Search Results - "Roberts, Jordan C"

Identification of Marbling Gene Loci in Commercial Pigs in Canadian Herds by Meadus, William, Duff, Pascale, Juarez, Manuel, Roberts, Jordan, Zantinge, Jennifer

“…A genome-wide association study (GWAS) was performed on the intramuscular fat percentage in pork chops in commercially available swine in Canada. The Duroc,…”
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Rapid and non-destructive determination of lean fat and bone content in beef using dual energy X-ray absorptiometry by López-Campos, Óscar, Roberts, Jordan C., Larsen, Ivy L., Prieto, Nuria, Juárez, Manuel, Dugan, Michael E.R., Aalhus, Jennifer L.

“…Dual energy X-ray absorptiometry (DXA) was evaluated for its accuracy in predicting total lean, fat and bone in beef carcass sides and primal cuts. Left…”
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Effects of hypoxic acclimation on contractile properties of the spongy and compact ventricular myocardium of steelhead trout (Oncorhynchus mykiss) by Roberts, Jordan C., Carnevale, Christian, Gamperl, A. Kurt, Syme, Douglas A.

“…The trout ventricle has an outer compact layer supplied with well-oxygenated arterial blood from the coronary circulation, and an inner spongy myocardium…”
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Effects of epinephrine exposure on contractile performance of compact and spongy myocardium from rainbow trout (Oncorhynchus mykiss) during hypoxia by Roberts, Jordan C., Syme, Douglas A.

“…Hypoxia results in elevated circulating epinephrine for many fish species, and this is likely important for maintaining cardiac function. The aims of this…”
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Effects of Using Tricaine Methanesulfonate and Metomidate before Euthanasia on the Contractile Properties of Rainbow Trout (Oncorhynchus mykiss) Myocardium by Roberts, Jordan C, Syme, Douglas A

“…Because many anesthetics work through depressing cell excitability, unanesthetized euthanasia has become common for research involving excitable tissues (for…”
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Tenderness and sensory attributes of 11 muscles from carcasses within the Canadian cull cow grades by Roberts, Jordan C., Rodas-González, Argenis, Juárez, Manuel, López-Campos, Óscar, Larsen, Ivy L., Aalhus, Jennifer L.

“…The eating quality and shear force of meat from mature beef carcasses graded within the Canadian grading system were compared with youthful carcasses. Eleven…”
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The Anand parameters for SAC solders after extreme aging by Basit, Munshi, Ahmed, Sudan, Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

“…The mechanical behavior of lead free solder materials is often represented using the Anand viscoplastic constitutive model. This nine parameter model is built…”
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Measurement and simulation of moisture induced die stresses in Quad Flat Packages by Quang Nguyen, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C.

“…In this study, an investigation has been performed on effects of moisture on die stresses in 240 pin Quad Flat Packs (QFPs). Stress sensing test chips were…”
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Characterization of Moisture Induced Die Stresses in Flip Chip Packaging by Nguyen, Quang, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

“…Moisture is a significant contributing factor to the failure of microelectronic packaging including phenomena such as popcorn cracking, delaminations, and…”
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Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging by Mustafa, M., Zijie Cai, Roberts, J. C., Suhling, J. C., Lall, P.

“…The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to…”
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Error analysis for piezoresistive stress sensors used in flip chip packaging by Hussain, Safina, Jaeger, Richard C, Suhling, Jeffrey C, Roberts, Jordan C, Motalab, Mohammad A, Chun-Hyung Cho

“…Multi-element resistor rosettes on silicon are widely utilized to measure integrated circuit die stress in electronic packages and other applications. Past…”
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The effects of aging on the fatigue life of lead free solders by Mustafa, Muhannad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

“…Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for…”
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Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments by Chen, Jun, Nguyen, Quang, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

“…Plastic Ball Grid Array (PBGA) technology has been proven to be one of the most popular packaging solutions with many advantages in thermo-electro-mechanical…”
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A Study on Die Stresses in Flip Chip Package Subjected to Various Hygrothermal Exposures by Nguyen, Quang, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

“…Moisture has been one of the major concerns for package designers and reliability researchers. It is well-known that high humidity combined with high…”
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A study of moisture and thermally induced die stresses in plastic ball grid array packages by Quang Nguyen, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C.

“…Electronic packages absorb moisture when exposed to uncontrolled humid conditions during manufacturing processes and service life. At high temperatures, the…”
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Effects of aging on shear cyclic stress strain and fatigue behaviors of lead free solder joints by Mustafa, Muhannad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

“…Solder materials in electronic packages are often subjected to thermal cycling, either during their application in products or during accelerated life…”
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Characterization of moisture and thermally induced die stresses in flip chip on laminate assemblies by Quang Nguyen, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C.

“…Stress sensing test chips are a powerful tool for measuring in-situ stresses in electronic packages. In this study, we have applied (111) silicon test chips to…”
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The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders by Basit, Munshi M., Motalab, Mohammad, Roberts, Jordan C., Suhling, Jeffrey C., Lall, Pradeep

“…In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling…”
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Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping by Roberts, Jordan C., Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C., Jaeger, Richard C., Lall, Pradeep

“…Microprocessor packaging in modern workstations and servers often consists of one or more large flip chip die that are mounted to a high performance ceramic…”
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Application of stress sensing test chips to area array packaging by Suhling, J.C., Jaeger, R.C., Lall, P., Rahim, M.K., Roberts, J.C., Hussain, S.

“…Thermal cycling accelerated life testing is often used to qualify area array packages (e.g. Ball Grid Arrays and Flip Chip) for various applications. Finite…”
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