Search Results - "Razek, Nasser"
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Low temperature covalent wafer bonding for X-ray imaging detectors
Published in Japanese Journal of Applied Physics (01-02-2020)“…We developed a process for covalent semiconductor wafer bonding carried out at low temperature and its application to monolithic CMOS integrated pixel…”
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Journal Article -
2
Combined surface-focused acoustic microscopy in transmission and scanning ultrasonic holography
Published in Ultrasonics (22-12-2006)“…Employment of ultrasound techniques in nondestructive testing may require identification of the acoustic modes contributing to imaging. Such identification can…”
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Journal Article -
3
III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
Published in Nature energy (01-04-2018)“…Silicon dominates the photovoltaic industry but the conversion efficiency of silicon single-junction solar cells is intrinsically constrained to 29.4%, and…”
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Journal Article -
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Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g
Published in IEEE journal of photovoltaics (01-01-2017)“…Stacking III-V p-n junctions on top of wafer-based silicon solar cells is a promising way to go beyond the silicon single-junction efficiency limit. In this…”
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Journal Article -
5
Author Correction: III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
Published in Nature energy (01-07-2018)“…In the version of this Article originally published, in the ‘Rear-side light trapping’ paragraph of the Methods section, the values of depth and fill factor…”
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Journal Article -
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Author Correction: III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration
Published in Nature energy (01-06-2018)“…In the version of this Article originally published, in the legend in Fig. 5a, the blue, green and red lines were incorrectly labelled as GaAs, Si and GaInP,…”
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Journal Article -
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Application of spatially and temporally apodized non-confocal acoustic transmission microscopy to imaging of directly bonded wafers
Published in Ultrasonics (2006)“…Application of a line-shaped point spread function (PSF) to imaging of void defects in directly bonded wafers is considered. Two non-confocally adjusted…”
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Journal Article -
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Low temperature covalent wafer bonding for X-ray imaging detectors
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01-05-2019)“…Low temperature wafer bonding of silicon to various materials is a key technology for all applications requiring a low temperature budget, such as monolithic…”
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Conference Proceeding -
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An exploration of the case of Saudi students' engagement, success, and self-efficacy at a Mid Western American university
Published 01-01-2012“…The number of Saudi students studying in the United States quintupled over the last five years due to a fully funded Saudi government scholarship. The presence…”
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Dissertation