Search Results - "Rosenberg, W.D." :: Katalog Arama

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Ceramic packages for liquid-nitrogen operation by Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.

Published in IEEE transactions on electron devices (01-08-1989)
“…To evaluate their compatibility for use in a liquid-nitrogen computer, metallized ceramic packages with test chips using controlled-collapse solder (Pb-Sn)…”

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Integrity of ceramic packages upon liquid nitrogen cycling by Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.

Published in Proceedings., 39th Electronic Components Conference (1989)
“…The integrity of two types of test packages (A and B) during cycling between 30 degrees C and liquid nitrogen temperature (-196 degrees C) is discussed. Type-A…”

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