Search Results - "Rayner, G. B."
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Nonlinear composition dependence of x-ray photoelectron spectroscopy and Auger electron spectroscopy features in plasma-deposited zirconium silicate alloy thin films
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-07-2002)“…The local bonding of Zr, Si, and O atoms in plasma-deposited, and post-deposition annealed Zr silicate pseudobinary alloys [( ZrO 2 ) x ( SiO 2 ) 1−x ] was…”
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Conference Proceeding -
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A spectroscopic study distinguishing between chemical phase separation with different degrees of crystallinity in Hf(Zr) silicate alloys
Published in Applied surface science (15-07-2004)“…One of the more significant limitations for the integration of transition metal silicate alloys as gate dielectrics into advanced Si devices is a chemical…”
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Conference Proceeding Journal Article -
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Chemical phase separation in Zr silicate alloys: a spectroscopic study distinguishing between chemical phase separation with different degrees of micro- and nano-crystallinity
Published in Journal of non-crystalline solids (15-06-2004)“…Chemical phase separation is an important issue for process integration of non-crystalline Zr and Hf silicate alloys into advanced microelectronic devices…”
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Journal Article -
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Chemical phase separation in Zr silicate alloys: a spectroscopic study distinguishing between chemical phase separation with different degree of micro- and nano-crystallinity
Published in Microelectronic engineering (01-04-2004)“…Chemical phase separation at processing temperatures is an important issue for integration of Zr and Hf silicates alloys into advanced CMOS devices. Chemical…”
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Journal Article Conference Proceeding -
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Microscopic model for enhanced dielectric constants in low concentration SiO2-rich noncrystalline Zr and Hf silicate alloys
Published in Applied physics letters (30-10-2000)“…Dielectric constants, k, of Zr(Hf) silicate alloy gate dielectrics obtained from analysis of capacitance–voltage curves of metal–oxide–semiconductor capacitors…”
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Electronic structure of high-k transition metal oxides and their silicate and aluminate alloys
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-07-2002)“…This article addresses differences between the electronic structure of: (i) alternative high-k transition metal (TM) rare earth dielectrics and (ii) SiO 2 and…”
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Conference Proceeding -
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Chemical and physical limits on the performance of metal silicate high- k gate dielectrics
Published in Microelectronics and reliability (01-07-2001)“…This research identifies four significant limitations on the performance of high- k alternative gate dielectrics that derive from inherent relationships…”
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Device-quality GaN–dielectric interfaces by 300 °C remote plasma processing
Published in Applied surface science (30-06-2003)“…In previous studies, device-quality Si–SiO 2 interfaces and dielectric bulk films (SiO 2) were prepared using a two-step process; (i) remote plasma-assisted…”
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Journal Article Conference Proceeding -
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Electronic structure of noncrystalline transition metal silicate and aluminate alloys
Published in Applied physics letters (17-09-2001)“…A localized molecular orbital description (LMO) for the electronic states of transition metal (TM) noncrystalline silicate and aluminate alloys establishes…”
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A spectroscopic study distinguishing between chemical phase separation with different degrees of crystallinity in Zr(Hf) silicate alloys
Published in Surface science (20-09-2004)“…Chemical phase separation at device processing temperatures is an important issue for integration of Zr and Hf silicates alloys into advanced CMOS devices…”
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Journal Article -
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Spectroscopic study of chemical phase separation in zirconium silicate alloys
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-07-2003)“…This article presents a comprehensive spectroscopic study of chemical phase separation in zirconium silicate alloys, ( ZrO 2 ) x ( SiO 2 ) 1−x , using Fourier…”
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Conference Proceeding -
13
In Situ Process Control of Trilayer Gate-Stacks on p-Germanium With 0.85-nm EOT
Published in IEEE electron device letters (01-09-2015)“…In situ spectroscopic ellipsometry was utilized in an atomic-layer-deposition (ALD) reactor for rapid and rational gate stack process optimization of the…”
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Journal Article -
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Molybdenum Atomic Layer Deposition Using MoF6 and Si2H6 as the Reactants
Published in Chemistry of materials (12-04-2011)“…Mo ALD has been demonstrated by fluorosilane elimination chemistry using MoF6 and Si2H6 as the reactants. The nucleation and growth characteristics of Mo ALD…”
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Nucleation and growth of tantalum nitride atomic layer deposition on Al 2 O 3 using TBTDET and hydrogen radicals
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2009)“…The nucleation and growth of tantalum nitride atomic layer deposition (ALD) was investigated on Al 2 O 3 ALD surfaces on silicon substrates using…”
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Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (01-07-2009)“…The nucleation and growth of tantalum nitride atomic layer deposition (ALD) was investigated on Al2O3 ALD surfaces on silicon substrates using tertbutylimino…”
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Journal Article -
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Nucleation and growth of tantalum nitride atomic layer depositionon Al 2 O 3 using TBTDET and hydrogen radicals
Published in Journal of vacuum science & technology. A, Vacuum, surfaces, and films (19-06-2009)“…The nucleation and growth of tantalum nitride atomic layer deposition (ALD) was investigated on Al 2 O 3 ALD surfaces on silicon substrates using…”
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Journal Article -
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Performance enhancement of InAsSb QW-MOSFETs with in-situ H2 plasma cleaning for gate stack formation
Published in 2015 73rd Annual Device Research Conference (DRC) (01-06-2015)“…The measured split capacitance-voltage (CV) characteristics are shown. The combination of an in-situ H 2 plasma cleaned GaSb cap with a scaled 4.5 nm thick HfO…”
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Conference Proceeding -
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Device-quality GaN-dielectric interfaces by 300DGC remote plasma processing
Published in Applied surface science (30-06-2003)“…In previous studies, device-quality Si-SiO2 interfaces and dielectric bulk films (SiO2) were prepared using a two-step process: remote plasma-assisted…”
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