Search Results - "Pucha, R."

A striking relationship between dust extinction and radio detection in DESI QSOs: evidence for a dusty blow-out phase in red QSOs by Fawcett, V A, Alexander, D M, Brodzeller, A, Edge, A C, Rosario, D J, Myers, A D, Aguilar, J, Ahlen, S, Alfarsy, R, Brooks, D, Canning, R, Circosta, C, Dawson, K, de la Macorra, A, Doel, P, Fanning, K, Font-Ribera, A, Forero-Romero, J E, Gontcho A Gontcho, S, Guy, J, Harrison, C M, Honscheid, K, Juneau, S, Kehoe, R, Kisner, T, Kremin, A, Landriau, M, Manera, M, Meisner, A M, Miquel, R, Moustakas, J, Nie, J, Percival, W J, Poppett, C, Pucha, R, Rossi, G, Schlegel, D, Siudek, M, Tarlé, G, Weaver, B A, Zhou, Z, Zou, H

“…ABSTRACT We present the first eight months of data from our secondary target programme within the ongoing Dark Energy Spectroscopic Instrument (DESI) survey…”
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Overview of the Instrumentation for the Dark Energy Spectroscopic Instrument by Abareshi, B., Ahlen, S., Alam, Shadab, Balaguera-Antolínez, A., Baltay, C., Bault, A., Besuner, R., Blake, C., Brodzeller, A., Buckley-Geer, E., Carnero Rosell, A., Casas, R., Castander, F. J., Chaussidon, E., Circosta, C., Cole, S., Cooper, A. P., de la Cruz-Noriega, R., de Mattia, A., Dey, A., Doel, P., Donaldson, J., Douglass, K., Edelstein, J., Escoffier, S., Evatt, M., Fagrelius, P., Fan, X., Fanning, K., Forero-Romero, J. E., Gerardi, F., Gonzalez-de-Rivera, G., Gonzalez-Perez, V., Grove, C., Guy, J., Hahn, C., Honscheid, K., Iršič, V., Jullo, E., Karim, T., Kitaura, F., Kremin, A., Lahav, O., Lamman, C., Landriau, M., Lange, J. U., Leauthaud, A., Le Van Suu, A., Levi, Michael E., Magneville, C., Marshall, B., Martini, Paul, McDonald, P., Meneses-Rizo, J., Mezcua, M., Miquel, R., Moon, J., Muñoz-Gutiérrez, Andrea, Nadathur, S., Niz, G., Noriega, Hernán E., Palanque-Delabrouille, N., Palmese, A., Zhiwei, P., PENG, X., Percival, W. J., Perruchot, S., Pogge, R., Porredon, A., Prada, F., Ramírez-Pérez, César, Reil, K., Rezaie, M., Roe, N. A., Rossi, G., Ruhlmann-Kleider, V., Sabiu, C. G., Saintonge, A., Samushia, L., Saulder, C., Schaan, E., Schubnell, M., Seo, H., Sharples, Ray M., Sholl, Michael J., Silber, Joseph Harry, Tarlé, Gregory, Tie, Suk Sien, Vargas-Magaña, M., Verde, L., Wang, B., Wang, M. S., Wechsler, R., Wilson, Michael J., Yang, J., Zhao, Cheng, Zhou, Rongpu, Zhou, Zhimin, Zou, J., Zu, Y.

