Search Results - "Ricky Lee, S.W"

Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints by Yang, Chaoran, Song, Fubin, Ricky Lee, S.W.

“…•Ni in the SnCu solder can promote the growth of (Cu, Ni)6Sn5 and suppress the growth of Cu3Sn.•Ni improves the IMC strength, in terms of reducing the…”
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Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches by Zhang, Rong, Lee, S.W. Ricky

“…This paper demonstrates a LED wafer level packaging process which employs the glob-top dispensing technique for encapsulation. The process utilizes the…”
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Reliability study of surface mount printed circuit board assemblies with lead-free solder joints by Lo, Jeffery C.C, Jia, B.F, Liu, Z, Zhu, J, Ricky Lee, S.W

“…Purpose - The purpose of this paper is to evaluate the lead-free solder joint reliability of a variety of surface mount components assembled onto printed…”
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Drop/impact tests and analysis of typical portable electronic devices by Zhou, C.Y., Yu, T.X., Lee, Ricky S.W.

“…Drop/impact protection is an important concern for the design of portable electronic products. Drop/impact forces may cause severe functional damage in form of…”
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Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints by Yang, Chaoran, Le, Fuliang, Lee, S.W. Ricky

“…A detailed experimental study on the fracture mechanism of Cu–Sn intermetallic compounds (IMCs) in the Pb-free solder was presented in this paper. The growth…”
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Analysis on solder ball shear testing conditions with a simple computational model by Ricky Lee, S.W, Huang, Xingjia

“…This paper introduces a simple computational model for the analysis on the solder ball shear testing conditions. Both two-dimensional (2-D) and…”
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Implementation and characterisation of a sterilisation module consisting of novel 265 nm UVC LED packages by Qiu, Xing, Lo, Jeffery C C, Cheng, Yuanjie, Xu, Hua, Xu, Qianwen, Lee, Ricky S W

“…To efficiently fight against the COVID-19 pandemic, a sterilisation module using 265 nm UVC LED packages was developed. In this paper, the performance of the…”
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Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate by Yan, Eric C.C, Ricky Lee, S.W, Huang, X

“…This paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate for various plating schemes…”
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Fan-Out Wafer-Level Packaging for Heterogeneous Integration by Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

“…The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips and four capacitors by a fan-out wafer-level…”
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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration by Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

“…The design, materials, process, fabrication, and reliability of a heterogeneous integration of four chips by a fan-out panel-level packaging (FOPLP) method are…”
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Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes by Shang, Andrew W., Lo, Jeffery C. C., Lee, Ricky S. W.

“…Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially…”
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Transient light emission microscopy for detecting the non-uniform junction temperature in flip-chip light emitting diodes by Tao, Mian, Ricky Lee, S.W.

“…The non-uniform junction temperature may exist in the high-power light-emitting diode (LED) of flip-chip architecture. Detecting the local hot area on the chip…”
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Investigation on copper diffusion depth in copper wire bonding by Chen, Catherine H., Zhang, Shawn X., Ricky Lee, S.W., Mohamed, Lebbai

“…Due to the dramatic price increase of precious metals, the replacement of Au with Cu in wire bonding has become an emerging trend for IC packaging nowadays…”
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Improved Inkjet Printing of Polydimethylsiloxane Droplets by Tu, Ning, Lo, Jeffery C.C., Lee, S.W. Ricky

“…Inkjet printing polydimethylsiloxane (PDMS) has received wide interest in the field of additive manufacturing for printing flexible wearable electronics…”
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Stability Study of Quantum Dot Color Converted Mini/Micro-LED Displays by Cheng, Yuanjie, Lo, Jeffery C.C., Qiu, Xing, Xu, Hua, Tao, Mian, Lee, S.W. Ricky

“…The implementation of quantum dot color conversion (QDCC) technology in mini/micro-LED display applications has attracted considerable interest due to its…”
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Reliability study of surface mount printed circuit board assemblies with leadfree solder joints by Lo, Jeffery C.C., Jia, B.F., Liu, Z., Zhu, J., Ricky Lee, S.W.

“…Purpose The purpose of this paper is to evaluate the leadfree solder joint reliability of a variety of surface mount components assembled onto printed circuit…”
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Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels by Xu, Hua, Lo, Jeffery C.C., Lee, S.W. Ricky

“…Cross-sectioning plays an important role in failure analysis. However, commonly used polishing method affects the bonded silicon microchannels and face-to-face…”
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A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties by Jing-Feng Gong, Chan, P.C.H., Guo-Wei Xiao, Lee, R.S.W., Yuen, M.M.F.

“…The effects of under bump metallurgy (UBM) microstructures on the intermetallic compound (IMC) growth of electroplated and stencil printed eutectic Sn-Pb…”
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Solder joint reliability of cavitydown plastic ball grid array assemblies by Ricky Lee, S.W., Lau, John H.

“…A computational model was established in this study to simulate cavitydown plastic ball grid array PBGA assemblies. Stress analysis was performed to…”
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Thermally conductive adhesives based on silver coated copper flake fillers by Jin-Qi, Xie, Hu-Ming, Ren, Kai, Zhang, Yuen, Matthew M. F., Lee, S. W. Ricky, Xian-Zhu, Fu, Rong, Sun, Ching-Ping, Wong

“…In this paper, we reported thermally conductive adhesives filled with Ag-coated Cu flakes and investigated the effect of adhesive composition on the thermal…”
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