Search Results - "RICHTER, Karola"
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Focusing hard x rays beyond the critical angle of total reflection by adiabatically focusing lenses
Published in Applied physics letters (06-03-2017)“…In response to the conjecture that the numerical aperture of x-ray optics is fundamentally limited by the critical angle of total reflection [Bergemann et al.,…”
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TSV Transistor—Vertical Metal Gate FET Inside a Through Silicon VIA
Published in IEEE electron device letters (01-10-2018)“…A new vertical field-effect transistor (FET) has been fabricated inside a through silicon VIA (TSV). Front side and backside of a 200-<inline-formula>…”
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High aspect ratio pattern collapse of polymeric UV-nano-imprint molds due to cleaning
Published in Microelectronic engineering (01-10-2013)“…[Display omitted] ► Polymer molds with aspect-ratios up to 10. ► Investigation of pattern collapse due to cleaning. ► Comparison of different polymer mold…”
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Multicolor generation using silicon nanodisk absorber
Published in Applied physics letters (23-02-2015)“…A multicolored matrix that spans the visible range was demonstrated by using silicon nanodisk arrays. A nanostructured silicon substrate, which featured…”
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Novel Graphene Adjustable-Barrier Transistor with Ultra-High Current Gain
Published in ACS applied materials & interfaces (31-08-2022)“…A graphene-based three-terminal barristor device was proposed to overcome the low on/off ratios and insufficient current saturation of conventional graphene…”
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Creation of Vias With Optimized Profile for 3-D Through Silicon Interconnects (TSV)
Published in Plasma processes and polymers (01-06-2009)“…The continually growing functionality and pattern density of semiconductor devices leads to the development of innovative and cost‐effective 3‐D stacking and…”
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High aspect ratio pattern collapse of polymeric UV-nano-imprint molds due to cleaning : Nanolithography 2012
Published in Microelectronic engineering (2013)Get full text
Conference Proceeding -
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Micro-Patterned Silicon Surfaces for Biomedical Devices
Published in Plasma processes and polymers (01-04-2007)“…Actual trends in biotechnology require special chips, suitable for the immobilization of molecules. Thus, we created fields with randomly distributed silicon…”
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Positive Etch Profiles in Silicon with Improved Pattern Quality
Published in Plasma processes and polymers (01-04-2007)“…The patterning of silicon substrates is one of the most important steps for the fabrication of microelectromechanical systems (MEMS), microfluidic devices or…”
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Journal Article