“…Abstract The Dark Energy Spectroscopic Instrument (DESI) embarked on an ambitious 5 yr survey in 2021 May to explore the nature of dark energy with…”
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Validation of the Scientific Program for the Dark Energy Spectroscopic Instrument by Ahlen, S., Alam, S., Aldering, G., Alvarez, M., Anand, A., Asorey, J., Avila, S., Aviles, A., Ballester, O., Baltay, C., Bault, A., BenZvi, S., Bermejo-Climent, J. R., Beutler, F., Blake, C., Bolton, A. S., Cai, Z., Canning, R., Cervantes-Cota, J. L., Chabanier, S., Chaussidon, E., Chaves-Montero, J., Chen, X., Chuang, C., Davis, T. M., Dawson, K., de la Macorra, A., de Mattia, A., DeRose, J., Douglass, K., Edge, A., Elliott, A., Fan, X., Ferraro, S., Forero-Romero, J. E., García-Bellido, J., Golden-Marx, J., Gonzalez-Perez, V., Gordon, C., Gruen, D., Han, J. J., Herrera-Alcantar, H. K., Hou, J., Howlett, C., Iršič, V., Jing, Y. P., Joudaki, S., Jullo, E., Juneau, S., Karim, T., Kehoe, R., Khederlarian, A., Kneib, J., Koposov, S. E., Kovács, A., Krolewski, A., L’Huillier, B., Magneville, C., Manser, C. J., Margala, D., Medina, G. E., Meisner, A., Meneses-Rizo, J., Moustakas, J., Nadathur, S., Neveux, R., Niz, G., Palmese, A., Zhiwei, P., Penmetsa, S., Pérez-Fernández, A., Pucha, R., Raichoor, A., Ramírez-Pérez, C., Ravoux, C., Said, K., Saintonge, A., Schlegel, D., Seo, H., Siudek, M., Slepian, Z., Sprayberry, D., Suárez-Pérez, J., Tan, T., Tojeiro, R., Ureña-López, L. A., Vaisakh, R., Variu, A., Verde, L., Wang, B., Weaverdyck, N., Xie, Y., Yèche, C., Yuan, S., Zhao, C., Zheng, Z., Zhou, Z., Zou, H., Zou, S., Zu, Y.

“…Abstract The Dark Energy Spectroscopic Instrument (DESI) was designed to conduct a survey covering 14,000 deg 2 over 5 yr to constrain the cosmic expansion…”
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An enhanced constitutive material model for machining of Ti–6Al–4V alloy by Liu, Rui, Melkote, Shreyes, Pucha, Raghuram, Morehouse, John, Man, Xiaolin, Marusich, Troy

“…Material failure due to adiabatic shear banding is a characteristic feature of chip formation in machining of Ti–6Al–4V material. In this paper, an enhanced…”
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The Early Data Release of the Dark Energy Spectroscopic Instrument by Ahlen, S., Alvarez, M., Anand, A., Asorey, J., Avila, S., Aviles, A., Baltay, C., Bault, A., BenZvi, S., Bermejo-Climent, J. R., Beutler, F., Blake, C., Blum, R., Cai, Z., Castander, F. J., Cervantes-Cota, J. L., Chabanier, S., Chaussidon, E., Chaves-Montero, J., Chuang, C., Cole, S., Davis, T. M., Della Costa, J., Demina, R., Doel, P., Doshi, R., Douglass, K., Escoffier, S., Fagrelius, P., Fanning, K., Forero-Romero, J. E., Forero-Sánchez, D., Gänsicke, B. T., Golden-Marx, J., Gontcho A Gontcho, S., Graur, O., Gruen, D., Guy, J., Huterer, D., Jacques, A., Jana, A., Jullo, E., Juneau, S., Karaçaylı, N. G., Kitaura, F., Kneib, J., Kovács, A., Landriau, M., Lasker, J., Leauthaud, A., Le Guillou, L., Li, T. S., Linder, E., Manser, C. J., Margala, D., McDonald, P., Mena-Fernández, J., Miquel, R., Moustakas, J., Mueller, E., Mundet, J., Nadathur, S., Napolitano, L., Newman, J. A., Nie, J., Paillas, E., Parkinson, D., Penmetsa, S., Pérez-Fernández, A., Pérez-Ràfols, I., Pieri, M., Ramírez-Pérez, C., Ramirez-Solano, S., Ross, A. J., Sabiu, C. G., Said, K., Saintonge, A., Schaan, E., Schubnell, M., Sharples, R., Silber, J., Siudek, M., Slepian, Z., Soumagnac, M. T., Suárez-Pérez, J., Tan, T., Vaisakh, R., Valdes, F., Walther, M., Wang, B., Wang, M. S., Wechsler, R. H., Yang, J., Yuan, S., Zhang, Z., Zhao, C., Zheng, Z., Zhou, Z., Zou, H., Zu, Y.

