Search Results - "Quesnel, David J."

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  1. 1

    Behavior of β phase (Al3Mg2) in AA 5083 during friction stir welding by Choi, Don-Hyun, Ahn, Byung-Wook, Quesnel, David J., Jung, Seung-Boo

    Published in Intermetallics (01-04-2013)
    “…Friction stir welds of aluminum alloy 5083 are created at tool rotation speeds of 700, 1050, and 1600 rpm, with a fixed traveling speed of 100 mm/min. Stir…”
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    Journal Article
  2. 2

    Enhancement of the Stress Corrosion Sensitivity of AA5083 by Heat Treatment by Gao, Jie, Quesnel, David J.

    “…In this study, the stress corrosion cracking (SCC) resistance of AA5083 is intentionally degraded by a series of progressively longer annealing treatments at…”
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    Journal Article
  3. 3

    Investigation of Oxygen Evolution Reaction at LaRuO3, La3.5Ru4O13, and La2RuO5 by Abreu-Sepulveda, Maria, Trinh, Phong, Malkhandi, S., Narayanan, S.R., Jorné, Jacob, Quesnel, David J., Postonr, James A., Manivannan, A.

    Published in Electrochimica acta (20-10-2015)
    “…Development of electrocatalysts is important for reducing the voltage loss due to the oxygen evolution reaction (OER) in metal-air batteries and water…”
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    Journal Article
  4. 4

    Effects of NaCl, pH, and Potential on the Static Creep Behavior of AA1100 by Wan, Quanhe, Quesnel, David J.

    “…The creep rates of AA1100 are measured during exposure to a variety of aggressive environments. NaCl solutions of various concentrations have no influence on…”
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  5. 5

    Molecular automation: a new kind of simulation applied to ionic solutions by Quesnel, David J., Zhang, Yingrui

    Published in Physics and chemistry of liquids (01-01-2012)
    “…Physical chemistry originates from the repetitive application of simple rules of interaction between species. Nature's simple rules cause complex outcomes to…”
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  6. 6

    Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application by Kim, Dae-Gon, Kim, Jong-Woong, Lee, Jung-Goo, Mori, Hirotaro, Quesnel, David J., Jung, Seung-Boo

    Published in Journal of alloys and compounds (31-05-2005)
    “…The interfacial microstructure of Sn–37Pb solder with immersion Au/electroless Ni–P under bump metallization (UBM) was studied using scanning electron…”
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    Journal Article
  7. 7

    Effect of Young's Modulus on the Detachment Force of 7 μm Particles by Dejesus, M. Cristina, Rimai, Donald S, Quesnel, David J

    Published in Langmuir (17-01-2006)
    “…The detachment force of ground, 7-μm-diameter polyester particles overcoated with clusters of silica having a cluster radius of approximately 100 nm from…”
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    Journal Article
  8. 8

    Electrochemical and Mechanical Properties of Sodium-Ion Conducting Cross-Linked Polymer Gel Electrolyte by Xue, Yuan, Li, Xiang, Quesnel, David J.

    “…The free radical polymerization of cross-linked poly(methyl methacrylate) (PMMA) polymer gel electrolyte (PGE) for sodium-ion transport exhibits high ionic…”
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  9. 9

    Finite Element Modeling of Particle Adhesion: A Surface Energy Formalism by Quesnel, David J., Rimai, Donald S.

    Published in The Journal of adhesion (01-12-2000)
    “…The adhesion of particles is modeled with finite element analysis using an energy approach comparable with that used in the JKR formalism. The strain energy of…”
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  10. 10
  11. 11

    Interaction of process variables with the fracture behavior of amorphous polystyrene during attrition by Kubisiak, Michael P., Quesnel, David J.

    Published in Polymer engineering and science (01-09-1996)
    “…This study investigates the fracture of oriented general‐purpose polystyrene. Specimen microstructure was controlled using an extrusion‐sheeting technique…”
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  12. 12

    Effect of Young's modulus on the detachment force of 7 microm particles by Dejesus, M Cristina, Rimai, Donald S, Quesnel, David J

    Published in Langmuir (17-01-2006)
    “…The detachment force of ground, 7-microm-diameter polyester particles overcoated with clusters of silica having a cluster radius of approximately 100 nm from…”
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    Journal Article
  13. 13

    Mode I fracture toughness testing of eutectic Sn-Pb solder joints by PRATT, R. E, STROMSWOLD, E. I, QUESNEL, D. J

    Published in Journal of electronic materials (01-04-1994)
    “…The mode-I plane strain fracture toughness of Cu/63Sn-37Pb solder joints was measured using a technique based upon the ASTM standard methods for fracture…”
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  14. 14

    Friability and crushing strength of micrometer-size diamond abrasives used in microgrinding of optical glass by YIYANG ZHOU, TAKAHASHI, T, QUESNEL, D. J, FUNKENBUSCH, P. D

    “…In abrasive grinding, the properties of the abrasives and their response to impact loading play a significant role in determining the results achieveable. For…”
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  15. 15

    Molecular statics of polymer configurations by Quesnel, David J., Mazlout, Lazhar

    Published in Journal of materials research (01-12-1988)
    “…Molecular behaviors of single isolated chains of various lengths are simulated using four energy potentials: the twisting, bending, stretching, and Van der…”
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  16. 16

    Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints by Pratt, R.E., Stromswold, E.I., Quesnel, D.J.

    “…The mode I chevron notch fracture toughness of Cu/63Sn-37Pb solder joints was measured as a function of solid state copper-tin intermetallic growth at the…”
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