Search Results - "Premachandran, CS"

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  1. 1
    Efficient Bidirectional protection structure for Plasma induced damage (PID) and Electrostatic discharge (ESD) for 3D IC Integration

    Efficient Bidirectional protection structure for Plasma induced damage (PID) and Electrostatic discharge (ESD) for 3D IC Integration by C.S., Premachandran, Cimino, Salvatore, Prabhu, Manjunatha

    “…During metal/dielectric plasma processing for the back end of the line (BEOL), degradation of the transistor gate oxide may occur due to the plasma discharge…”
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  2. 2
    A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer

    A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer by Premachandran, CS, Tran-Quinn, Thuy, Burrell, Lloyd, Justison, Patrick

    “…Stacking of chips vertically will reduce the interconnection resistance and as a result enhance data communication between chips. Memory chip to logic chip…”
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  3. 3
    A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging

    A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging by Premachandran, C.S., Nagarajan, R., Chen Yu, Zhang Xiolin, Chong Ser Choong

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  4. 4
    Design and electrical characterization of a novel wafer level package for RF MEMS applications

    Design and electrical characterization of a novel wafer level package for RF MEMS applications by Rotaru, N.D., Premachandran, C.S., Iyer, M.K.

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  5. 5
    Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices

    Effect of passivation on frit glass bonding method for wafer level hermetic sealing on MEMS devices by Ser Choong Chong, XiaoLin Zhang, Mohanraj, S., Premachandran, C.S., Ranganathan, N.

    “…A wafer level hermetic package has been developed for micro-electronics mechanical system (MEMS) applications by wafer to wafer bonding method. A cap wafer,…”
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  6. 6
    Finite element simulation of the fatigue behaviour of a MEMS package

    Finite element simulation of the fatigue behaviour of a MEMS package by Chng, A., Tay, A.A.O., Lim, K.M., Chai, T.C., Premachandran, C.S.

    “…Finite element analysis (FEA) was carried out to analyse the reliability of the solder sealing of a ceramic based vacuum package under the combined effect of…”
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  7. 7
    Pressure and depth dependence of sidewall roughness of polymer optical waveguides during reactive ion etching

    Pressure and depth dependence of sidewall roughness of polymer optical waveguides during reactive ion etching by Pani, S.K., Wong, C.C., Premachandran, C.S., Iyer, M.K., Ramana, P.V., Lim, V., Ranganathan, N.

    “…Sidewall roughness (SWR) of fluorinated polyether waveguides fabricated using reactive ion etching in pure oxygen gas was directly measured using atomic force…”
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  8. 8
    Design & development of a new thermally stable high vacuum IR bolometer package

    Design & development of a new thermally stable high vacuum IR bolometer package by Premachandran, C.S., Khan, N., Xiaowu Zhang, Chong Ser Choong, Chai, T.C.

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