Search Results - "SEES, J. A"

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    Characterization and Application of the Vapor Phase Decomposition Technique for Trace Metal Analysis on Silicon Oxide Surfaces by Hall, L. H., Sees, J. A., Schmidt, B. L.

    Published in Surface and interface analysis (01-08-1996)
    “…Vapor phase decomposition–droplet surface etching–graphite furnace atomic absorption spectroscopy (VPD–DSE–GFAAS) is discussed as a technique for the…”
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    Journal Article
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    Sub-part-per-trillion detection and analysis of submicrometer particles in integrated circuit processing chemicals by Xu, D., Pinizzotto, R. F., Sees, J. A.

    Published in Journal of materials research (01-03-1998)
    “…We have developed a new technique for the analysis of particulate contaminants in liquids (or gases) with an elemental detectability limit as low as 0.1 parts…”
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    Journal Article
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    Studies on the production of fungal peroxidases in Aspergillus niger by CONESA, A, VAN DEN HONDEL, C. A. M. J. J, PUNT, P. J

    Published in Applied and environmental microbiology (01-07-2000)
    “…To get insight into the limiting factors existing for the efficient production of fungal peroxidase in filamentous fungi, the expression of the Phanerochaete…”
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    Journal Article
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    A Student-Designed Potentiometric Titration: Quantitative Determination of Iron(II) by Caro's Acid Titration by Powell, Joyce R, Tucker, Sheryl A, Acree, William E, Sees, Jennifer A, Hall, Lindsey H

    Published in Journal of chemical education (01-10-1996)
    “…A laboratory experiment involving the feasibility of using Caro's acid, H2SO5, as a titrant in the potentiometric determination of iron (II) is presented…”
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    Journal Article
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    The dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders by Pinizzotto, R.F., Jacobs, E.G., Wu, Y., Sees, J.A., Foster, L.A., Pouraghabagher, C.

    “…The kinetics of the growth of Cu/Sn intermetallics at composite solder/Cu substrate interfaces is examined. The composite solders consist of a eutectic Sn/Pb…”
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    Conference Proceeding