Search Results - "Ročak, D."

A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits by Ročak, D., Maček, S., Sitek, J., Hrovat, M., Bukat, K., Drozd, Z.

“…The results of the influence of lead-free solder paste, design and process parameters on the attachment reliability of chip surface-mounted components (SMCs)…”
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Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits by Ročak, D., Bukat, K., Zupan, M., Fajfar-Plut, J., Tadić, V.

“…Some new no-clean fluxes were investigated by measurement of ionic contamination of flux residues and influence of flux residues on surface insulation…”
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Residual stresses in a pressure-sensor package induced by adhesive material during curing: a case study by Zarnik, Marina Santo, Rocak, Dubravka, Macek, Sreco

“…The attachment of the silicon piezoresistive pressure-sensor die to the ceramic substrate is one of the most critical steps in the production of highly…”
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Ceramic suspension optimization using factorial design of experiments by Rocak, Dubravka, Kosec, Marija, Degen, Andrej

“…The influence of organic phases (binder and two plasticizers) on ZnO slip viscosity and the properties of green tape were studied using design of experiments…”
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An Evaluation of Polymer Coatings for Hybrid Circuits by Ro ak, D, Kosec, M, Jan, F

“…An evaluation of some silicone and epoxy materials for primary chip and top coatings on hybrid circuits and of their relative merits on the basis of humidity…”
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Characterisation of Die Attach Adhesives by Remškar, M, Ro ak, D

“…Several commercially available epoxy and polyimide adhesives were tested. The properties essential for the use of adhesives in microelectronics are stated and…”
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Low-frequency noise of thick-film resistors as quality and reliability indicator by Rocak, Dubravka, Belavic, Darko, Hrovat, Marko, Sikula, Josef, Koktavy, Pavel, Pavelka, Jan, Sedlakova, Vlasta

“…The non-linearity and the noise of thick-film resistors are parameters that can be used to make a prediction of resistor reliability. The noise spectroscopy…”
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A comparison of the quality of lead-free solder pastes by Sitek, Janusz, Ro ak, Dubravka, Bukat, Krystyna, Fajfar-Plut, Janeta, Belavi, Darko

“…The European Commission has decided that from the second half of 2006 only lead-free solder pastes will be permitted for use in the electronics industry…”
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Silicon pressure sensors with a thick film periphery by BELAVIC, D, SOBA, S, PAVLIN, M, ROCAK, D, HROVAT, M

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An Introduction of RoHS Legislation in SMD Thick-Film Hybrid Technology - a Case Study by Belavic, D., Rocak, D., Plut, J.F., Hrovat, M., Pavlic, J., Drozd, Z., Macek, S., McGill, I., Bukat, K.

“…In this paper a case study of the introduction of European environmental regulations on the restriction of the use of hazardous substances (RoHS) in thick-film…”
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Solder paste for fine line printing in hybrid microelectronics by Ročak, Dubravka, Stopar, Vinko, Plut, Janeta Fajfar

“…A series of experiments was performed to evaluate the deposit consistency of solder paste from various producers, for fine line printing. Two main variables…”
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