Search Results - "Rhee, Min Woo Daniel"

Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling by Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee, Daniel

“…Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple…”
Get full text

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application by Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel

“…Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic…”
Get full text

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications by Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo

“…Cyanate ester resin-based composite materials have been proposed as potential encapsulants for high-temperature applications. The objective of this study is to…”
Get full text

Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Rhee, Daniel Min Woo, Leong, Kam Chew, Chen, Zhong

“…•Deposition of Cu thin film on Al2O3 substrate is carried out without adhesion layer.•Effectiveness of surface treatments to improve the film adhesion has been…”
Get full text

Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices by Gongyue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, Rhee, Daniel Min Woo

“…In this paper, a compact and efficient single-phase liquid cooling system is developed for the microelectronic devices with high-power dissipation, such as the…”
Get full text

Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in Non-Conductive Paste (NCP) for 3DIC Packaging by Woo Rhee, Daniel Min

“…A new estimation technique for interfacial reaction between amine-epoxy based resin and nano scale silica filler suspension system is developed to explain the…”
Get full text

Numerical study of edge condensation in wafer to wafer bonding process with lattice Boltzmann approach by Lee, Jung Shin, Hyung Kim, Jun, Woo Rhee, Daniel Min

“…Direct wafer bonding process is applied in semiconductor production because of the advantage of attaching several chips at once. During the bonding process,…”
Get full text

Direct Patterning of Conductive Fine Line in Dielectric Layer for Semiconductor Package by Lee, Jung Shin, Cho, Jung Woo, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Woo Rhee, Daniel Min

“…Using inkjet printing, fine conductive lines could be obtained through a combination of suitable substrate wettability. we performed study on what surface…”
Get full text

Process characterization of highly conductive silver paste die attach materials for thin die on QFN by Leong Ching Wai, Ding Mian Zhi, Rao, V. S., Rhee, Min Woo Daniel

“…In this paper, die attach process characterization on two type of highly conductive silver paste die attach materials was discussed. The first silver paste die…”
Get full text

Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics by Chidambaram, Vivek, Rong, Eric Phua Jian, Gan Chee Lip, Rhee, Min Woo Daniel

“…Au-Ge eutectic has been used as a high temperature electronics interconnection material up to 250°C due to its favorable characteristics. However, both…”
Get full text

Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages by Hoe, Yen Yi Germaine, Yap Guan Jie, Rao, V. S., Rhee, M. W. Daniel

“…This work describes an investigation into the performance of packaging materials, developed with a specific aim in improving thermal performance, such as…”
Get full text

Flow modeling of die attach process and the optimization of process parameters in advance packaging by Lin Ji, Leong Ching Wai, Rhee, M. W. D.

“…This paper presents a new numerical model to characterize the die attach process in the advance packaging. With its successful application on a 5 mm by 5 mm…”
Get full text

Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications by Sekhar, V. N., Lee Jong Bum, Shibata, Tomoaki, Kawamori, Takashi, Masuda, Katsuyuki, Woo, Daniel Rhee Min, Chen Bangtao, Yamamoto, Kazunori

“…In this paper, the authors focus on the evaluation of novel film type thermo-plastic adhesives in thin wafer handling technology for temporary bonding…”
Get full text

Impact of advanced materials on power cycling performance and process dependent stresses of QFN by Ho Siow Ling, Ching, E. W. L., Yi, G. H. Y., Rhee, Min Woo Daniel

“…Due to different demands, there are many types of die attach technologies in the market. In this work, die attach materials such as solder, silver filled…”
Get full text

Characterization of thermally conductive underfill materials for high performance flip-chip applications by Chew, M., Mian Zhi Ding, Wai, E., Ser Choong Chong, Rao, V. S., Rhee, Min Woo Daniel

“…In this paper, characterization of 3 types of underfill for high performance applications has been presented. Characterizations of underfill materials such as…”
Get full text

Extreme high pressure and high temperature package development by Hwang How Yuan, Ching, Eva Wai Leong, Chan Yuen Sing, Chidambaram, Vivek, Lee Jong Bum, Rong, Eric Phua Jian, Gan Chee Lip, Woo, Daniel Rhee Min

“…As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature…”
Get full text

A Development of Finite Element Analysis Model of 3DIC TSV Package Warpage Considering Cure Dependent Viscoelasticity with Heat Generation by Han, Min soo, Shin, Yongchul, Lim, Kyeongbin, Rhee, Daniel Min Woo

“…In this study, a numerical methodology to predict package warpage considering viscoelasticity with cure-kinetics during thermal process was proposed. When a…”
Get full text

Novel Characterization Method of Chip Level Hybrid Bonding Strength by Kim, Juno, Lim, Kyeongbin, Hahn, Seung Ho, Lee, Mingu, Rhee, Daniel Min Woo

“…A new characterization method for interfacial adhesion between die to die hybrid bonding interface at chip level is developed to evaluate and analyze the…”
Get full text

Numerical Study of Metal Ink Behavior on the Wettability Pattern for Conductive Line Inkjet-Printing with Lattice Boltzmann Approach by Lee, Jung Shin, Cho, Jung Woo, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Rhee, Daniel Min Woo

“…In order to obtain a thin conductive wiring using inkjet printing, it is necessary to create a wetting pattern on the target surface to adjust the spread of…”
Get full text

Miniaturized Double Side Cooling Packaging for High Power 3 Phase SiC Inverter Module with Junction Temperature over 220°C by Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Lee Jong Bum, Zhang Hengyun

“…In this paper, authors developed miniaturizeddouble side cooling packaging for SiC (silicon carbide) highpower inverter module using new material solutions…”
Get full text