Search Results - "Rhee, Min Woo"

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications by Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo

“…Cyanate ester resin-based composite materials have been proposed as potential encapsulants for high-temperature applications. The objective of this study is to…”
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Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application by Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel

“…Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic…”
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Reliability Investigation of Cu/In TLP Bonding by Lee, Jong-Bum, Hwang, How-Yuan, Rhee, Min-Woo

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Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling by Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee, Daniel

“…Microfluid cooling solution is one of the most effective techniques for thermal management of high heat fluxes. A jet-based Si microcooler with multiple…”
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3-D TSV Six-Die Stacking and Reliability Assessment of 20- \mu m-Pitch Bumps on Large-Scale Dies by Lee, Jong Bum, Aw, Jie Li, Rhee, Min Woo

“…3-D integration typically involves multiple chips stacking with large numbers of interconnections within each chip. There are several fundamental technology…”
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Evaluation of Die-Attach Bonding Using High-Frequency Ultrasonic Energy for High-Temperature Application by Lee, Jong-Bum, Aw, Jie-Li, Rhee, Min-Woo

“…Room-temperature die-attach bonding using ultrasonic energy was evaluated on Cu/In and Cu/Sn-3Ag metal stacks. The In and Sn-3Ag layers have much lower melting…”
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Effect of surface treatment on adhesion strength between magnetron sputtered copper thin films and alumina substrate by Lim, Ju Dy, Lee, Pui Mun, Rhee, Daniel Min Woo, Leong, Kam Chew, Chen, Zhong

“…•Deposition of Cu thin film on Al2O3 substrate is carried out without adhesion layer.•Effectiveness of surface treatments to improve the film adhesion has been…”
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3-D Modeling and Characterization for Die Attach Process by Bu, Lin, Ching, Wai Leong, Ling, Ho Siow, Rhee, Min Woo, Fen, Yong Puay

“…A new 3-D model for the die attach (DA) process is established and validated in this paper. With this model, the fluid flow characteristics of the DA process…”
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Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices by Gongyue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, Rhee, Daniel Min Woo

“…In this paper, a compact and efficient single-phase liquid cooling system is developed for the microelectronic devices with high-power dissipation, such as the…”
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Reliability Investigation of Cu/In TLP Bonding by Lee, Jong-Bum, Hwang, How-Yuan, Rhee, Min-Woo

“…Die-attach bonding was evaluated using a transient liquid phase (TLP) bonding method on a Cu/In, Au/In and Cu-Sn3Ag metal stack. TLP bonding is a relatively…”
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Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in Non-Conductive Paste (NCP) for 3DIC Packaging by Woo Rhee, Daniel Min

“…A new estimation technique for interfacial reaction between amine-epoxy based resin and nano scale silica filler suspension system is developed to explain the…”
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First Lateral Contact Probing of 55- \mu m Fine Pitch Micro-Bumps by Kim, Chang-Keun, Yoon, Yong-Hoon, Kwon, Donguk, Kim, Seunghwan, Yoon, Gun-Wook, Rhee, Min Woo, Yun, Jinyeong, Park, Inkyu, Yoon, Jun-Bo

“…Probing micro-bumps for pre-bond testing is an essential process to check for a known good die. In recent technologies, micro-bumps such those used in 3-D-IC…”
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First Lateral Contact Probing of 55-[Formula Omitted]m Fine Pitch Micro-Bumps by Chang-Keun, Kim, Yong-Hoon, Yoon, Kwon, Donguk, Kim, Seunghwan, Gun-Wook Yoon, Min Woo Rhee, Jinyeong Yun, Park, Inkyu, Jun-Bo, Yoon

“…Probing micro-bumps for pre-bond testing is an essential process to check for a known good die. In recent technologies, micro-bumps such those used in 3-D-IC…”
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Process characterization of highly conductive silver paste die attach materials for thin die on QFN by Leong Ching Wai, Ding Mian Zhi, Rao, V. S., Rhee, Min Woo Daniel

“…In this paper, die attach process characterization on two type of highly conductive silver paste die attach materials was discussed. The first silver paste die…”
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Performance enhancement of Au-Ge eutectic alloys for high-temperature electronics by Chidambaram, Vivek, Rong, Eric Phua Jian, Gan Chee Lip, Rhee, Min Woo Daniel

“…Au-Ge eutectic has been used as a high temperature electronics interconnection material up to 250°C due to its favorable characteristics. However, both…”
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Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages by Hoe, Yen Yi Germaine, Yap Guan Jie, Rao, V. S., Rhee, M. W. Daniel

“…This work describes an investigation into the performance of packaging materials, developed with a specific aim in improving thermal performance, such as…”
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Numerical study of edge condensation in wafer to wafer bonding process with lattice Boltzmann approach by Lee, Jung Shin, Hyung Kim, Jun, Woo Rhee, Daniel Min

“…Direct wafer bonding process is applied in semiconductor production because of the advantage of attaching several chips at once. During the bonding process,…”
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Direct Patterning of Conductive Fine Line in Dielectric Layer for Semiconductor Package by Lee, Jung Shin, Cho, Jung Woo, Park, Sun Woo, Lee, Seungdon, Lee, Hyunjin, Woo Rhee, Daniel Min

“…Using inkjet printing, fine conductive lines could be obtained through a combination of suitable substrate wettability. we performed study on what surface…”
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Flow modeling of die attach process and the optimization of process parameters in advance packaging by Lin Ji, Leong Ching Wai, Rhee, M. W. D.

“…This paper presents a new numerical model to characterize the die attach process in the advance packaging. With its successful application on a 5 mm by 5 mm…”
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Impact of advanced materials on power cycling performance and process dependent stresses of QFN by Ho Siow Ling, Ching, E. W. L., Yi, G. H. Y., Rhee, Min Woo Daniel

“…Due to different demands, there are many types of die attach technologies in the market. In this work, die attach materials such as solder, silver filled…”
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