Search Results - "RASKIN, J"

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  1. 1

    Modeling of Semiconductor Substrates for RF Applications: Part I-Static and Dynamic Physics of Carriers and Traps by Rack, M., Allibert, F., Raskin, J.-P.

    Published in IEEE transactions on electron devices (01-09-2021)
    “…This article aims to provide deep insight into the physics of substrates for RF applications under large-amplitude signal excitations. The impact of physical…”
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    Journal Article
  2. 2

    Modeling of Semiconductor Substrates for RF Applications: Part II-Parameter Impact on Harmonic Distortion by Rack, M., Allibert, F., Raskin, J.-P.

    Published in IEEE transactions on electron devices (01-09-2021)
    “…This article presents the accurate modeling results of the nonlinear behavior of a wide range of silicon-based substrates at RF. The TCAD-based model includes…”
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    Journal Article
  3. 3

    Low-Loss Si-Substrates Enhanced Using Buried PN Junctions for RF Applications by Rack, M., Nyssens, L., Raskin, J.-P.

    Published in IEEE electron device letters (01-05-2019)
    “…A novel method for increasing the effective resistivity in low-doped silicon substrates is presented. By creating a chain series of p-n depletion junctions…”
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    Journal Article
  4. 4

    Extrinsic mechanical size effects in thin ZrNi metallic glass films by Ghidelli, M., Gravier, S., Blandin, J.-J., Djemia, P., Mompiou, F., Abadias, G., Raskin, J.-P., Pardoen, T.

    Published in Acta materialia (01-05-2015)
    “…Mechanical size effects in ZrxNi100−x thin metallic glass films are investigated for thicknesses from 200 to 900nm. Local order, elastic properties and rate…”
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    Journal Article
  5. 5

    Inter- and intragranular plasticity mechanisms in ultrafine-grained Al thin films: An in situ TEM study by Mompiou, F., Legros, M., Boé, A., Coulombier, M., Raskin, J.-P., Pardoen, T.

    Published in Acta materialia (01-01-2013)
    “…The nature of the elementary deformation mechanisms in small-grained metals has been the subject of numerous recent studies. In the submicron range, mechanisms…”
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  6. 6

    On the Separate Extraction of Self-Heating and Substrate Effects in FD-SOI MOSFET by Nyssens, Lucas, Rack, M., Halder, A., Raskin, J.-P., Kilchytska, V.

    Published in IEEE electron device letters (01-05-2021)
    “…This paper proposes an original approach to separately characterize self-heating and substrate effects in Fully-Depleted Silicon-on-Insulator (FD-SOI) devices…”
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    Journal Article
  7. 7

    Crack on a chip test method for thin freestanding films by Jaddi, S., Coulombier, M., Raskin, J.-P., Pardoen, T.

    “…Fracture mechanics has been applied for more than two decades to various configurations of cracks in films on substrate. Fracture toughness data are indeed…”
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    Journal Article
  8. 8

    Twisted Bi-Layer Graphene: Microscopic Rainbows by Campos-Delgado, J., Algara-Siller, G., Santos, C. N., Kaiser, U., Raskin, J.-P.

    “…Blue, pink, and yellow colorations appear from twisted bi‐layer graphene (tBLG) when transferred to a SiO2/Si substrate (SiO2 = 100 nm‐thick). Raman and…”
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    Journal Article
  9. 9

    Novel class of nanostructured metallic glass films with superior and tunable mechanical properties by Ghidelli, M., Orekhov, A., Bassi, A. Li, Terraneo, G., Djemia, P., Abadias, G., Nord, M., Béché, A., Gauquelin, N., Verbeeck, J., Raskin, J.-P., Schryvers, D., Pardoen, T., Idrissi, H.

    Published in Acta materialia (01-07-2021)
    “…A novel class of nanostructured Zr50Cu50 (%at.) metallic glass films with superior and tunable mechanical properties is produced by pulsed laser deposition…”
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  10. 10

    Inkjet-printed frequency-selective surfaces based on carbon nanotubes for ultra-wideband thin microwave absorbers by Jaiswar, R., Mederos-Henry, F., Dupont, V., Hermans, S., Raskin, J. -P., Huynen, I.

