Search Results - "Ramadout, B."

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  1. 1

    Multigate MOSFET in a Bulk Technology by Integrating Polysilicon-Filled Trenches by Ramadout, B., Guo-Neng Lu, Carrere, J.-P., Pinzelli, L., Perrot, C., Rivoire, M., Nemouchi, F.

    Published in IEEE electron device letters (01-12-2009)
    “…We present a new device structure consisting of a MOSFET with two additional lateral trench gates. This multigate MOSFET can be implemented and fabricated in a…”
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    Journal Article
  2. 2

    Electrical spin injection into InGa(N)As quantum structures and single InGaAs quantum dots by Hetterich, M., Löffler, W., Fallert, J., Höpcke, N., Burger, H., Passow, T., Li, S., Daniel, B., Ramadout, B., Lupaca-Schomber, J., Hetterich, J., Litvinov, D., Gerthsen, D., Klingshirn, C., Kalt, H.

    Published in Physica Status Solidi (b) (01-11-2006)
    “…We investigate electrical spin injection from a semi‐magnetic n‐type ZnMnSe spin aligner into III–V p–i–n diodes with InGaAs quantum dots (QDs) in the active…”
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    Journal Article Conference Proceeding
  3. 3
  4. 4

    MOSFET with additional lateral trench gate by Ramadout, B., Guo-Neng Lu, Carrere, J.-P.

    “…We present a device structure consisting of a MOS transistor with additional lateral trench gate (LTG). It can be seen as two transistors with surface and…”
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    Conference Proceeding
  5. 5

    Effects of technological and geometrical parameters of a tri-gate MOSFET fabricated in a bulk technology by Ramadout, B., Lu, G.-N., Carrere, J.P., Pinzelli, L., Perrot, C., Rivoire, M., Nemouchi, F.

    “…We have investigated, by TCAD simulations, a tri-gate MOSFET fabricated in a bulk CMOS technology. By biasing both lateral-gates with the same voltage, this…”
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    Conference Proceeding