Search Results - "Rong, Michelle Chew Bi"

A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction by Zhang, Li, Rafei, Siti Mohamed, Xie, Ling, Chew, Michelle Bi-Rong, Ji, Hong Miao, Chen, Yu, Rajoo, Ranjan, Ong, Kian-Leong, Tan, Rosemary, Lau, Suk-Hiang, Chow, Vincent T.K., Heng, Chew-Kiat, Teo, Keng-Hwa, Kang, Tae Goo

“…A self-contained disposable polydimethylsiloxane (PDMS) cartridge was developed for the extraction of dengue viral ribonucleic acid (RNA) in solid phase. The…”
Get full text

Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill by Pei-Siang, Sharon Lim, Fa Xing Che, Chong Ser Choong, Rong, Michelle Chew Bi, Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Chai Tai Chong

“…This paper reports the study of 3-D die stacking of three chips through-silicon-via (TSV) interconnections. Two different reflow approaches were used for the…”
Get full text

Challenges and optimization of 2nd bond process for reliable QFN packages by Binte Jaafar, Norhanani, Ching, Eva Wai Leong, Bi-Rong, Michelle Chew, Rao, Vempati Srinivasa, Minwoo, Daniel Rhee

“…As device technology is moving towards nano-IC technologies and consumer market are aggressively demands for the miniaturization of electronic products with…”
Get full text

Challenges and approaches of TSV thin die stacking on organic substrate by Pei-Siang, S. L., Che Faxing, Chong Ser Choong, Rong, M. C. B., Sekhar, V. N., Rao, V. S., Chai Tai Chong

“…The requirements for high density packaging such as smaller form factor, high performance and multi functionality electronics products have resulted in…”
Get full text

Development of Fine Pitch Solder Microbumps for 3D Chip Stacking by Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao

“…Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps…”
Get full text