“…Abstract The Dark Energy Spectroscopic Instrument (DESI) completed its 5 month Survey Validation in 2021 May. Spectra of stellar and extragalactic targets from…”
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Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages by Pucha, Raghuram, Pyland, James, Sitaraman, Suresh K.

“…The accumulated equivalent inelastic strain per cycle and the maximum strain energy density over one cycle have been used as damage metrics to map the solder…”
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Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures by Pucha, Raghuram V, Ramakrishna, Gnyaneshwar, Mahalingam, Saketh, Sitaraman, Suresh K

“…Copper microvias play a key role as electrical interconnects in high density wiring substrates used in microsystems packaging. These microvia structures…”
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Thermomechanical reliability of underfilled BGA packages by Pyland, J., Pucha, R.V., Sitararnan, S.K.

“…The effect of underfill on various thermomechanical reliability issues in super ball grid array (SBGA) packages is studied in this paper. Nonlinear finite…”
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Effect of underfill on BGA reliability by Pyland, J., Raghuram Pucha, Suresh Sitaraman

“…The effect of underfill on various thermo-mechanical reliability issues in SBGA (super ball grid array) packages is studied in this paper. Non-linear finite…”
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Thermomechanical reliability of high density wiring substrates by Hedge, S., Pucha, R.V., Takahashi, A., Takano, N., Sitaraman, S.K.

“…The thermomechanical response of multi-layered high density wiring (HDW) substrates is influenced by various material and geometrical parameters. This study…”
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Effect of underfill on BGA reliability by Pyland, J., Pucha, R., Sitaraman, S.

“…The effect of underfill on various thermomechanical reliability issues in SBGA (super ball grid array) packages is studied in this paper. Nonlinear finite…”
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Does underfilling enhance BGA reliability? by Pyland, J., Pucha, R., Sitaram, S.

“…The effect of underfill on various thermomechanical reliability issues in SBGA (super ball grid array) packages is studied in this paper. Nonlinear finite…”
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Value Added Catalog of physical properties of more than 1.3 million galaxies from the DESI Survey by Siudek, M, Pucha, R, Mezcua, M, Juneau, S, Aguilar, J, Ahlen, S, Brooks, D, Circosta, C, Claybaugh, T, Cole, S, Dawson, K, de la Macorra, A, Dey, Arjun, Dey, Biprateep, Doel, P, Font-Ribera, A, Forero-Romero, J. E, Gaztañaga, E, Gontcho, S. Gontcho A, Gutierrez, G, Honscheid, K, Howlett, C, Ishak, M, Kehoe, R, Kirkby, D, Kisner, T, Kremin, A, Lambert, A, Landriau, M, Guillou, L. Le, Manera, M, Martini, P, Meisner, A, Miquel, R, Moustakas, J, Newman, J. A, Niz, G, Pan, Z, Percival, W. J, Poppett, C, Prada, F, Rossi, G, Saintonge, A, Sanchez, E, Schlegel, D, Scholte, D, Schubnell, M, Seo, H, Speranza, F, Sprayberry, D, Tarle, G, Weaver, B. A, Zou, H

