Search Results - "Rouvière, J. L"

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  1. 1

    Strain measurement at the nanoscale: Comparison between convergent beam electron diffraction, nano-beam electron diffraction, high resolution imaging and dark field electron holography by Béché, A., Rouvière, J.L., Barnes, J.P., Cooper, D.

    Published in Ultramicroscopy (01-08-2013)
    “…Convergent beam electron diffraction (CBED), nano-beam electron diffraction (NBED or NBD), high resolution imaging (HRTEM and HRSTEM) and dark field electron…”
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    Journal Article
  2. 2

    Improved precision in strain measurement using nanobeam electron diffraction by Béché, A., Rouvière, J. L., Clément, L., Hartmann, J. M.

    Published in Applied physics letters (21-09-2009)
    “…Improvements in transmission electron microscopy have transformed nanobeam electron diffraction into a simple and powerful technique to measure strain. A Si…”
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    Journal Article
  3. 3

    Confirmation of the Domino-Cascade Model by LiFePO4/FePO4 Precession Electron Diffraction by Brunetti, G, Robert, D, Bayle-Guillemaud, P, Rouvière, J. L, Rauch, E. F, Martin, J. F, Colin, J. F, Bertin, F, Cayron, C

    Published in Chemistry of materials (25-10-2011)
    “…A recent transmission electron microscopy (TEM) method using precession electron diffraction (PED) was used to obtain LiFePO4 and FePO4 phase mapping at the…”
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    Journal Article
  4. 4

    Theoretical discussions on the geometrical phase analysis by Rouvière, J.L., Sarigiannidou, E.

    Published in Ultramicroscopy (01-12-2005)
    “…The Geometrical phase analysis, which is a very efficient method to measure deformation from High resolution transmission electron microscopy images, is…”
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    Journal Article
  5. 5

    Understanding and improving the low optical emission of InGaAs quantum wells grown on oxidized patterned (001) silicon substrate by Roque, J., Haas, B., David, S., Rochat, N., Bernier, N., Rouvière, J. L., Salem, B., Gergaud, P., Moeyaert, J., Martin, M., Bertin, F., Baron, T.

    Published in Applied physics letters (14-05-2018)
    “…In 0.3 Ga 0.7 As quantum wells (QW) embedded in AlGaAs barriers and grown on oxidized patterned (001) silicon substrates by metalorganic chemical vapor…”
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    Journal Article
  6. 6

    Dark field electron holography for strain measurement by Béché, A., Rouvière, J.L., Barnes, J.P., Cooper, D.

    Published in Ultramicroscopy (01-02-2011)
    “…Dark field electron holography is a new TEM-based technique for measuring strain with nanometer scale resolution. Here we present the procedure to align a…”
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    Journal Article
  7. 7

    Strain effect on mobility in nanowire MOSFETs down to 10 nm width: Geometrical effects and piezoresistive model by Pelloux-Prayer, J., Cassé, M., Triozon, F., Barraud, S., Niquet, Y.-M., Rouvière, J.-L., Faynot, O., Reimbold, G.

    Published in Solid-state electronics (01-11-2016)
    “…The effect of strain on carrier mobility in triple gate Fully Depleted Silicon On Insulator (FDSOI) nanowires (NWs) is experimentally investigated through…”
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    Journal Article
  8. 8

    Visualization of Tm dopant atoms diffused out of GaN quantum dots by Okuno, H., Rouvière, J.-L., Jouneau, P.-H., Bayle-Guillemaud, P., Daudin, B.

    Published in Applied physics letters (21-06-2010)
    “…GaN quantum dots doped with Tm atoms and embedded in AlN have been characterized by high-angle annular dark-field imaging using a scanning transmission…”
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    Journal Article
  9. 9

    Strain measurements by convergent-beam electron diffraction: The importance of stress relaxation in lamella preparations by Clément, L., Pantel, R., Kwakman, L. F. Tz, Rouvière, J. L.

