Design and Integration Technology for Miniature Medical Microsystems

The electronic subsystem of wearable and implantable devices is constructed using board-level and package-level integration technology and this limits the achievable miniaturization. We will show that this limitation can be overcome by emerging wafer-level integration methods such as chip-in-wire te...

Full description

Bibliographic Details

Published in:	2008 IEEE International Electron Devices Meeting pp. 1 - 4
Main Authors:	Van Hoof, C., Neves, H., Aarts, A.A.A., Iker, F., Soussan, P., Gonzalez, M., Beyne, E., Vanfleteren, J., Puers, R.P., De Moor, P.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-12-2008
Subjects:	Biomedical monitoring Capacitive sensors Cochlear implants Dielectric materials Electrodes Electronics packaging Integrated circuit interconnections Integrated circuit technology Space technology Wafer scale integration
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!