Search Results - "Rzepka, S."

Time-independent elastic–plastic behaviour of solder materials by Wiese, S., Rzepka, S.

“…For a long time, constitutive modelling of solders has focused onto the elastic and creep properties. Indeed, the creep model describes the behaviour of solder…”
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Stress analyses of high spatial resolution on TSV and BEoL structures by Vogel, D., Auerswald, E., Auersperg, J., Bayat, P., Rodriguez, R.D., Zahn, D.R.T., Rzepka, S., Michel, B.

“…Knowledge and control of local stress development in Back-End-of-Line (BEoL) stacks and nearby Through Silicon Vias (TSVs) in advanced 3D integrated devices is…”
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On the crack and delamination risk optimization of a Si-interposer for LED packaging by Auersperg, J., Dudek, R., Jordan, R., Bochow-Neß, O., Rzepka, S., Michel, B.

“…•Reliability issues of thermal copper-TSVs used for heat spreading in LED packages.•Interface fracture mechanics is utilized within a FEM framework.•Simulative…”
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Stress impact of moisture diffusion measured with the stress chip by Schindler-Saefkow, F., Rost, F., Otto, A., Pantou, R., Mroßko, R., Wunderle, B., Michel, B., Rzepka, S., Keller, J.

“…[Display omitted] •Measuring the stress during soldering, temperature cyclings, and moisture diffusion.•Verifying a high stress accuracy of the stress…”
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Effect of moisture swelling on MEMS packaging and integrated sensors by Keller, J., Mrossko, R., Dobrinski, H., Stürmann, J., Döring, R., Dudek, R., Rzepka, S., Michel, B.

“…In MEMS packaging moisture uptake of packaging materials may lead to severe changes in sensor behavior and package reliability. Knowledge and understanding of…”
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Condition monitoring indicators for Si and SiC power modules by Di Nuzzo, G., Tuellmann, M., Methfessel, T., Rzepka, S.

“…The reliability of power modules plays a crucial role in developing safer and smarter generations of electric vehicles. Condition monitoring represents a…”
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Determining adhesion of critical interfaces in microelectronics - a reverse Finite Element Modelling approach based on nanoindentation - Part I by Reuther, G.M., Albrecht, J., Pufall, R., Dudek, R., Rzepka, S.

“…In modern microelectronic devices, mechanical robustness and reliability have become more and more challenging, which is mainly due to continuous shrinkage of…”
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Determining adhesion of critical interfaces in microelectronics – A reverse Finite Element Modelling approach based on nanoindentation by Reuther, G.M., Albrecht, J., Dudek, R., Rzepka, S.

“…State-of-the-art microelectronic devices, especially power semiconductors, are usually exposed to harsh environmental conditions on the one hand, for example…”
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Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads by Dudek, R., Hildebrandt, M., Kreysig, K., Rzepka, S., Doring, R., Scheiter, L., Zhang, M., Ortmann, R. W.

“…Reliability is an obvious requirement in particular for the developing use of automotive electronics towards autonomous driving. Micro-electronics must also…”
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Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling by Dudek, R., Doring, R., Rzepka, S., Ehrhardt, C., Gunther, M., Haag, M.

“…New demands on the thermo-mechanical design of sintered silver interconnections emerge. Development of this inter-connection technology and both experimental…”
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Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor by Auersperg, J., Auerswald, E., Collet, C., Dean, Th, Vogel, D., Winkler, Th, Rzepka, S.

“…Silicon based pressure sensors often take advantage of piezo-resistive gages which are normally embedded by multiple silicon oxide and silicon nitride layers…”
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Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments by Vogel, D., Auerswald, E., Gadhiya, Gh, Rzepka, S.

“…A new measurement method for mechanical stresses with microscopic and sub-microscopic spatial resolution is presented. It bases on classical stress relief…”
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Geriatric trauma hospitalization in the United States: A population-based study by Rzepka, Susan G, Malangoni, Mark A, Rimm, Alfred A

“…The objective of this study was to characterize elderly trauma hospitalizations nationwide. Elderly Medicare beneficiaries hospitalized in 1989, with trauma as…”
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Thermo-fluidic coupled analysis of flip-chip mounted thermal test chips on a PCB — A numerical and experimental study by Schacht, R., Punch, J., Merten, E., Rzepka, S., Michel, B.

“…The concentration of electronic and mechanical components on a PCB (e.g. a PC main board) continues to increase, leading to higher power densities and more…”
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FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact by Auersperg, J., Breuer, D., Machani, K. V., Rzepka, S., Michel, B.

“…With the recent increase in Gold (Au) wire cost; Copper (Cu) wire becomes an attractive way to manage overall package cost. On the other hand, Copper wire…”
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Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue by Dudek, R., Hildebrand, M., Rzepka, S., Fries, T., Döring, R., Seiler, B., Ortmann, R.W.

“…Among others, physics of failure related concepts are being developed to address the thermo-mechanical reliability challenges in automotive electronics…”
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Risk assessment of bond pad stacks: Combined utilization of nanoindentation and FE-modeling by Albrecht, J., Reuther, G. M., Brueckner, J., Auersperg, J., Rzepka, S., Pufall, R.

“…Wire bonding as well as wafer probing can lead to oxide layer cracking. In combination with metal migration electrical failures may occur. Loading conditions…”
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Grabungsvorberichte/Preliminary Excavation Reports: Tell el-Retaba, Polish-Slovak Mission. From Hyksos Settlers to Ottoman Pipe Smokers. Tell el-Retaba 2014 by Rzepka, S.

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Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip by Schindler-Saefkow, F., Rost, F., Rezaie-Adli, A., Jansen, K. M. B., Wunderle, B., Keller, J., Rzepka, S., Michel, B.

“…The integration of smart systems into hybrid structures is one of the challenges addressed by the project MERGE - the cluster of excellence on Technologies for…”
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Reliability investigation and design of high power rectifier modules based on material characterization, simulation and experimental verification by Merten, E., von Essen, T., Luczack, F., Otto, A., Lunding, A., Lurkens, P., Bast, M., Abo Ras, M., Rzepka, S.

“…Increasing demands on efficiency, reliability and sustainability of high power electronics combined with the accompanying need of suitable new materials, raise…”
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