    Published in Applied physics letters (26-07-2004)
    “…Local convergent-beam electron diffraction (CBED) patterns have been acquired on focus ion beam prepared samples in order to determine the strain field…”
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    Journal Article
  10. 10

    Microstructural void environment characterization by electron imaging in 45 nm technology node to link electromigration and copper microstructure by GALAND, R, BRUNETTI, G, ARNAUD, L, ROUVIERE, J.-L, CLEMENT, L, WALTZ, P, WOUTERS, Y

    Published in Microelectronic engineering (01-06-2013)
    “…The work presented in this paper illustrates the link between electromigration (EM) and microstructure in copper interconnects. For this study, 70 nm wide…”
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    Conference Proceeding Journal Article
  11. 11

    Quantitative analysis of HOLZ line splitting in CBED patterns of epitaxially strained layers by Houdellier, F., Roucau, C., Clément, L., Rouvière, J.L., Casanove, M.J.

    Published in Ultramicroscopy (01-08-2006)
    “…A SiGe layer epitaxially grown on a silicon substrate is experimentally studied by convergent beam electron diffraction (CBED) experiments and used as a test…”
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    Journal Article
  12. 12

    Strain distribution in GaN∕AlN quantum-dot superlattices by Sarigiannidou, E., Monroy, E., Daudin, B., Rouvière, J. L., Andreev, A. D.

    Published in Applied physics letters (14-11-2005)
    “…The two-dimensional strain distribution in a GaN∕AlN quantum-dot (QD) superlattice is measured from high-resolution transmission electron microscopy images…”
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    Journal Article
  13. 13

    GaN islanding by spontaneous rearrangement of a strained two-dimensional layer on (0001) AlN by Adelmann, C., Gogneau, N., Sarigiannidou, E., Rouvière, J.-L., Daudin, B.

    Published in Applied physics letters (14-10-2002)
    “…It is shown that a two-dimensional GaN layer grown on (0001) AlN under Ga-rich conditions remains two-dimensional while annealing under a Ga flux due to a…”
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    Journal Article
  14. 14

    Alternate dissociation of the screw dislocations in a (0 0 1) buried small-angle twist boundary in silicon by Bonnet, R., Loubradou, M., Youssef, S., Rouvière, J.-L., Fournel, F.

    Published in Philosophical magazine (Abingdon, England) (11-02-2009)
    “…The square dislocation network of a (0 0 1) buried small-angle boundary in silicon was observed by dark-field transmission electron microscopy to examine the…”
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    Journal Article
  15. 15

    Improved quality GaN grown by molecular beam epitaxy using In as a surfactant by Widmann, F., Daudin, B., Feuillet, G., Pelekanos, N., Rouvière, J. L.

    Published in Applied physics letters (02-11-1998)
    “…The surfactant effect of In during the growth of GaN by molecular beam epitaxy has been investigated. It has been found that the presence of In modifies the…”
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    Journal Article
  16. 16

    Polarity determination of GaN films by ion channeling and convergent beam electron diffraction by Daudin, B., Rouvière, J. L., Arlery, M.

    Published in Applied physics letters (21-10-1996)
    “…By using ion channeling and convergent beam electron diffraction techniques, we have determined the absolute polarity of various GaN films grown by MOCVD on…”
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    Journal Article
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  18. 18

    Strain, stress, and mechanical relaxation in fin-patterned Si/SiGe multilayers for sub-7 nm nanosheet gate-all-around device technology by Reboh, S., Coquand, R., Barraud, S., Loubet, N., Bernier, N., Audoit, G., Rouviere, J.-L., Augendre, E., Li, J., Gaudiello, J., Gambacorti, N., Yamashita, T., Faynot, O.

    Published in Applied physics letters (29-01-2018)
    “…Pre-strained fin-patterned Si/SiGe multilayer structures for sub-7 nm stacked gate-all-around Si-technology transistors that have been grown onto bulk-Si,…”
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    Journal Article
  19. 19

    TEM contrast of dissociated screw dislocations in silicon nearby a free surface by Boussaid, Ahlem, Youssef, Sami, Fnaiech, Mustapha, Rouvière, J.-L., Bonnet, Roland

    Published in Physica Status Solidi (b) (01-03-2006)
    “…Dislocations are commonly analyzed by weak‐beam or high resolution transmission electron microscopy (TEM) from the observation of the thinnest parts of TEM…”
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    Journal Article
  20. 20

    Epitaxial growth of germanium dots on Si(001) surface covered by a very thin silicon oxide layer by Barski, A., Derivaz, M., Rouvière, J. L., Buttard, D.

    Published in Applied physics letters (27-11-2000)
    “…We show that germanium dots can be directly grown by molecular beam epitaxy (MBE) on a silicon (001) surface covered by a thin (1.2-nm-thick) thermal silicon…”
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    Journal Article