Search Results - "Pollard, Scott"

Contexts Rather Than Close Readings of Latin American Literature – CORRIGENDUM by Pollard, Scott

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Essence of the Giant Reduction of Power Density in Osmotic Energy Conversion in Porous Membranes: Importance of Testing Area by Lin, Chih-Yuan, Chang, Shao-Fu, Kuo, Kuan-Ting, Garner, Sean, Pollard, Scott C., Chen, Shih-Hsun, Hsu, Jyh-Ping

“…Harvesting osmotic energy through nanofluidic devices with diverse materials has received considerable attention in recent years. Often, a small testing area…”
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Off-label use of transmucosal ketamine as a rapid-acting antidepressant: a retrospective chart review by Nguyen, Linda, Marshalek, Patrick J, Weaver, Cory B, Cramer, Kathy J, Pollard, Scott E, Matsumoto, Rae R

“…This study evaluated the effectiveness and safety of subanesthetic doses of ketamine using an off-label, transmucosal administration route in patients with…”
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Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates by Okoro, Chukwudi, Jayaraman, Shrisudersan, Pollard, Scott

“…This work aims to understand and eliminate the formation of thermo-mechanically induced radial cracks in copper (Cu) metallized through-glass via (TGV)…”
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All-Solution-Processed Metallization of High Aspect Ratio Through Glass Vias (HAR-TGVs) with a High Adhesion Promoting Layer (APL) by Chang, Yiu-Hsiang, Wang, Wei-Yen, Tseng, Pei-Lien, Kanungo, Mandakini, Pollard, Scott C., Mazumder, Prantik

“…Metallization of through glass vias (TGV) by wet processing has received a lot of attention in recent years. However, there are two critical challenges - (i)…”
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Evaluation of the helium hermeticity reliability of copper through-glass vias by Okoro, Chukwudi, Maurey, Pamela, Davis, Ronald, Pollard, Scott

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In-situ temperature-dependent characterization of copper through glass via (TGV) by Pan, Ke, Xu, Jiefeng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

“…Glass has been proposed as a promising material for interposer because of its outstanding material properties. The development of through-glass via (TGV)…”
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The interfacial reliability of through-glass vias for 2.5D integrated circuits by Ahmed, Omar, Jalilvand, Golareh, Pollard, Scott, Okoro, Chukwudi, Jiang, Tengfei

“…Purpose Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has…”
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Feasibility of Integrated Depression Care in an HIV Clinic by Adams, Julie, Pollard, R. Scott, Sikkema, Kathleen J

“…Adams et al detail how they developed an integrated approach to depression management in an HIV clinic using non-medically trained care managers (social…”
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Improved Method for Rapid Evaluation of Chiral Stationary Phase Libraries by Welch, Christopher J, Pollard, Scott D, Mathre, David J, Reider, Paul J

“…An improved method for rapid LC/MS screening of chiral stationary phases based on the use of isotopically labeled enantiomers is reported…”
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The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study by Ahmed, Omar, Okoro, Chukwudi, Pollard, Scott, Jiang, Tengfei

“…PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical…”
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High-Temperature Constitutive Behavior of Electroplated Copper TGV Through Numerical Simulation by Pan, Ke, Yang, Junbo, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

“…A reliable constitutive model for copper is important for simulating the thermomechanical behavior of copper through glass via (TGV) in the glass interposer…”
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Contexts Rather Than Close Readings of Latin American Literature by Pollard, Scott

“…This essay reviews the following works: Borges and the Literary Marketplace: How Editorial Practices Shaped Cosmopolitan Readings . By Nora C. Benedict. New…”
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Call for Papers: Disabilities in Children's Literature: A Special Issue of Children's Literature Association Quarterly by Pollard, Scott

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Off-label use of transmucosal ketamine as a rapidacting antidepressant: a retrospective chart review by Nguyen, Linda, Marshalek, Patrick J, Weaver, Cory B, Cramer, Kathy J, Pollard, Scott E, Matsumoto, Rae R

“…Objective: This study evaluated the effectiveness and safety of subanesthetic doses of ketamine using an off-label, transmucosal administration route in…”
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Resolving Thermo-Mechanically Induced Circumferential Crack Formation in Copper Through-Glass Vias by Okoro, Chukwudi, Allowatt, Tammie, Pollard, Scott

“…This works aims at eliminating the formation of thermo-mechanically induced circumferential cracks in metallized through-glass via (TGV) substrates, aided by…”
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68-4: Demonstration of the Novel Ultra-Slim Flexible Glass as Substrate with Metal Meshed Antenna by Tseng, Chia-Ying, Chen, Yi-Jiun, Wang, Kai-Jiun, Lin, Jen-Chieh, Garner, Sean, Pollard, Scott, Kuo, Kuan-Ting, Chang, Kao-Der, Lin, Hung-Yi, Wang, Yu-Ming, Lin, Hoang Yan

“…The ultra‐slim flexible glass is demonstrated as the substrate with metal meshed antenna for developing thinner, lighter and fulltransparent smart devices. The…”
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Monitoring of the Effect of Thermal Shock on Crack Growth in Copper Through-Glass Via Substrates by Okoro, Chukwudi, Jayaraman, Shrisudersan, Pollard, Scott

“…This work aims at understanding thermo-mechanically induced cracks in through-glass via (TGV) made in Corning® HPFS® Fused Silica glass substrate, as well as…”
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Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling by Pan, Ke, Xu, Jiefeng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

“…Glass interposers have attracted much interest from academia and industry because of the outstanding material properties of glass. However, the thermal…”
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Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV) by Yang, Junbo, Pan, Ke, Yin, Pengcheng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

“…This study investigated the impact of an adhesion layer on Through Glass Via (TGV) samples and studied the creep behavior of copper TGVs. TGV samples with and…”
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