Search Results - "Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE)"

Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate by Geczy, A., Lener, V., Hajdu, I., Illyefalvi-Vitez, Z.

“…The applicability of decomposable biopolymer (polylactide - PLA) as Printed Wiring Board (PWB) substrate was investigated. A novel approach for low temperature…”
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Comparing the intermetallic layer formation of Infrared and Vapour Phase soldering by Krammer, O., Garami, T.

“…In our experiment the intermetallic layer (IML) formation during Infrared (IR) and Vapour Phase (VP) soldering was investigated. A testboard was designed, onto…”
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Boundary value of rheological properties of solder paste by Pietrikova, A., Kravcik, M.

“…This work has been focused on viscosity and rheological measurement of some solder pastes as non-Newtonian. The results of the analysis show that increasing…”
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The ontology based FMEA of lead free soldering process by Molhanec, M., Zhuravskaya, O., Povolotskaya, E., Tarba, L.

“…The idea behind of the paper is aimed to improve FMEA (Failure mode and Effects Analysis) process in the field of reflow lead free soldering with using the…”
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A comparison between Sepic and Buck-Boost converters used in maximum power point trackers by Patarau, T., Daraban, S. R., Petreus, D., Etz, R.

“…This paper presents a comparison between an analog compensated Sepic converter and a step down - step up converter (Buck-Boost) in a novel maximum power point…”
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Sensor system of detecting defects in wheels of railway vehicles running at operational speed by Nenov, N., Dimitrov, E., Vasilev, V., Piskulev, P.

“…A number of deviations from the theoretical idea of the expected mechanical interaction between railway vehicles and track are observed in the real operation…”
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Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model by Plotog, I., Mihailescu, B., Pencea, I., Branzei, M., Svasta, P., Cucu, T., Tarcolea, M.

“…In the case of surface mount technology (SMT), the 4P Soldering Process [1, 2, 3] concept defines solder joints as result of synergistic interactions and of…”
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Reliability of SnAgCu solder joints during vibration in various temperature by Matkowski, P.

“…The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (-40…”
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Application of copper-Carbon Nanotubes composite in packaging interconnects by Aryasomayajula, L., Rieske, R., Wolter, K.

“…This paper concentrates on the work done on utilizing Carbon Nanotubes (CNTs) for Electronic Packaging. CNTs have been utilized in various aspects of…”
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Finite element modeling on thermal fatigue of BGA solder joints with multiple voids by Schwerz, R., Meyer, S., Roellig, M., Meier, K., Wolter, K.

“…The electronics industry strives for miniaturization and diversification of functionality while the demand for reliability of electronic components strongly…”
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Correlations between mechanical and electrical parameters of modified electrically conductive adhesives by Busek, D., Selepova, J., Mach, P.

“…In our previous research, only electrical properties in dependence on different substrates and after various straining were measured or only mechanical…”
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Assembly and interconnection technologies for MID based on thermally conductive plastics for heat dissipation by Hoerber, J., Mueller, M., Franke, J., Ranft, F., Heinle, C., Drummer, D.

“…The present study aims to display new opportunities for Molded Interconnect Devices by using thermally conductive thermoplastics as substrate materials…”
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Contact resistance in Polytriarylamine based organic transistors by Bonea, A., Bonfert, D., Svasta, P.

“…The paper aims to describe the simulations and measurements performed in order to determine the resistance of source and drain contacts of organic transistors…”
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Inkjet printed electrically conductive structures for microelectronics by Felba, J.

“…Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet…”
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Modelling and simulation of sensors for position control for hydraulic mechatronic systems by Drumea, A., Svasta, P.

“…Many electro-hydraulic applications like automated manufacturing tools and systems, robotics or seismic test benches for civil engineering require precise…”
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Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures by Smolarek, A., Moscicki, A., Kinart, A., Felba, J., Falat, T.

“…Flexible electronics, which actual cover a significant part of electronic market, requires as low processing temperature as possible. Plastic foil type of…”
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Temperature control system based on adaptive PID algorithm implemented in FPAA by Visan, D. A., Lita, I., Cioc, I. B.

“…The system presented in this paper is intended to be used for adaptive control of temperature in electronic equipments. The novelty of the proposed system is…”
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TiAl-based ohmic contacts on p-type SiC by Mysliwiec, M., Sochacki, M., Kisiel, R., Guziewicz, M., Wzorek, M.

“…Titanium-aluminum alloys were successfully used to form low resistance ohmic contacts to p-type SiC. This work concerns two Al-Ti alloy compositions. Contacts…”
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The impact of the planes parameters on the noise of a power distribution network by Fizesan, R., Pitica, D.

“…The goal of a power distribution network is to have a flat impedance over the entire frequency range. This goal may or may not be achievable depending on the…”
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Multimodal biometric securing methods for informatic systems by Soviany, S., Jurian, M.

“…The paper presents a novel approach to provide a more secured remote access to informatic systems; this approach is based on biometric identification…”
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