Search Results - "Rip, Jens"

Scaled-Down c-Si and c-SiGe Wagon-Wheels for the Visualization of the Anisotropy and Selectivity of Wet-Chemical Etchants by Pacco, Antoine, Tao, Zheng, Rip, Jens, van Dorp, Dennis, Philipsen, Harold, Holsteyns, Frank

“…Wet etching offers an advantage as a soft, damage-less method to remove sacrificial material with close to nanometer precision which has become critical for…”
Get full text

Reaction mechanisms for atomic layer deposition of aluminum oxide on semiconductor substrates by Delabie, Annelies, Sioncke, Sonja, Rip, Jens, Van Elshocht, Sven, Pourtois, Geoffrey, Mueller, Matthias, Beckhoff, Burkhard, Pierloot, Kristine

“…In this work, we have studied the TMA/H2O (TMA = Al(CH3)3) atomic layer deposition (ALD) of Al2O3 on hydroxyl (OH) and thiol (SH) terminated semiconductor…”
Get full text

Chemical Vapor Deposition of Azidoalkylsilane Monolayer Films by Vos, Rita, Rolin, Cedric, Rip, Jens, Conard, Thierry, Steylaerts, Tim, Cabanilles, Maria Vidal, Levrie, Karen, Jans, Karolien, Stakenborg, Tim

“…N3-functionalized monolayers on silicon wafer substrates are prepared via the controlled vapor-phase deposition of 11-azidoundecyltrimethoxysilanes at reduced…”
Get full text

Metals in the active site of native protein phosphatase-1 by Heroes, Ewald, Rip, Jens, Beullens, Monique, Van Meervelt, Luc, De Gendt, Stefan, Bollen, Mathieu

“…Protein phosphatase-1 (PP1) is a major protein Ser/Thr phosphatase in eukaryotic cells. Its activity depends on two metal ions in the catalytic site, which…”
Get full text

Smooth and high quality epitaxial strained Ge grown on SiGe strain relaxed buffers with 70–85% Ge by Loo, Roger, Souriau, Laurent, Ong, Patrick, Kenis, Karine, Rip, Jens, Storck, Peter, Buschhardt, Thomas, Vorderwestner, Martin

“…Further improving complementary metal oxide semiconductor (CMOS) performance beyond the 15 nm generation likely requires the use of high mobility materials…”
Get full text

Mechanisms for the Trimethylaluminum Reaction in Aluminum Oxide Atomic Layer Deposition on Sulfur Passivated Germanium by Delabie, Annelies, Sioncke, Sonja, Rip, Jens, Van Elshocht, Sven, Caymax, Matty, Pourtois, Geoffrey, Pierloot, Kristine

“…Germanium combined with high-κ dielectrics is investigated for the next generations of CMOS devices. Therefore, we study reaction mechanisms for Al2O3 atomic…”
Get full text

Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking by Rip, Jens, Derakhshandeh, Jaber, Negishi, Ryo, Tomatsu, Itsuro, Cuypers, Dieter H., Beyne, Eric

“…In this paper we demonstrate the application of a formulated wet passivation on scaled Cu micro-bumps before Thermal Compression Bonding (TCB)process for 3D…”
Get full text

Biocompatibility assessment of advanced wafer-level based chip encapsulation by Dy, E, Vos, R, Rip, J, la Manna, A, Op de Beeck, M

“…Next generation implantable microsystem-based medical devices will have different packaging requirements than current implantable devices such as pace makers…”
Get full text

Total reflection X-ray fluorescence spectrometry for the introduction of novel materials in clean-room production environments by Hellin, D., De Gendt, S., Rip, J., Vinckier, C.

“…In this paper, a number of case studies on the analysis of novel metallic contaminants on conventional and alternative substrates using the technique of total…”
Get full text