Search Results - "Roy, Surajit Kumar"

Fault Detection and Diagnosis of DMFB Using Concurrent Electrodes Actuation by Ghosh, Sourav, Kumar Roy, Surajit, Giri, Chandan

“…Digital Microfluidic Biochip (DMFB) is a heartening replacement to the conventional approach of biochemical laboratory tests. Air quality monitoring,…”
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TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…Through silicon via (TSV)-based 3-D integrated circuit (3-D IC) has several advantages like high density, high bandwidth, and low-power consumption. However,…”
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Iterative Parallel Test to Detect and Diagnose Multiple Defects for Digital Microfluidic Biochip by Ghosh, Sourav, Maity, Dolan, Chowdhury, Arijit, Kumar Roy, Surajit, Giri, Chandan

“…Digital microfluidic biochip is a revolutionizing platform to execute complex bioassay operations concurrently. Dependability is an important feature of…”
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Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…Three-dimensional Integrated-Circuits (3D ICs) based on Through-Silicon-Via (TSV) technology offer numerous advantages, including high density, enhanced…”
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Frequency-scaled thermal-aware test scheduling for 3D ICs using machine learning based temperature estimation by Chatterjee, Subhajit, Roy, Surajit Kumar, Giri, Chandan, Rahaman, Hafizur

“…Three-dimensional Integrated Circuits (3D IC) are being looked at as an alternative in overcoming some critical challenges plaguing conventional 2D ICs…”
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A cost-effective repair scheme for clustered TSV defects in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…The current industry trend favors TSV (Through-Silicon-Via) based 3D ICs (Three-dimensional Integrated-Circuits) due to their several benefits. However, the…”
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Built-in Self-prevention (BISP) for runtime ageing effects of TSVs in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…The adoption of Through-Silicon-Vias (TSVs) in Three-Dimensional Integrated Circuits (3D ICs) is gaining momentum in the industry, thanks to the numerous…”
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Threshold Analysis Using Probabilistic Xgboost Classifier for Hardware Trojan Detection by Dhar, Tapobrata, Das, Ranit, Giri, Chandan, Roy, Surajit Kumar

“…The fabless nature of integrated circuits manufacturing leaves them vulnerable to modifications by ill-intentioned third party. There arises a necessity for…”
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Identification of Random/Clustered TSV Defects in 3D IC During Pre-Bond Testing by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…Three-dimensional Integrated Circuits (3D ICs) based on Through-Silicon Vias (TSVs) provide many benefits, such as high density, high bandwidth and low-power…”
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Hardware Trojan Detection by Stimulating Transitions in Rare Nets by Dhar, Tapobrata, Roy, Surajit Kumar, Giri, Chandan

“…Outsourcing in the various stages of Integrated Circuit (IC) manufacturing process leaves the ICs vulnerable to inclusion of malicious circuitry called…”
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Design-for-test and test time optimization for 3D SOCs by Roy, Surajit Kumar, Giri, Chandan

“…Three dimensional (3D) integration based on through-Silicon-Via (TSV) is currently evolving as an area of great interest in modern semiconductor industry. 3D…”
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Optimization of Test Wrapper for TSV Based 3D SOCs by Roy, Surajit Kumar, Giri, Chandan, Rahaman, Hafizur

“…Manufacturing of core based three-dimensional (3D) integrated circuit (IC) is an emerging field of semiconductor industry that promises greater number of…”
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Testing and Diagnosis of Digital Microfluidic Biochips using Multiple Droplets by Ghosh, Sourav, Roy, Surajit Kumar, Giri, Chandan

“…Digital microfluidic biochip is a promising alternative to the traditional cumbersome laboratory equipment. Such automated biochips are used in many critical…”
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Optimisation of test architecture in three‐dimensional stacked integrated circuits for partial stack/complete stack using hard system‐on‐chips by Roy, Surajit Kumar, Giri, Chandan, Rahaman, Hafizur

“…Three‐dimensional stacked integrated circuits (3D SICs) are currently evolving as an area of great interest in modern semiconductor industry. Several partial…”
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Identification of Faulty TSV with a Built-In Self-Test Mechanism by Maity, Dilip, Roy, Surajit, Giri, Chandan, Rahaman, Hafizur

“…Three-dimensional Integrated Circuit (3D IC) based on through silicon via (TSV) has brought a drastic change in the IC technology. Since TSVs connect different…”
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Identification of Faulty TSVs in 3D IC During Pre-Bond Testing by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

“…Manufacturing of three-dimensional (3D) integrated circuit (IC) using through-silicon vias (TSVs) passes through a complex process and testing of TSVs is a…”
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Cost Effective Single Target Sample Preparation on Digital Microfluidic Biochip by Ghosh, Sourav, Roy, Surajit Kumar, Giri, Chandan

“…In many healthcare-related application fields, such as point-of-care clinical diagnostics, high throughput sequencing, and proteomics, the recent emergence of…”
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A Threshold based Hardware Trojan Detection Technique Using XGBoost Algorithm by Das, Ranit, Dhar, Tapobrata, Roy, Surajit Kumar

“…The globalization of Integrated Circuit (IC) manu-facturing has made ICs vulnerable to Hardware Trojans (HT). This paper proposes a gate-level netlist HT…”
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Wrapper design of embedded cores for three dimensional system-on-chips (SoC) using available TSVs by Roy, Surajit Kumar, Giri, Chandan, Ghosh, Sourav, Rahaman, Hafizur

“…Core based three-dimensional(3D) integrated circuits (ICs) design is an emerging field of semiconductor industry that promises greater number of devices on…”
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Hardware Trojan Detection Using Improved Testability Measures by Naskar, Priyanka, Dhar, Tapobrata, Roy, Surajit Kumar

“…The globalised nature of design and manufacturing process of Integrated Circuits (ICs) makes them susceptible to malicious alterations called Hardware Trojan…”
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