Search Results - "Reboun, Jan"

Study of copper thick film metallization on aluminum nitride by Hlina, Jiri, Reboun, Jan, Hamacek, Ales

“…This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology…”
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Properties of power electronic substrates based on thick printed copper technology by Reboun, Jan, Hromadka, Karel, Hermansky, Vojtech, Johan, Jan

“…The aim of this work is to develop new metallisation procedures of 96% alumina substrates with copper using thick film technology and firing in a special batch…”
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Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons by Hirman, Martin, Navratil, Jiri, Steiner, Frantisek, Reboun, Jan, Soukup, Radek, Hamacek, Ales

“…This article addresses the research and development of a reliable interconnection technique for mounting surface mounted device components onto newly developed…”
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Effect of copper- and silver-based films on alumina substrate electrical properties by Reboun, Jan, Hlina, Jiri, Totzauer, Pavel, Hamacek, Ales

“…This paper focuses on evaluating the influence of thick films on the electrical properties of ceramic substrates, especially their dielectric strength…”
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FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers by Kalaš, David, Šíma, Karel, Kadlec, Petr, Polanský, Radek, Soukup, Radek, Řeboun, Jan, Hamáček, Aleš

“…The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused…”
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Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials by Kalaš, David, Soukup, Radek, Řeboun, Jan, Radouchová, Michaela, Rous, Pavel, Hamáček, Aleš

“…Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or…”
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Solder joints on thick printed copper substrates by Hirman, Martin, Michal, David, Reboun, Jan, Steiner, Frantisek

“…•We tested larger components soldering on ceramic substrates without conventional flux.•We tried glutaric acid or diluted flux use combined with formic acid…”
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Interconnecting embroidered hybrid conductive yarns by ultrasonic plastic welding for e-textiles by Dils, Christian, Kalas, David, Reboun, Jan, Suchy, Stanislav, Soukup, Radek, Moravcova, Daniela, Krshiwoblozki, Malte von, Schneider-Ramelow, Martin

“…This article presents a novel approach for the electrical interconnection of embroidered conductive yarns with each other at defined cross-points using…”
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Investigation of cooling capability of ceramic substrates for power electronics applications by Hlina, Jiri, Reboun, Jan, Janda, Martin

“…•Numerical study of cooling capability of Al2O3 and AlN substrates.•Effects of ceramic substrate thickness, material and flow rate were investigated.•Numerical…”
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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications by Hlina, Jiri, Reboun, Jan, Hamacek, Ales

“…This paper is focused on copper–nickel nanoparticle resistive inks compatible with thick printed copper (TPC) technology, which can be used for power substrate…”
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Study of Internal Stress in Conductive and Dielectric Thick Films by Hlina, Jiri, Reboun, Jan, Janda, Martin, Hamacek, Ales

“…This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and…”
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Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper by Hlina, Jiri, Reboun, Jan, Simonovsky, Marek, Syrovy, Tomas, Janda, Martin, Hamacek, Ales

“…This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power…”
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Comparison of the surface properties of power electronic substrates by Hromadka, Karel, Reboun, Jan, Rendl, Karel, Wirth, Vaclav, Hamacek, Ales

“…This paper deals with thick film copper technology (TFC) and its comparison with other power electronic substrates such as a printed silver or direct bonded…”
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Reliability of printed power resistor with thick-film copper terminals by Hlina, Jiri, Reboun, Jan, Johan, Jan, Simonovsky, Marek, Hamacek, Ales

“…This paper is focused on the thick-film power resistors with copper terminals. These terminals are created by the new Thick Printed Copper (TPC) technology…”
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Study of co-fired multilayer structures based on Thick Printed Copper technology by Hlina, Jiri, Reboun, Jan, Hermansky, Vojtech, Simonovsky, Marek, Johan, Jan, Hamacek, Ales

“…•Electrical and mechanical parameters of co-fired multilayer Thick Printed Copper structures.•Evaluation of changes in electrical and mechanical parameters…”
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Test bench for calibration of magnetic field sensor prototypes for COMPASS-U tokamak by Torres, Andre, Kovarik, Karel, Markovic, Tomas, Adamek, Jiri, Duran, Ivan, Ellis, Robert, Jerab, Martin, Reboun, Jan, Turjanica, Pavel, Weinzettl, Vladimir, Fernandes, Horacio

“…•COMPASS Upgrade magnetic field sensors prototypes described.•Detailed procedures for calibration and frequency response of magnetic field…”
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Printed inductors for RFID tags by Shlykevich, Alexey, Blecha, Tomas, Reboun, Jan, Hamacek, Ales, Syrovy, Tomas

“…The article describes various options of receiving printing inductors for passive RFID tags which work at frequency 13.56 MHz. Different variants of producing…”
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Organic based sensors: Novel screen printing technique for sensing layers deposition by Soukup, R., Hamacek, A., Reboun, J.

“…This paper presents a research focused on development of low-cost manufacturing process which enables fabrication of accurate organic humidity sensors, where…”
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Nitrogen Dioxide Sensor Based on Organic Electrochemical Transistor by Slauf, Josef, Reboun, Jan

“…The concept of a sensor element based on an organic electrochemical transistor is presented. The sensor is aimed at detecting gaseous nitrogen dioxide in low…”
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The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer by Michal, David, Reboun, Jan

“…This paper deals with the effect of the formic acid vapours on the thickness and roughness of the conductive layer during oxide reduction process. To fully…”
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