Search Results - "Qinghu Cui"

Impact wear mechanism of 2Cr13 steel under small stress multi-impact conditions by Wang, Shifu, Cui, Qinghu, Zou, Jinping, Zhang, Zheng

“…The current study investigates the impact wear mechanism of 2Cr13 steel under small stress multi-impact (SSMI) conditions. Self-made cyclic impact equipment,…”
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Self‐learning energy management for plug‐in hybrid electric bus considering expert experience and generalization performance by Guo, Hongqiang, Zhao, Fengrui, Guo, Hongliang, Cui, Qinghu, Du, Erlei, Zhang, Kun

“…Summary A self‐learning energy management is proposed for plug‐in hybrid electric bus, by combining Q‐Learning (QL) and Pontryagin's minimum principle…”
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Low cycle fatigue behavior of AlSi10Mg(Cu) alloy at high temperature by Cai, Cheng, Geng, Huifang, Cui, Qinghu, Wang, Shifu, Zhang, Zheng

“…Low cycle fatigue (LCF) behavior of AlSi10Mg(Cu) alloy was investigated at 100 °C and 250 °C over a range of strain amplitude from 0.25% to 0.40%. Cycle stress…”
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Design and optimization of redistribution layer (RDL) on TSV interposer for high frequency applications by Qinghu Cui, Xin Sun, Yunhui Zhu, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin

“…The fabrication of redistribution layer (RDL) for TSV 3D integration and its optimization are presented in this paper. BCB is selected as the passivation layer…”
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Electrical characterization of cylindrical and annular TSV for combined application thereof by Xin Sun, Qinghu Cui, Yunhui Zhu, Zhiyuan Zhu, Min Miao, Jing Chen, Yufeng Jin

“…In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process…”
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Effect of additives on copper electroplating profile for TSV filling by Yunhui Zhu, Yuan Bian, Xin Sun, Shenglin Ma, Qinghu Cui, Xiao Zhong, Jing Chen, Min Miao, Yufeng Jin

“…3D integration with TSVs is emerging as a promising technology for the next generation integrated circuits. TSV filling is a critical process in TSV…”
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Understanding effect of additives in copper electroplating filling for through silicon via by Min Miao, Yunhui Zhu, Yuan Bian, Xin Sun, Shenglin Ma, Qinghu Cui, Xiao Zhong, Runiu Fang, Jing Chen, Yufeng Jin

“…3D integration with TSVs (Through Silicon Via) is emerging as a promising technology for the next generation integrated circuits. Copper electroplating is one…”
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Process development of a stacked chip module with TSV interconnection by Xiao Zhong, Shenglin Ma, Yunhui Zhu, Yuan Bian, Xin Sun, Qinghu Cui, Min Miao, Jing Chen, Yufeng Jin

“…In this paper, a novel 3D integration process named Via-Backside-Release process, abbreviated as VBR process, is proposed and technical issues are addressed…”
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Process development of multi-layer stacked chip module by Shenglin Ma, Xin Sun, Yunhui Zhu, Wenping Kang, Qinghu Cui, Min Miao, Jin Chen, Yufeng Jin

“…In this paper, at first electroplating of copper and tin is optimized to fabricate micro-bump. Chip-to-chip bonding process is developed. Then, a temporary…”
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Design and process development of a stacked SRAM memory chip module with TSV interconnection by Shenglin Ma, Xin Sun, Yunhui Zhu, Zhiyuan Zhu, Qinghu Cui, Meng Chen, Yongqiang Xiao, Jing Chen, Min Miao, Wengao Lu, Yufeng Jin

“…In this paper, a stacked SRAM chip module is presented and simulation results are demonstrated. A novel 3D integration process is presented and challenging…”
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Design and fabrication of a novel monolithic integration structure for un-cooled infrared focal plane array and readout IC by Shenglin Ma, Xin Sun, Yunhui Zhu, Qinghu Cui, Yufeng Jin, Xiaomei Yu, Jing Chen, Min Miao

“…In this paper, a monolithic integration structure with TSV interconnections is introduced for un-cooled infrared FPA to do easy wafer-level-package. Firstly,…”
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Development of a through-stack-via integrated SRAM module by Yunhui Zhu, Xin Sun, Shenglin Ma, Qinghu Cui, Xiao Zhong, Yuan Bian, Meng Chen, Yongqiang Xiao, Runiu Fang, Zhenhua Liu, Zhiyuan Zhu, Xin Gong, Jing Chen, Min Miao, Wengao Lu, Yufeng Jin

“…In this paper, a through-stack-via integration process for SRAM module was developed using wafer level pre-patterned BCB bonding. A SRAM module with a built-in…”
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Sign language translation system based on micro-inertial measurement units and ZigBee network by Shi, Guangyi, Li, Zhi, Tu, Keke, Jia, Songtao, Cui, Qinghu, Jin, Yufeng

“…Chinese sign language has been proved as an effective communication tool for deaf people. In this paper, we present a novel translation system, which can…”
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Design and fabrication of a TSV interposer for SRAM integration by Yunhui Zhu, Shenglin Ma, Qinghu Cui, Wenping Kang, Zhiyuan Zhu, Xin Sun, Guanjiang Wang, Mengmeng Zhang, Jing Chen, Min Miao, Yufeng Jin

“…TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple…”
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Process development and characterization of BCB-based redistribution layer (RDL) for silicon interposer application by Sun, Xin, Cui, Qinghu, Zhu, Yunhui, Ma, Shenglin, Chen, Jing, Miao, Min, Jin, Yufeng

“…Redistribution layer (RDL) is necessary for electric interconnection of TSV-based 3D stacking applications. Fabrication process and electrical measurement of…”
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A TSV last integration approach with wafer level pre-patterned adhesive bonding by Zhu, Yunhui, Ma, Shenglin, Sun, Xin, Cui, Qinghu, Zhong, Xiao, Bian, Yuan, Chen, Jing, Miao, Min, Jin, Yufeng

“…In this paper, a TSV last wafer level 3D integration scheme using pre-patterned benzocyclobutene (BCB) adhesive bonding was proposed. With pre-patterned BCB…”
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