    “…A microwave absorber combining frequency-selective surfaces (FSSs) and dielectric layers is presented. FSSs are printed on dielectric layers using a resistive…”
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    Journal Article
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    A randomized controlled trial of duloxetine in diabetic peripheral neuropathic pain by WERNICKE, J. F, PRITCHETT, Y. L, D'SOUZA, D. N, WANINGER, A, TRAN, P, IYENGAR, S, RASKIN, J

    Published in Neurology (24-10-2006)
    “…Serotonin (5-HT) and norepinephrine (NE) are involved in pain modulation via descending inhibitory pathways in the brain and spinal cord. To assess the…”
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  12. 12

    Dislocation-mediated relaxation in nanograined columnar palladium films revealed by on-chip time-resolved HRTEM testing by Colla, M. -S., Amin-Ahmadi, B., Idrissi, H., Malet, L., Godet, S., Raskin, J. -P., Schryvers, D., Pardoen, T.

    Published in Nature communications (05-01-2015)
    “…The high-rate sensitivity of nanostructured metallic materials demonstrated in the recent literature is related to the predominance of thermally activated…”
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    Journal Article
  13. 13

    UTBB SOI MOSFETs analog figures of merit: Effects of ground plane and asymmetric double-gate regime by Md Arshad, M.K., Makovejev, S., Olsen, S., Andrieu, F., Raskin, J.-P., Flandre, D., Kilchytska, V.

    Published in Solid-state electronics (01-12-2013)
    “…► GP introduction has only marginal effect on UTBB MOSFET analog FoM (slightly higher body factor in devices with GP).► ADG (i.e. front- to back-gate shorten)…”
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    Journal Article Conference Proceeding
  14. 14

    Adhesionless and near-ideal contact behavior of graphene on Cu thin film by Hammad, M., Adjizian, J.-J., Sacré, C.-H., Huet, B., Charlier, J.-C., Raskin, J.-P., Pardoen, T.

    Published in Carbon (New York) (01-10-2017)
    “…Graphene coatings reduce surface adhesion owing to a low surface energy. In the present work, a single CVD-grown graphene layer on Cu is shown to modify the…”
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    High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model by Colla, M.-S., Wang, B., Idrissi, H., Schryvers, D., Raskin, J.-P., Pardoen, T.

    Published in Acta materialia (01-02-2012)
    “…The mechanical behaviour of thin nanocrystalline palladium films with an ∼30nm in plane grain size has been characterized on chip under uniaxial tension. The…”
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    Journal Article
  17. 17

    Effect of parasitic elements on UTBB FD SOI MOSFETs RF figures of merit by Md Arshad, M.K., Kilchytska, V., Emam, M., Andrieu, F., Flandre, D., Raskin, J.-P.

    Published in Solid-state electronics (01-07-2014)
    “…•Parasitic elements significantly impact the RF performances of UTBB devices especially in short channel devices.•UTBB devices are capable to meet the ITRS…”
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    Journal Article
  18. 18

    Ellipsometry-based conductivity extraction in case of phosphorus doped polysilicon by Kemiha, A., Birouk, B., Raskin, J.-P.

    “…In this work, we investigated a new method for thin films electrical conductivity extraction based on spectroscopic ellipsometry. This has been enabled through…”
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  19. 19

    High-resistivity with PN interface passivation in 22 nm FD-SOI technology for low-loss passives at RF and millimeter-wave frequencies by Nyssens, L., Rack, M., Nabet, M., Schwan, C., Zhao, Z., Lehmann, S., Herrmann, T., Henke, D., Kondrat, A., Soonekindt, C., Koch, F., Kache, T., Kini, D.P., Zimmerhackl, O., Allibert, F., Aulnette, C., Lederer, D., Raskin, J.-P.

    Published in Solid-state electronics (01-07-2023)
    “…•Parasitic surface conduction of high-resistivity substrates degrades RF performance of substrates.•PN interface passivation solution to counter PSC effect on…”
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    Journal Article
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