RC Variability for Automotive Manufacturing using Novel Advanced Process Control by Yew, Kwang Sing, Jan Khor, Ee, Lee, Choon Gay, Chockalingam, Ramasamy, Tan, Juan Boon

“…Control of variation in interconnects resistance and capacitance (RC) model due to variability in semiconductor manufacturing is extremely challenging,…”
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Interconnects Variability Control for High Voltage Applications by Yew, Kwang Sing, Jiang, Yi, Yi, Wanbing, Chockalingam, Ramasamy, Ong, Ran Xing, Li, Bo, Tan, Juan Boon

“…Limiting the minimum spacing design rule of intra-metal lines and skipping the inter-metal layer in interconnects for more oxide spacing in order to improve…”
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Analysis of Extreme Pattern Density and Interconnects Routing Impacts on Via Open by Jiang, Yi, Yew, Kwang Sing, Lin, Kemao, Cheng, Weining, Hsieh, Curtis, Ong, Jonathan, Yi, Wanbing, Chockalingam, Ramasamy, Siah, Soh Yun, Boon Tan, Juan

“…Two phenomena of dual damascene via open in extremely low local metal pattern density region, and when connected through a narrow width metal line to a big pad…”
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Interconnects Electrical Parametric Variability Control for Automotive Manufacturing by Yew, Kwang Sing, Chockalingam, Ramasamy, Lee, Choon Gay, Goh, Jasper, Chen, Baozhuo, Guan, Xiaochong, Hsu, Rex, Tan, Juan Boon

“…The control of interconnects resistance, intra- and inter-capacitance (RC) variations in order to meet the stringent automotive sigma requirements is an…”
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