“…Aims. We present an extensive catalog of the physical properties of more than a million galaxies within the Dark Energy Spectroscopic Instrument (DESI), one of…”
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Identifying Quasars from the DESI Bright Galaxy Survey by Juneau, S, Canning, R, Alexander, D. M, Pucha, R, Fawcett, V. A, Myers, A. D, Moustakas, J, Ruiz-Macias, O, Cole, S, Pan, Z, Aguilar, J, Ahlen, S, Alam, S, Bailey, S, Brooks, D, Chaussidon, E, Circosta, C, Claybaugh, T, Dawson, K, de la Macorra, A, Dey, Arjun, Doel, P, Fanning, K, Forero-Romero, J. E, Gaztañaga, E, Gontcho, S. Gontcho A, Gutierrez, G, Hahn, C, Honscheid, K, Kehoe, R, Kisner, T, Kremin, A, Lambert, A, Landriau, M, Guillou, L. Le, Manera, M, Martini, P, Meisner, A, Miquel, R, Muñoz-Gutiérrez, A, Nie, J, Palanque-Delabrouille, N, Percival, W. J, Poppett, C, Prada, F, Ravoux, C, Rezaie, M, Rossi, G, Sanchez, E, Schlafly, E. F, Schlegel, D, Schubnell, M, Seo, H, Silber, J, Siudek, M, Sprayberry, D, Tarlé, G, Zhou, Z, Zou, H

“…The Dark Energy Spectroscopic Instrument (DESI) cosmology survey includes a Bright Galaxy Survey (BGS) which will yield spectra for over ten million bright…”
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A striking relationship between dust extinction and radio detection in DESI QSOs: evidence for a dusty blow-out phase in red QSOs by Fawcett, V. A, Alexander, D. M, Brodzeller, A, Edge, A. C, Rosario, D. J, Myers, A. D, Aguilar, J, Ahlen, S, Alfarsy, R, Brooks, D, Canning, R, Circosta, C, Dawson, K, de la Macorra, A, Doel, P, Fanning, K, Font-Ribera, A, Forero-Romero, J. E, Gontcho, S. Gontcho A, Guy, J, Harrison, C. M, Honscheid, K, Juneau, S, Kehoe, R, Kisner, T, Kremin, A, Landriau, M, Manera, M, Meisner, A. M, Miquel, R, Moustakas, J, Nie, J, Percival, W. J, Poppett, C, Pucha, R, Rossi, G, Schlegel, D, Siudek, M, Tarlé, G, Weaver, B. A, Zhou, Z, Zou, H

“…We present the first eight months of data from our secondary target program within the ongoing Dark Energy Spectroscopic Instrument (DESI) survey. Our program…”
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Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias by Sukumaran, V., Bandyopadhyay, T., Chen, Q., Kumbhat, N., Liu, F., Pucha, R., Sato, Y., Watanabe, M., Kitaoka, K., Ono, M., Suzuki, Y., Karoui, C., Nopper, C., Swaminathan, M., Sundaram, V., Tummala, R.

“…This paper demonstrates thin glass interposers with fine pitch through package vias (TPV) as a low cost and high I/O substrate for 3D integration. Interposers…”
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System-level reliability assessment of mixed-signal convergent microsystems by Pucha, R.V., Hegde, S., Damani, M., Tunga, K., Perkins, A., Mahalingam, S., Ramakrishna, G., Lo, G.C., Klein, K., Ahmad, J., Sitaraman, S.K.

“…The next-generation convergent microsystems, based on system-on-package (SOP) technology, require up-front system-level design-for-reliability approaches and…”
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Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates by Lee, K.J., Damani, M., Pucha, R.V., Bhattacharya, S.K., Tummala, R.R., Sitaraman, S.K.

“…Understanding and quantifying the RLC characteristics of the embedded passives under thermomechanical deformation during fabrication and accelerated thermal…”
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Design and demonstration of low cost, panel-based polycrystalline silicon interposer with through-package-vias (TPVs) by Qiao Chen, Bandyopadhyay, T., Suzuki, Y., Fuhan Liu, Sundaram, V., Pucha, R., Swaminathan, M., Tummala, R.

“…This paper for the first time proposes and demonstrates the use of panel-based polycrystalline silicon interposers for highest I/Os at lowest cost. Such an…”
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Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections by Mishra, D., Raj, P. M., Khan, S., Kumbhat, N., Yushu Wang, Addya, S., Pucha, R. V., Choudhury, A., Sundaram, V., Tummala, R.

“…The trend towards thinner packages with embedded active components in case of RF modules, and higher I/O densities in case of multicore processors or 3D ICs,…”
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