Search Results - "Ravichandran, Arul"
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1
Atomic Layer Deposition of Layered Boron Nitride for Large-Area 2D Electronics
Published in ACS applied materials & interfaces (12-08-2020)“…Hexagonal boron nitride (h-BN) has been considered a promising dielectric for two-dimensional (2D) material-based electronics due to its atomically smooth and…”
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2
Low Temperature Thermal Atomic Layer Deposition of Aluminum Nitride Using Hydrazine as the Nitrogen Source
Published in Materials (31-07-2020)“…Aluminum nitride (AlN) thin films were grown using thermal atomic layer deposition in the temperature range of 175–350 °C. The thin films were deposited using…”
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3
Sub-10 nm Tunable Hybrid Dielectric Engineering on MoS2 for Two-Dimensional Material-Based Devices
Published in ACS nano (24-10-2017)“…The successful realization of high-performance 2D-materials-based nanoelectronics requires integration of high-quality dielectric films as a gate insulator. In…”
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Journal Article -
4
Ambipolar Gate Modulation Technique for the Reduction of Offset and Flicker Noise in Graphene Hall-Effect Sensors
Published in IEEE sensors journal (15-11-2021)“…There is a constant need for Hall-effect magnetic sensors with lower noise and lower offset for the high accuracy analog applications driven primarily by…”
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5
Ozone based high-temperature atomic layer deposition of SiO2 thin films
Published in Japanese Journal of Applied Physics (01-06-2020)“…In this paper, atomic layer deposition of SiO2 thin films was investigated with Si2Cl6 and O3/O2 (400 g m−3). O3/O2 is not preferred for high-temperature (>400…”
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6
Robust SiN x /GaN MIS-HEMTs With Crystalline Interfacial Layer Using Hollow Cathode PEALD
Published in IEEE electron device letters (01-08-2018)Get full text
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7
Ozone based high-temperature atomic layer deposition of SiO 2 thin films
Published in Japanese Journal of Applied Physics (01-06-2020)Get full text
Journal Article -
8
Robust SiNx/GaN MIS-HEMTs With Crystalline Interfacial Layer Using Hollow Cathode PEALD
Published in IEEE electron device letters (01-08-2018)“…In this letter, we report gallium nitride-based metal-insulator-semiconductor high-electron-mobility transistors (GaN MIS-HEMTs) with a 16-nm-thick silicon…”
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9
Evaluation and Integration of Graphene Field Effect Devices
Published 01-01-2020“…Graphene field effect devices have potential applications in emerging analogue and sensing technology. However, to use them in end applications, evaluation of…”
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Dissertation -
10
Sub-10 nm Tunable Hybrid Dielectric Engineering on MoS 2 for Two-Dimensional Material-Based Devices
Published in ACS nano (24-10-2017)“…The successful realization of high-performance 2D-materials-based nanoelectronics requires integration of high-quality dielectric films as a gate insulator. In…”
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Journal Article -
11
Plasma-Enhanced Atomic-Layer Deposition of Nanometer-Thick SiN x Films Using Trichlorodisilane for Etch-Resistant Coatings
Published in ACS applied nano materials (26-03-2021)“…In recent times, the requirements have become extremely stringent for employing silicon nitride (SiN x ) films in various types of applications. For instance,…”
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Journal Article -
12
The Graphene Field Effect Transistor: A Large Scale Integration Approach
Published 01-01-2016“…Owing to the continuous down scaling of devices as per Moore’s law and the simultaneous need to increase the processing efficiency of the transistor, graphene…”
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Dissertation