Search Results - "Roy, Surajit"

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  1. 1

    Fault Detection and Diagnosis of DMFB Using Concurrent Electrodes Actuation by Ghosh, Sourav, Kumar Roy, Surajit, Giri, Chandan

    Published in Journal of electronic testing (01-02-2023)
    “…Digital Microfluidic Biochip (DMFB) is a heartening replacement to the conventional approach of biochemical laboratory tests. Air quality monitoring,…”
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    Journal Article
  2. 2

    Identification of Faulty TSV with a Built-In Self-Test Mechanism by Maity, Dilip, Roy, Surajit, Giri, Chandan, Rahaman, Hafizur

    Published in 2018 IEEE 27th Asian Test Symposium (ATS) (01-10-2018)
    “…Three-dimensional Integrated Circuit (3D IC) based on through silicon via (TSV) has brought a drastic change in the IC technology. Since TSVs connect different…”
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    Conference Proceeding
  3. 3

    TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

    “…Through silicon via (TSV)-based 3-D integrated circuit (3-D IC) has several advantages like high density, high bandwidth, and low-power consumption. However,…”
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    Journal Article
  4. 4

    In-situ fatigue monitoring procedure using nonlinear ultrasonic surface waves considering the nonlinear effects in the measurement system by Dib, Gerges, Roy, Surajit, Ramuhalli, Pradeep, Chai, Jangbom

    Published in Nuclear engineering and technology (01-06-2019)
    “…Second harmonic generation using nonlinear ultrasonic waves have been shown to be an early indicator of possible fatigue damage in nuclear power plant…”
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    Journal Article
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    Iterative Parallel Test to Detect and Diagnose Multiple Defects for Digital Microfluidic Biochip by Ghosh, Sourav, Maity, Dolan, Chowdhury, Arijit, Kumar Roy, Surajit, Giri, Chandan

    Published in 2019 IEEE 28th Asian Test Symposium (ATS) (01-12-2019)
    “…Digital microfluidic biochip is a revolutionizing platform to execute complex bioassay operations concurrently. Dependability is an important feature of…”
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    Conference Proceeding
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    Vanishing waters: water chemistry of temporary rock pools of the Western Ghats, India by Kulkarni, Aboli, Roy, Surajit, Yogeshwaran, Murugesan, Shigwan, Bhushan, Vijayan, Smrithy, Kshirsagar, Pranav, Datar, Mandar N., Karthick, Balasubramanian

    Published in Water practice and technology (01-01-2022)
    “…The freshwater rockpools support high endemic biodiversity but are poorly studied habitats in the Western Ghats biodiversity hotspot. These freshwater rock…”
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    Journal Article
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    PKDL--A Silent Parasite Pool for Transmission of Leishmaniasis in Kala-azar Endemic Areas of Malda District, West Bengal, India by Ganguly, Swagata, Saha, Pabitra, Chatterjee, Moytrey, Roy, Surajit, Ghosh, Tamal Kanti, Guha, Subhasish K, Kundu, Pratip K, Bera, Dilip K, Basu, Nandita, Maji, Ardhendu K

    Published in PLoS neglected tropical diseases (01-10-2015)
    “…Post Kala-azar Dermal Leishmaniasis (PKDL) is a chronic but not life-threatening disease; patients generally do not demand treatment, deserve much more…”
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    Journal Article
  8. 8

    In-situ fatigue monitoring procedure using nonlinear ultrasonic surface waves considering the nonlinear effects in the measurement system by Dib, Gerges, Roy, Surajit, Ramuhalli, Pradeep, Chai, Jangbom

    “…Second harmonic generation using nonlinear ultrasonic waves have been shown to be an early indicator of possible fatigue damage in nuclear power plant…”
    Get full text
    Journal Article
  9. 9

    Solar power forecasting using domain knowledge by Mondal, Rakesh, Roy, Surajit Kr, Giri, Chandan

    Published in Energy (Oxford) (01-09-2024)
    “…Integrating renewable energy into the existing energy market is crucial. Solar power forecasting is essential since it depends on weather parameters and must…”
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    Journal Article
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    Load monitoring and compensation strategies for guided-waves based structural health monitoring using piezoelectric transducers by Roy, Surajit, Ladpli, Purim, Chang, Fu-Kuo

    Published in Journal of sound and vibration (01-09-2015)
    “…Accurate interpretation of in-situ piezoelectric sensor signals is a challenging task. This paper presents the development of a numerical compensation model…”
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    Journal Article
  12. 12

    Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

    Published in Microelectronics and reliability (01-12-2023)
    “…Three-dimensional Integrated-Circuits (3D ICs) based on Through-Silicon-Via (TSV) technology offer numerous advantages, including high density, enhanced…”
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    Journal Article
  13. 13

    Application of the Tsai’s modulus and double-double concepts to the definition of a new affordable design approach for composite laminates by Vermes, Bruno, Tsai, Stephen W., Riccio, Aniello, Di Caprio, Francesco, Roy, Surajit

    Published in Composite structures (01-03-2021)
    “…Composites design has always been perceived to be complicated, time-consuming and therefore not affordable. With a paradigm shift, it is possible to make…”
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    Journal Article
  14. 14

    COLOR INTENSITY AND ANTIOXIDATIVE CAPACITY OF FOUR NATURAL MONOFLORAL HONEY FROM MALDA, INDIA by SURAJIT ROY, SHYAMAPADA MANDAL

    “…Objective: The objective of the study was to explore the color intensity and antioxidative capacity of mango honey available from local niches, in and around…”
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    Journal Article
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    A cost-effective repair scheme for clustered TSV defects in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

    Published in Microelectronics and reliability (01-02-2022)
    “…The current industry trend favors TSV (Through-Silicon-Via) based 3D ICs (Three-dimensional Integrated-Circuits) due to their several benefits. However, the…”
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    Journal Article
  16. 16

    Built-in Self-prevention (BISP) for runtime ageing effects of TSVs in 3D ICs by Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan

    Published in Integration (Amsterdam) (01-01-2024)
    “…The adoption of Through-Silicon-Vias (TSVs) in Three-Dimensional Integrated Circuits (3D ICs) is gaining momentum in the industry, thanks to the numerous…”
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    Journal Article
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    Threshold Analysis Using Probabilistic Xgboost Classifier for Hardware Trojan Detection by Dhar, Tapobrata, Das, Ranit, Giri, Chandan, Roy, Surajit Kumar

    Published in Journal of electronic testing (01-08-2023)
    “…The fabless nature of integrated circuits manufacturing leaves them vulnerable to modifications by ill-intentioned third party. There arises a necessity for…”
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    Journal Article
  19. 19

    A novel physics-based temperature compensation model for structural health monitoring using ultrasonic guided waves by Roy, Surajit, Lonkar, Kuldeep, Janapati, Vishnuvardhan, Chang, Fu-Kuo

    Published in Structural health monitoring (01-05-2014)
    “…This article investigates the role of ambient temperature in causing changes to the structural wave propagation, as sensed by piezoelectric transducers, in a…”
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    Journal Article
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